JP7234820B2 - Electrical connection structure and method for manufacturing the electrical connection structure - Google Patents

Description

The present invention relates to an electrical connection structure and a method for manufacturing the electrical connection structure .

2. Description of the Related Art It is common practice to mount electronic components on a printed circuit board by inserting leads of the electronic component into through-holes of the printed circuit board (for example, Patent Document 1). Metal substrates, which are excellent in heat dissipation, are sometimes used instead of printed substrates. A metal substrate is obtained by forming a conductor layer on the surface of a metal base plate via an insulating layer.

JP-A-2008-53336

A through-hole in a printed board is formed by drilling through the printed board, while a through-hole in a metal board is formed by punching out a metal board by pressing it with a pair of press dies having an uneven structure. Here, when an attempt is made to form a through-hole having a diameter smaller than the thickness of the base plate in the metal substrate, the diameter of the projection of the press die becomes smaller than the thickness of the base plate, causing the projection to deform or break. , the base plate may not be punched out.

The present invention has been made to solve the above problems, and an object of the present invention is to provide an electrical connection structure and an electrical connection structure in which a through hole having a part of a circle with a diameter smaller than the plate thickness of a base plate is formed. It is to provide a manufacturing method.

An electrical connection structure for solving the above problems includes a metal substrate having an insulating layer on the surface of a metal base plate and having a first through hole and a second through hole formed by press working; An electrical connection structure comprising a connector having a first positioning pin inserted through a hole and a second positioning pin inserted through the second through hole, wherein an inner peripheral surface defining the first through hole and the second The inner peripheral surfaces defining the two through-holes are respectively a first curved surface forming a part of a first imaginary cylinder having a diameter equal to or larger than the thickness of the base plate and a second curved surface having a diameter smaller than the thickness of the base plate. a second curved surface forming a part of two virtual cylinders, and a first plane and a second plane composed of two common external tangents of the first virtual cylinder and the second virtual cylinder, respectively; The gist is that the first positioning pin contacts the second curved surface of the first through hole, and the second positioning pin contacts the second curved surface of the second through hole.

According to this, even if the press member used when pressing and punching the metal substrate does not have a cylindrical convex portion with a diameter smaller than the thickness of the base plate, A through hole having a portion of a circle can be formed in the base plate. In addition, since the through-hole has a first plane and a second plane formed by two common outer tangent lines of the first virtual cylinder and the second virtual cylinder, respectively, the outer peripheral surface of the convex portion of the press member has corners. not formed. Therefore, it is possible to suppress a change in the shape of the through-hole due to a change in the shape of the protrusion due to abrasion or the like.

A method for manufacturing an electrical connection structure for solving the above problems includes a metal substrate having an insulating layer on the surface of a metal base plate and having a first through hole and a second through hole formed therein; A method of manufacturing an electrical connection structure comprising a connector having a first positioning pin inserted through a hole and a second positioning pin inserted through the second through hole, the inner peripheral surface defining the first through hole and a first curved surface forming a part of a first imaginary column having a diameter greater than or equal to the thickness of the base plate and an inner peripheral surface defining the second through hole, and a diameter greater than the thickness of the base plate. a second curved surface that forms a part of a second virtual cylinder that is smaller than the second curved surface; The metal substrate is pressed and punched, and the first positioning pin is inserted into the first through hole so that the first positioning pin contacts the second curved surface of the first through hole. and the second positioning pin is inserted through the second through hole so that the second positioning pin contacts the second curved surface of the second through hole.

According to this, even if the press member used when pressing and punching the metal substrate does not have a cylindrical convex portion with a diameter smaller than the thickness of the base plate, A through hole having a portion of a circle can be formed in the base plate. In addition, the through hole is formed such that the inner peripheral surface defining the through hole has a first plane and a second plane composed of two common outer tangents of the first virtual cylinder and the second virtual cylinder. Therefore, corners are not formed on the outer peripheral surface of the convex portion of the pressing member. Therefore, it is possible to suppress a change in the shape of the through-hole due to a change in the shape of the protrusion due to abrasion or the like.

According to the present invention, it is possible to manufacture an electrical connection structure in which a through hole having a portion of a circle with a diameter smaller than the plate thickness of the base plate is formed.

FIG. 2 is an exploded perspective view schematically showing an electrical connection structure; Sectional drawing of a 2nd board|substrate and a 2nd connector member. The bottom view of the 2nd board|substrate with which the 2nd connector member was attached. The perspective view of a 2nd board|substrate. The enlarged plan view of a 2nd board|substrate. Sectional drawing which shows a pair of press type|mold. The perspective view of a 1st press member. The bottom view of a 1st press member. The perspective view of a 2nd press member. The top view of a 2nd press member. Sectional drawing which shows the manufacturing method of a 1st board|substrate.

An embodiment embodying a metal substrate and a method for manufacturing the metal substrate will be described below with reference to FIGS. 1 to 11. FIG.
As shown in FIG. 1, the electrical connection structure 10 includes a first substrate 11, a second substrate 12, and a pair of connectors 13 connecting the first substrate 11 and the second substrate 12 together. A pair of connectors 13 has a first connector member 14 mounted on the first substrate 11 and a second connector member 15 mounted on the second substrate 12 . The first connector member 14 and the second connector member 15 are fitted after the first connector member 14 is mounted on the first substrate 11 and the second connector member 15 is mounted on the second substrate 12. will be

The first substrate 11 is a printed circuit board. The first substrate 11 has a base plate and a conductor pattern formed on the surface of the base plate. The base plate is made of an insulating material. The conductor pattern is formed by printing a metal material on the surface of the base plate.

The first connector member 14 has a conductive member (not shown), a connector body 14a holding the conductive member, and a pair of positioning pins 14b projecting from the connector body 14a. The conductive member is electrically connected to the conductor pattern of the first substrate 11 . The positioning pin 14b is cylindrical. The diameter of each positioning pin 14 b is smaller than the thickness of the base plate of the first substrate 11 .

A pair of through holes 11 h for mounting the first connector member 14 on the first substrate 11 is formed in the first substrate 11 . Each through hole 11h is circular. Each through hole 11h is formed by a drill. The first connector member 14 is mounted on the first board 11 by inserting the positioning pins 14 b into the through holes 11 h of the first board 11 .

The diameter of each through hole 11h is set to be slightly larger than the diameter of each positioning pin 14b. The diameter of each through hole 11 h is smaller than the thickness of the base plate of the first substrate 11 . Also, the shortest distance between the centers of the pair of through holes 11h is set to be substantially the same as the shortest distance between the axes of the pair of positioning pins 14b. Therefore, the first connector member 14 is positioned on the first board 11 by inserting the positioning pins 14b into the through holes 11h of the first board 11 . In other words, the pair of through holes 11 h also serve as positioning holes for positioning the first connector member 14 on the first substrate 11 .

As shown in FIG. 2, the second substrate 12 is a metal substrate. The second substrate 12 has a metal base plate 12a, an insulating layer 12b formed on one side of the base plate 12a, and a conductor pattern as a conductor layer (not shown) formed on the surface of the insulating layer 12b. The base plate 12a of this embodiment is made of aluminum. In FIG. 2, the ratio of the thickness Hb of the insulating layer 12b to the thickness Ha of the base plate 12a is shown to be larger than the actual ratio.

The second connector member 15 has a conductive member (not shown), a connector body 15a holding the conductive member, and a pair of positioning pins 15b projecting from the connector body 15a. The conductive member is electrically connected to the conductor pattern of the second substrate 12 . The conductive member is electrically connected to the conductive member of the first connector member 14 by fitting the connector main body 15a with the connector main body 14a of the first connector member 14 . Each positioning pin 15b is cylindrical. Assume that the diameter of each positioning pin 15b is R15. A diameter R15 of each positioning pin 15b is smaller than the plate thickness Ha of the base plate 12a of the second substrate 12 .

As shown in FIGS. 2 and 3, the second board 12 is formed with a pair of through holes 16 for mounting the second connector member 15 on the second board 12 . As in the formation of the through-hole 11h in the first substrate 11, if an attempt is made to form the through-hole 16 in the second substrate 12 with a drill, since the base plate 12a is made of metal, the teeth of the drill will not penetrate the base plate 12a. Sometimes you lose. Therefore, each through-hole 16 is formed by pressing and punching the second substrate 12 . The second connector member 15 is mounted on the second board 12 by inserting the positioning pins 15 b into the through holes 16 of the second board 12 .

As shown in FIG. 4, the inner peripheral surface defining each through-hole 16 has a first curved surface 16a, a second curved surface 16b, a first plane 16c, and a second plane 16d.
As shown in FIG. 5, when the second substrate 12 is viewed from the plate thickness direction, the second curved surface 16b faces the first curved surface 16a. The first curved surface 16a is a curved surface that is recessed in a direction away from the second curved surface 16b. The first curved surface 16a forms part of the first imaginary cylinder C1. The diameter R1 of the first virtual cylinder C1 is larger than the plate thickness Ha of the base plate 12a. The second curved surface 16b is a curved surface recessed in a direction away from the first curved surface 16a. The second curved surface 16b forms part of the second virtual cylinder C2. The diameter R2 of the second virtual cylinder C2 is smaller than the diameter R1 of the first virtual cylinder C1. The diameter R2 of the second virtual cylinder C2 is slightly larger than the diameter R15 of the positioning pin 15b. The diameter R2 of the second virtual cylinder C2 is smaller than the plate thickness Ha of the base plate 12a. In this embodiment, the first virtual cylinder C1 and the second virtual cylinder C2 do not overlap.

The first plane 16c connects one end of the first curved surface 16a and one end of the second curved surface 16b. The second plane 16d connects the other end of the first curved surface 16a and the other end of the second curved surface 16b. The first plane 16c and the second plane 16d are planes formed from two common outer tangent lines L1 and L2 of the first virtual cylinder C1 and the second virtual cylinder C2, respectively.

As shown in FIG. 3, the direction in which the pair of through holes 16 are arranged matches the direction in which the first curved surface 16a and the second curved surface 16b face each other. In the pair of through holes 16, the virtual line L16b, which is the shortest of the virtual lines connecting the second curved surfaces 16b, is the virtual line L16a that connects the first curved surfaces 16a and partially overlaps the entire virtual line L16b. is arranged so that it is shorter than the length of That is, in the direction in which the pair of through-holes 16 are arranged, the first curved surface 16a is located outside, and the second curved surface 16b is located inside.

The pair of positioning pins 15b are provided on the connector body 15a so that the shortest imaginary line L15 of the imaginary lines connecting the outer peripheral surfaces of the pair of positioning pins 15b is slightly longer than the imaginary line L16b. It is Therefore, when the pair of positioning pins 15b are inserted into the pair of through holes 16, two points on the outer peripheral surface of the positioning pins 15b come into contact with the second curved surface 16b. Thereby, the second connector member 15 is positioned with respect to the second substrate 12 . Therefore, the pair of through holes 16 also serve as positioning holes for positioning the second connector member 15 on the second substrate 12 .

Next, a pair of press dies 30 used for manufacturing the second substrate 12 will be described.
As shown in FIG. 6, the pair of press dies 30 includes a first press member 31 and a second press member 32. As shown in FIG. The first pressing member 31 and the second pressing member 32 are configured to be able to form a pair of through holes 16 in the second substrate 12 .

As shown in FIG. 7, the first pressing member 31 has a pair of protrusions 33 protruding from the first pressing surface 31a. Each projection 33 has a tip surface 331 and an outer peripheral surface 332 connecting the tip surface 331 and the first pressing surface 31a.

The outer peripheral surface 332 of each protrusion 33 is set to have the same shape as the inner peripheral surface that defines the through hole 16 to be formed in the second substrate 12 . The outer peripheral surface 332 of each convex portion 33 includes a first convex curved surface 33a having the same shape as the first curved surface 16a, a second convex curved surface 33b having the same shape as the second curved surface 16b, and a first flat surface 16c. and a second convex side plane 33d having the same shape as the second plane 16d.

As shown in FIG. 8, the pair of convex portions 33 are arranged such that the second convex-side curved surfaces 33b face each other. In the pair of protrusions 33, the length of the shortest imaginary line L33b among the imaginary lines connecting the second convex curved surfaces 33b is equal to the length of the imaginary line L33b, which is the shortest between the first convex curved surfaces 33a. It is arranged so as to be shorter than the length of the overlapping imaginary line L33a. That is, in the direction in which the pair of protrusions 33 are arranged, the first convex curved surface 33a is located outside, and the second convex curved surface 33b is located inside.

As shown in FIG. 9, the second pressing member 32 has a pair of recesses 34 recessed from the second pressing surface 32a. Each recess 34 is defined by a bottom surface 341 and an inner side surface 342 connecting the bottom surface 341 and the second pressing surface 32a.

As shown in FIG. 10, the inner surface 342 forms part of a third imaginary cylinder C3 whose diameter R3 is equal to or greater than the plate thickness Ha of the base plate 12a and which is slightly larger than the diameter R1 of the first imaginary cylinder C1. A first concave side curved surface 34a and a second concave forming part of a fourth virtual cylinder C4 having a diameter R4 smaller than the plate thickness Ha of the base plate 12a and slightly larger than the diameter R2 of the second virtual cylinder C2. It has a side curved surface 34b, and a first concave side plane 34c and a second concave side plane 34d formed from two common outer tangent lines L3 and L4 of the third virtual cylinder C3 and the fourth virtual cylinder C4, respectively.

Each concave portion 34 is configured so that each convex portion 33 of the first pressing member 31 can be fitted. The first concave curved surface 34a faces, the second convex curved surface 33b faces the second concave curved surface 34b, the first convex flat surface 33c faces the first concave flat surface 34c, The second convex side plane 33d and the second concave side plane 34d face each other.

Next, a method for manufacturing the second substrate 12 will be described.
First, as shown in FIG. 6, the second substrate 12 is arranged between the first pressing member 31 and the second pressing member 32 . One surface of the second substrate 12 faces the first pressing surface 31 a of the first pressing member 31 , and the other surface of the second substrate 12 faces the second pressing surface 32 a of the second pressing member 32 .

Next, as shown in FIG. 11, by bringing the first press surface 31a of the first press member 31 and the second press surface 32a of the second press member 32 close to each other, the first press member 31 and the second press member 32 are separated from each other. and the second substrate 12 is pressed. At this time, the projections 33 of the first press member 31 are fitted into the recesses 34 of the second press member 32, so that the portions of the projections 33 of the second substrate 12 overlapping the tip end surfaces 331 are punched out. Thereby, a pair of through holes 16 are formed in the second substrate 12 .

The operation of this embodiment will be described.
The through-holes are formed in the second substrate 12 by pressing the second substrate 12 with a pair of press dies 30 and punching them out. Here, if it is attempted to form a through hole having a diameter smaller than the plate thickness Ha of the base plate 12a, the diameter of the protrusion 33 of the first pressing member 31 is smaller than the plate thickness Ha of the base plate 12a. may be deformed or broken and may not punch through the base plate 12a.

On the other hand, in the present embodiment, the inner peripheral surface that defines the through hole 16 is a first curved surface 16a that forms a part of the first imaginary cylinder C1 whose diameter R1 is equal to or greater than the plate thickness Ha of the base plate 12a, A second curved surface 16b forming a part of a second virtual cylinder C2 whose diameter R2 is smaller than the plate thickness Ha of the base plate 12a, and two common external tangents L1 to the first virtual cylinder C1 and the second virtual cylinder C2, The second substrate 12 is pressed and punched so as to have a first plane 16c and a second plane 16d each formed of L2. Therefore, even if the first pressing member 31 does not have a cylindrical convex portion with a diameter smaller than the plate thickness Ha of the base plate 12a, it has a part of a circle with a diameter smaller than the plate thickness Ha of the base plate 12a. A through hole 16 can be formed in the base plate 12a. In addition, since the convex portion 33 has a first convex side plane 33c and a second convex side plane 33d composed of two common outer tangent lines L1 and L2 of the first virtual cylinder C1 and the second virtual cylinder C2, respectively, The outer peripheral surface 332 of the projection 33 does not have a corner. Therefore, it is possible to prevent the shape of the through hole 16 from being changed due to the shape of the protrusion 33 being changed due to abrasion or the like.

Effects of the present embodiment will be described.
(1) The through holes 16 are formed in the second substrate 12 by pressing and punching the second substrate 12 with the pair of press dies 30 . The second substrate 12 has a first curved surface 16a whose inner peripheral surface defining the through hole 16 forms a part of a first imaginary cylinder C1 whose diameter R1 is equal to or greater than the plate thickness Ha of the base plate 12a, and whose diameter R2 is From the second curved surface 16b forming a part of the second virtual cylinder C2 smaller than the plate thickness Ha of the base plate 12a and the two common external tangent lines L1 and L2 of the first virtual cylinder C1 and the second virtual cylinder C2, respectively It is stamped to have a first flat surface 16c and a second flat surface 16d configured. Therefore, even if the first pressing member 31 does not have a cylindrical convex portion with a diameter smaller than the plate thickness Ha of the base plate 12a, it has a part of a circle with a diameter smaller than the plate thickness Ha of the base plate 12a. A through hole 16 can be formed in the base plate 12a. In addition, since the convex portion 33 has a first convex side plane 33c and a second convex side plane 33d composed of two common outer tangent lines L1 and L2 of the first virtual cylinder C1 and the second virtual cylinder C2, respectively, The outer peripheral surface 332 of the projection 33 does not have a corner. Therefore, it is possible to prevent the shape of the through-hole 16 from being changed due to the shape of the protrusion 33 being changed due to abrasion or the like.

(2) The first connector member 14 is positioned with respect to the first substrate 11 by inserting the pair of positioning pins 14b into the pair of through holes 11h of the first substrate 11 . The second connector member 15 is positioned with respect to the second substrate 12 by inserting the pair of positioning pins 15 b into the pair of through holes 16 of the second substrate 12 . Therefore, when electrically connecting the first substrate 11 and the second substrate 12, the connector main body 14a and the connector main body 15a can be easily fitted.

This embodiment can be implemented with the following modifications. This embodiment and modifications can be implemented in combination with each other within a technically consistent range.
O The diameter R1 of the first virtual cylinder C1 may be the same as the plate thickness Ha of the base plate 12a of the second substrate 12 .

O The first imaginary cylinder C1 and the second imaginary cylinder C2 may be in contact with each other.
O The first virtual cylinder C1 and the second virtual cylinder C2 may partially overlap.
O The number of through-holes 16 formed in the second substrate 12 is not limited to two, and may be one or three or more.

(circle) arrangement|positioning of a pair of through-hole 16 in the 2nd board|substrate 12 may be changed suitably. For example, the pair of through-holes 16 may be arranged such that the first curved surface 16a is located inside and the second curved surface 16b is located outside in the direction in which the pair of through-holes 16 are arranged. In this case, the pair of positioning pins 15b has a length of the longest virtual line among the virtual lines connecting the outer peripheral surfaces of the pair of positioning pins 15b. is provided on the connector main body 15a so as to be slightly shorter than the length of .

(circle) arrangement|positioning of a pair of through-hole 16 in the 2nd board|substrate 12 may be changed suitably. For example, the pair of through holes 16 may be arranged such that the first curved surface 16a of one through hole 16 and the first curved surface 16a of the other through hole 16 do not face each other.

(circle) the through-hole 16 may be used for purposes other than the positioning of the second connector member 15 with respect to the second substrate 12 .
(circle) the structure of the electrical connection structure 10 may be suitably changed if the 2nd board|substrate 12 in which the through-hole 16 was formed is used. However, the inner peripheral surface that defines the through hole 16 includes a first curved surface 16a that forms a part of a first imaginary column C1 having a diameter R1 that is equal to or greater than the plate thickness Ha of the base plate 12a, and and a second curved surface 16b forming a part of a second virtual cylinder C2 smaller than the plate thickness Ha, and two common external tangent lines L1 and L2 of the first virtual cylinder C1 and the second virtual cylinder C2, respectively. It has a first plane 16c and a second plane 16d.

(circle) about the 2nd board|substrate 12, the insulating layer 12b may be formed in both surfaces of the base plate 12a.
O The base plate 12a is not limited to aluminum as long as it is made of metal. The base plate 12a may be made of copper, for example.

(circle) each recessed part 34 of the 2nd press member 32 may be changed into the through-hole which penetrates the 2nd press member 32. FIG. In this case, the inner peripheral surface defining the through-hole has the same shape as the inner surface 342 of the recess 34 .

REFERENCE SIGNS LIST 12: Second substrate as a metal substrate 12a: Base plate 12b: Insulating layer 16: Through hole 16a: First curved surface 16b: Second curved surface 16c: First plane 16d: Second plane , C1 .

Claims (2)

a metal substrate having an insulating layer on the surface of a metal base plate and having first through holes and second through holes formed by press working ;
a connector having a first positioning pin inserted through the first through hole and a second positioning pin inserted through the second through hole;
An electrical connection structure comprising :
The inner peripheral surface that defines the first through hole and the inner peripheral surface that defines the second through hole, respectively ,
a first curved surface forming part of a first virtual cylinder having a diameter equal to or greater than the plate thickness of the base plate;
a second curved surface that forms part of a second virtual cylinder whose diameter is smaller than the thickness of the base plate;
a first plane and a second plane composed of two common outer tangents of the first virtual cylinder and the second virtual cylinder, respectively;
has
the first positioning pin contacts the second curved surface in the first through hole;
The electrical connection structure , wherein the second positioning pin contacts the second curved surface of the second through hole . a metal substrate having an insulating layer on the surface of a metal base plate and having first through holes and second through holes ;
a connector having a first positioning pin inserted through the first through hole and a second positioning pin inserted through the second through hole;
A method for manufacturing an electrical connection structure comprising :
An inner peripheral surface defining the first through hole and an inner peripheral surface defining the second through hole each form a first curved surface forming a part of a first imaginary cylinder having a diameter equal to or greater than the plate thickness of the base plate. a second curved surface forming a part of a second virtual cylinder whose diameter is smaller than the thickness of the base plate; and two common external tangents to the first virtual cylinder and the second virtual cylinder. Pressing and punching the metal substrate so as to have a first plane and a second plane,
inserting the first positioning pin through the first through hole such that the first positioning pin contacts the second curved surface of the first through hole;
A method of manufacturing an electrical connection structure , wherein the second positioning pin is inserted into the second through-hole so that the second positioning pin contacts the second curved surface of the second through-hole.

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