JP2013026174A - Socket for electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a socket for an electronic component that is equipped with a capacitor inside a housing to which an electronic component, such as an IC chip and the like, is attached.SOLUTION: A housing 2 holds a support plate 10 that functions as a capacitor obtained by sandwiching a dielectric layer 13 between a first electrode plate 11 and a second electrode plate 12. Support holes 14 and 15 are formed in the support plate 10 so as to penetrate through the support plate 10, and holding members 25 holding terminals 20 are inserted and held in the support holes 14 and 15. A first conduction projection 14a protruding toward the interior of the support hole 14 is provided in the first electrode plate 11. This first conduction projection 14a is in contact with a terminal 20 that is set to a ground potential. A second conduction projection 15a protruding toward the interior of the support hole 15 is provided in the second electrode plate 12. This second conduction projection 15a is contacted to a terminal 20 that is set to a power supply potential and the like.

Description

  The present invention relates to an electronic component socket including a plurality of terminals that come into contact with electrode portions of an electronic component such as an IC chip, and more particularly to an electronic component socket including a capacitor that is electrically connected to the terminals.

  Patent Documents 1 and 2 disclose sockets that support electronic components such as IC chips.

  In the sockets described in the cited document 1 and the patent document 2, a plurality of contacts are arranged on the surface of a semiconductor substrate, and an electrode portion of an IC installed on the semiconductor substrate is connected to the contacts.

  Further, a cover is stacked on the IC mounted on the semiconductor substrate, and this cover functions as a decoupling capacitor with a dielectric layer sandwiched between two metal plates. Furthermore, these patent documents disclose a structure in which a heat sink is placed on the cover which is a decoupling capacitor.

Japanese Patent No. 4050700 Japanese Patent No. 4133819

  Since the sockets described in Patent Document 1 and Patent Document 2 have a decoupling capacitor installed on the IC, the entire size is increased by installing the decoupling capacitor. In addition, since the decoupling capacitor is installed on the IC, it is difficult to select one of a plurality of electrode portions provided on the IC and connect it to the capacitor, and the internal circuit of the IC is changed. Sometimes it is necessary to change the terminal structure of the decoupling capacitor.

  SUMMARY OF THE INVENTION An object of the present invention is to solve the above-described conventional problems, and to provide a socket for electronic parts that does not increase in size even when a capacitor is incorporated.

  It is another object of the present invention to provide an electronic component socket having a structure that can easily cope with a change in circuit design such as where a terminal connected to a capacitor is arranged.

The present invention provides a socket for an electronic component provided with a housing in which an electronic component is installed, and a plurality of terminals provided in the housing and in contact with a plurality of component electrode portions provided on a bottom surface of the electronic component.
A support plate having a plurality of support holes is fixed to the insulating housing, and an insulating holding member holding the terminals is inserted and held in the support holes,
The support plate includes a first electrode plate, a second electrode plate, and a dielectric layer sandwiched therebetween, and any one of a plurality of terminals is electrically connected to the first electrode plate, The terminal is electrically connected to the second electrode plate.

  In the electronic component socket according to the present invention, since the support plate supporting the terminals functions as a capacitor, a space for installing the capacitor outside is not required, and can be configured to be thin and small.

  In the present invention, the first electrode plate is provided with a first conduction protrusion protruding into the support hole, and the second electrode plate is provided with a second conduction protrusion protruding into the support hole. The first conductive protrusion and the second conductive protrusion are in contact with different terminals.

  In the electronic component socket according to the present invention, it is possible to select a terminal to which the first electrode plate and the second electrode plate are to be conducted by changing a place where the conductive protrusion is provided. Therefore, when the internal circuit of the electronic component is changed, it is possible to cope with the change by simply changing the structure of the support plate.

  Further, according to the present invention, the holding member is formed with a concave portion continuous from the front end portion facing in the insertion direction to the support hole toward the rear, the terminal is exposed in the concave portion, and the holding member is It is preferable that when inserted into the support hole, the first conductive protrusion or the second conductive protrusion enters the concave portion and comes into contact with the terminal.

  In the above structure, the first conductive protrusion or the second conductive protrusion can be electrically connected to the terminal simply by inserting the holding member into the support hole.

  Moreover, it is preferable that the depth dimension from the front-end | tip part of all the said recessed parts to back is the same in this invention.

  In the above configuration, the holding member that holds the terminal brought into contact with the first conductive protrusion or the second conductive protrusion and the holding member that holds the terminal that does not come into contact with the conductive protrusion can all have the same structure.

  The present invention can be configured such that a grounding terminal among a plurality of terminals is electrically connected to the first electrode plate, and the first electrode plate functions as a shield plate. Further, for example, a power terminal or a signal terminal among the plurality of terminals is electrically connected to the second electrode plate.

  In addition, a side part of the first electrode plate may be bent so that the terminal is covered from the side.

  According to the present invention, since the capacitor that conducts with the terminal can be disposed as a structure that supports the terminal inside the housing, it is possible to avoid the housing from becoming extremely large by disposing the capacitor.

  Further, according to the present invention, it is possible to easily change which terminal is connected to the capacitor simply by changing the structure of the support plate.

The perspective view of the socket for electronic components of the 1st Embodiment of this invention, The electronic component socket and relay member of the 1st Embodiment of this invention are shown, The sectional view of the II-II line of FIG. Sectional drawing which shows the state by which the relay member was mounted | worn with the socket for electronic components of the 1st Embodiment of this invention, An exploded perspective view showing a support plate and a relay member constituting the capacitor; A plan view of the first electrode plate; An exploded perspective view showing a holding member holding a plurality of terminals and a support plate; FIG. 2 is an enlarged view of a part of FIG. 2 showing details of a holding member and terminals held by a support plate; Sectional drawing which shows the socket for electronic components of the 2nd Embodiment of this invention,

  As shown in FIGS. 1 to 3, an electronic component socket 1 according to an embodiment of the present invention has an insulating housing 2, and a support plate 10 that functions as a capacitor is held in the housing 2. As shown in an exploded view in FIG. 4, the support plate 10 includes a first electrode plate 11, a second electrode plate 12, and a dielectric layer 13 sandwiched between the electrode plates 11 and 12. ing. The housing 2 is formed by a so-called insert molding method, and a support plate 10 in which a first electrode plate 11, a second electrode plate 12, and a dielectric layer 13 are laminated is placed inside a mold cavity. In this state, molten resin is injected into the cavity, and the housing 2 holding the support plate 10 is molded.

  As shown in FIGS. 1 to 3, a support side wall 2 a is formed on the upper portion of the housing 2, and an upper recess 5 having four sides surrounded by the support side wall 2 a is formed. A step bottom 2b is formed on each inner side surface of the four support side walls 2a, and the upper recess 5 is a part support 5a at a portion above the step bottom 2b, and is located below the step bottom 2b. The portion is a terminal deformation space 5b.

  As shown in FIGS. 2 and 3, the housing 2 is formed with a ceiling wall portion 2c that extends further outward in four directions from the lower portion of the support side wall portion 2a, and extends downward from the periphery of the ceiling wall portion 2c. The side wall 2d is integrally formed, and a lower recess 6 is formed in which four surfaces are surrounded by the mounting side wall 2d. In the lower concave portion 6, a portion below the lower surface 2e of the ceiling wall portion 2c is a relay member mounting portion 6a, and a portion above the lower surface 2e is a terminal connection space 6b. The housing 2 has a structure in which the relay member mounting portion 6a projects outward from the component support portion 5a.

  The housing 2 has a structure in which an upper concave portion 5 and a lower concave portion 6 are continuously formed integrally and the upper concave portion 5 and the lower concave portion 6 are partitioned by a support plate 10.

  The first electrode plate 11 and the second electrode plate 12 constituting the support plate 10 are made of a conductive metal plate, such as a steel plate, a steel plate whose surface is plated with a low-resistance metal film, Alternatively, it is formed of a copper plate or the like.

  As shown in FIGS. 4 and 5, the first electrode plate 11 has a rectangular shape in plan view. A rectangular central opening 11a having a small area is formed at the center of the first electrode plate 11, and a rectangular region surrounding the central opening 11a is a terminal holding region 11b.

  As shown in FIGS. 4 and 5, the first electrode plate 11 is provided with a ceiling surface 11 c that is flush with the terminal holding region 11 b and extends in four directions toward the side. The support hole 14 is not formed in the ceiling surface 11c. Four bent side surfaces 11d that are bent substantially perpendicularly from the ceiling surface 11c are formed at positions away from the terminal holding region 11b in the four directions.

  As shown in FIG. 4, the second electrode plate 12 is a flat plate and is formed of the same conductive metal plate as the first electrode plate 11. The second electrode plate 12 has a rectangular shape, and has the same shape and size as those obtained by removing the bent side surface 11d from the first electrode plate 11. The second electrode plate 12 has a rectangular central opening 12a formed at the center. A rectangular region around the central opening 12a is a terminal holding region 12b, and a ceiling surface 12c is integrally formed on the outer periphery thereof. The shape and size of the central opening 12a and the terminal holding region 12b are the same as the central opening 11a and the terminal holding region 11b of the first electrode plate 11.

  As shown in FIGS. 5, 6, and 7, a plurality of first support holes 14 are formed in the terminal holding region 11 b of the first electrode plate 11. The first support holes 14 are regularly arranged in the entire region of the terminal holding region 11b. Each of the first support holes 14 has a rectangular shape. A plurality of second support holes 15 are formed through the terminal holding region 12 b of the second electrode plate 12. The second support hole 15 is a rectangular hole having the same shape and the same size as the first support hole 14, and when the first electrode plate 11 and the second electrode plate 12 are overlapped, The support hole 14 and the second support hole 15 are aligned vertically.

  The dielectric layer 13 shown in FIG. 4 is formed of a synthetic resin film, and has the same shape and the same size as the second electrode plate 12. A central opening 13 a is opened at the center of the dielectric layer 13. The shape and size of the central opening 13a are the same as the central openings 11a and 12a of the respective electrode plates 11 and 12. As shown in FIGS. 6 and 7, the inner region 13b around the central opening 13a of the dielectric layer 13 has a rectangular shape having the same size as the support holes 14 and 15 opened in the electrode plates 11 and 12, respectively. 13d is formed. The opening area of the central opening 13a may be larger than the central openings 11a and 12a of the electrode plates 11 and 12, and similarly, the opening area of the escape hole 13d is larger than the support holes 14 and 15. May be.

  Further, the dielectric layer 13 is not provided in the portion facing the terminal holding region 11b of the first electrode plate 11 and the terminal holding region 12b of the second electrode plate 12, and the ceiling surface 11c of each electrode plate 11, 12 is provided. , 12c may be provided only in the outer region 13c.

  Alternatively, the dielectric layer 13 may be formed of a synthetic resin film, and an adhesive layer that joins the first electrode plate 11 and the second metal plate 12 may be used as the dielectric layer 13.

  As shown in FIGS. 1 to 3, the structure of the electronic component socket 1 is such that the outer peripheral region of the support plate 10 including the first electrode plate 11, the second electrode plate 12 and the dielectric layer 13 is held in the housing 2. The central opening 11a and the terminal holding region 11b of the first electrode plate 11, and the central opening 12a and the terminal holding region 12b of the second electrode plate 12 are connected to the upper recess 5 and the lower side of the housing 2. It is located at the boundary with the recess 6.

  The ceiling surface 11c of the first electrode plate 11 and the ceiling surface 12c of the second electrode plate 12 are located on the ceiling wall portion 2c of the housing 2, and the ceiling surface 11c of the first electrode plate 11 is the ceiling wall. It appears on the outermost surface of the portion 2c. Further, the bent side surface 11d of the first electrode plate 11 appears on the surface of the mounting side wall 2d. In other words, the relay member mounting portion 6 a having a shape projecting to the periphery of the component support portion 5 a is covered with a part of the first electrode plate 11 at the ceiling and the four sides.

  The housing 2 is provided with a plurality of terminals 20. The terminals 20 are regularly arranged in the entire region of the terminal holding region 11b of the first electrode plate 11 and the terminal holding region 12b of the second electrode plate 12, but in FIG. 2 and FIG. For convenience, only some of the terminals 20 are shown.

  As shown in FIGS. 6 and 7, the plurality of terminals 20 are held by a holding member 25 (terminal holder) made of a synthetic resin material.

  The holding member 25 is integrally formed with a fitting part 26 located on the base side and a stopper part 28 located above the fitting part 26. The fitting portion 26 has a rectangular planar shape, and is press-fitted into the first support hole 14 formed in the first electrode plate 11 and the second support hole 15 formed in the second electrode plate 12. It is possible.

  A plurality of terminals 20 are held by the holding member 25. The plurality of terminals 20 are arranged at a constant pitch in the longitudinal direction of the holding member 25. In the example shown in FIG. 6, three terminals 20 are held by each holding member 25. The terminal 20 and the holding member 25 are integrated by an insert molding method. Alternatively, the terminal 20 is press-fitted into the holding member 25 and fixed.

  The holding member 25 is inserted and fitted downward into the support holes 14 and 15 with the front end portion 26a of the fitting portion 26 facing downward. As shown in FIG. 7, when the fitting portion 26 is inserted into the support holes 14 and 15, the stopper portion 28 is abutted against the surface of the first electrode plate 11, and the holding height of each holding member 25. Is determined to be uniform. When the plurality of holding members 25 are inserted and held in the support holes 14 and 15 of the two electrode plates 11 and 12, the terminal holding region 11b of the first electrode plate 11 and the second electrode plate The terminals 20 are arranged at a constant pitch over the entire 12 terminal holding regions 12b.

  Each terminal 20 is formed of a leaf spring material such as a phosphor bronze plate, a nickel plating layer is formed on the surface, and a gold plating layer is further formed on the surface.

  As shown in an enlarged view in FIG. 7, the intermediate piece 21 of the terminal 20 is embedded and held in the holding member 25. The terminal 20 is provided with an elastic piece 22 extending continuously upward from the intermediate piece 21, and the elastic piece 22 projects upward from the surface 28 a of the stopper portion 28 of the holding member 25. When no external force is applied to the elastic piece 22, the contact portion 22 a at the tip of the elastic piece 22 extends to the inside of the component support portion 5 a of the housing 2, as indicated by a broken line in FIG. 7.

  The terminal 20 is integrally provided with a base end piece 23 projecting downward from the tip end portion 26a of the fitting portion 26, and the lower end portion of the base end piece 23 is bent at a right angle to form a conductive piece 23a. Yes. The conductive piece 23 a is located inside the terminal connection space 6 b of the housing 2.

  As shown in FIG. 6, a concave portion 27 is formed on the side surface 26 b of the fitting portion 26 of the holding member 25, and the intermediate piece 21 of the terminal 20 is exposed inside the concave portion 27. The holding member 25 is formed with the same number of recesses 27 as the terminals 20 so that all of the held terminals 20 can be individually exposed. All the recessed portions 27 have the same opening depth dimension D from the front end portion 26a of the fitting portion 26 toward the rear (upward in the drawing).

  As shown in FIG. 6, a first conductive protrusion 14 a that protrudes toward the inside of a part of the support holes 14 is integrally formed on the first electrode plate 11. The second electrode plate 12 is also integrally formed with a second conductive protrusion 15 a that protrudes toward the inside of some of the support holes 15.

  All the holding members 25 are inserted with the distal end portions 26a facing the support holes 14 and 15. At this time, the first conductive protrusions 14a and the second conductive protrusions 15a are formed on the holding member 25. It enters the inside of the recess 27 and contacts the intermediate piece 21 of the terminal 20 to conduct.

  As shown in FIG. 7, the first conductive protrusion 14 a is positioned above the second conductive protrusion 15 a, but the stopper portion 28 of the holding member 25 abuts against the surface of the first electrode plate 11. The opening depth dimension D is determined so that the first conductive protrusion 14a can enter the concave portion 27 when the holding member 25 is inserted into the support holes 14 and 15. One conductive protrusion 14 a and all the second conductive protrusions 15 a can be brought into contact with the surface of the intermediate piece 21 of the terminal 20 to be conductive.

  The first electrode plate 11 can be set to the ground potential by bringing the first conductive protrusion 14 a into contact with the terminal 20 used as the ground terminal among the plurality of terminals 20. The second electrode plate 12 can be set to the power supply potential by bringing the second conductive protrusion 15a into contact with the terminal 20 used as the power supply terminal. In this case, the support plate 10 can function as a decoupling capacitor to suppress fluctuations in the power supply voltage supplied to the electronic component 30 such as an IC mounted on the electronic component socket 1.

  Alternatively, the second conductive protrusion 15a is brought into contact with the signal transmission terminal 20 for supplying a signal to the electronic component 30 such as an IC, thereby causing the capacitor formed of the support plate 10 to function as a noise removing capacitor. Is also possible.

  Even if the same holding member 25 is used only by changing the formation position of the first conduction protrusion 14a on the first electrode plate 11 and the formation position of the second conduction protrusion 15a on the second electrode plate 12, Of the plurality of terminals 20, a terminal 20 that is electrically connected to the first electrode plate 11 and a terminal 20 that is electrically connected to the second electrode plate 12 can be selected. Accordingly, the position of the first conductive protrusion 14a and the second conductive protrusion 15a are determined in accordance with the structure of the internal circuit of the electronic component 30 to be mounted on the socket 1, so that any internal circuit can be handled. be able to. That is, the electronic component socket 1 corresponding to the type of the electronic component 30 to be mounted can be configured even if the same holding member 25 is used simply by changing the structure of the support plate 10.

  In addition, as a process of assembling the support plate 10 to the housing 2, the support holes 14 and 15 of the support plate 10 in which the first electrode plate 11, the second electrode plate 12, and the dielectric layer 13 are previously laminated are provided. After the fitting portion 26 of the holding member 25 is press-fitted, the support plate 10 holding the holding member 25 is held in the cavity of the mold, and the molten resin is injected to form the housing 2. Alternatively, the fitting portion 26 of the holding member 25 may be inserted and held in the support holes 14 and 15 in the step after the housing 2 holding the support plate 10 is molded by the insert molding method.

  As shown in FIGS. 2 and 3, the relay member 40 is held by the relay member mounting portion 6 a of the electronic component socket 1.

  In the relay member 40, a plurality of upper connection electrode portions 41 are arranged on the upper surface 40a, and a plurality of lower connection electrode portions 42 are arranged on the lower surface 40b. The upper connection electrode portion 41 has a spherical solder layer on the surface. The lower connection electrode part 42 also has a spherical solder layer on the surface.

  As shown in FIG. 4, a rectangular electrode array region 40c is formed on the upper surface 40a of the relay member 40, and a plurality of upper connection electrode portions 41 are regularly arrayed in the electrode array region 40c. The shape and area of the electrode array region 40 c are equivalent to the shape and area of the terminal holding region 11 b of the first electrode plate 11 and the terminal holding region 12 b of the second electrode plate 12. In addition, the arrangement state of the upper connection electrode portions 41 matches the arrangement state of the terminals 20, and the arrangement pitch P <b> 1 of the upper connection electrode portions 41 matches the arrangement pitch P <b> 1 of the terminals 20.

  The relay member 40 is a so-called multilayer substrate, and is composed of a plurality of insulating layers stacked in the thickness direction. As shown in FIG. 2, an internal wiring layer 43 is patterned on the surface of each layer inside the relay member 40, and the upper connection electrode portion 41 and the lower connection electrode portion 42 are paired via the internal wiring layer 43. Conducted in one relationship. The arrangement pitch P2 of the lower connection electrode portions 42 is formed wider than the arrangement pitch P1 of the upper connection electrode portions 41.

  As shown in FIG. 3, the relay member 40 is inserted into the relay member mounting portion 6 a of the housing 2. The relay member 40 is inserted into the mounting side wall portion 2d and abutted against the lower surface 2e of the ceiling wall portion 2c, whereby the relay member 40 is positioned with respect to the housing 2, and the conductive piece 23a and the relay member of each terminal 20 are positioned. 40 upper connection electrode portions 41 are brought into contact with each other. When supplied to the heating furnace in this state, the solder layer on the surface of the upper connection electrode portion 41 is melted, and the upper connection electrode portion 41 and the conductive piece 23 a of the terminal 20 are individually soldered and relayed to the housing 2. The member 40 is held.

Next, a method for mounting the electronic component socket 1 will be described.
The main board (motherboard) on which the electronic component socket 1 is mounted has a main electrode portion on the surface thereof, and the main electrode portion has the same pitch as the arrangement pitch P2 of the lower connection electrode portions 42 of the relay member 40. Has been placed. The lower connection electrode portion 42 and the main electrode portion of the relay member 40 are individually faced to each other, and the solder layer of the lower connection electrode portion 42 is melted, whereby the lower connection electrode portion 42 and the main electrode portion are individually soldered. Then, the electronic component socket 1 is mounted on the main board via the relay member 40.

  Since the arrangement pitch P2 of the lower connection electrode portions 42 is wider than the arrangement pitch P1 of the terminals 20, the pitch of the main electrode portions of the main board can be increased, and the number of layers of the main board which is a multilayer board can be reduced. It is possible to reduce the manufacturing cost of the substrate.

  As shown in FIGS. 3 and 7, the electronic component 30 is mounted on the electronic component socket 1 mounted on the main board. The electronic component 30 is an IC bare chip or an IC package. A plurality of component electrode portions 31 are formed on the bottom surface 30 a of the electronic component 30. The component electrode part 31 is formed of a metal layer having a flat surface. The arrangement region of the component electrode portions 31 on the bottom surface 30a of the electronic component 30 is the same as the region where a large number of terminals 20 are arranged. The arrangement pitch P1 of the component electrode portions 31 is the same as the arrangement pitch P1 of the terminals 20.

  The electronic component 30 is inserted into the component support portion 5a of the electronic component socket 1 and is positioned so as not to move in the plane direction surrounded by the support side wall portion 2a. The component electrode portion 31 and the terminal 20 are vertically moved. Face each other individually. Then, the electronic component 30 is pressed and fixed from above by a pressing member (not shown).

  If the electronic component 30 is positioned by the component support part 5a, the component electrode part 31 of the electronic component 30 will contact the contact part 22a of the front part of the elastic piece 22 which protrudes in the component support part 5a. When the electronic component 30 is pushed into the component support portion 5a, the elastic piece 22 is deformed, and the respective terminals 20 and the component electrode portions 31 are brought into conduction.

  In the electronic component socket 1, since the support plate 10 functions as a capacitor, fluctuations in the power supply voltage can be suppressed and noise superimposed on the transmission signal can be reduced. Since the capacitor is the support plate 10 that holds the holding member 25, it is not necessary to provide a special space for mounting the capacitor in the electronic component socket 1, and a reduction in thickness and size can be realized.

  When the first electrode plate 11 of the support plate 10 is electrically connected to the terminal 20 that functions as a grounding terminal, the first electrode plate 11 can function as a shield plate.

  Therefore, the terminals 20 held on the support plate 10 with a space are easily shielded from each other, and it is easy to prevent external noise from being superimposed on the signal transmitted by the terminals 20.

  Since the relay member 40 has a structure in which the upper surface is covered with the ceiling surface 11c of the first electrode plate 11 set to the ground potential and the four sides are covered with the bent side surface 11d, the upper connection of the relay member 40 is performed. The conduction part between the electrode part 41 and the terminal 20, the connection part between the lower connection electrode part 42 and the main electrode part of the main board, and the internal wiring layer 43 can be shielded and transmitted via the relay member 40. This makes it easier to protect the signal from external noise.

  The electronic component socket 101 of the second embodiment shown in FIG. 8 has an upper concave portion 105 formed in a synthetic resin housing 102, and the inside thereof is a component support portion 105a and a terminal deformation space 105b. A support plate 10 made of a dielectric layer 13 sandwiched between the first electrode plate 11, the second electrode plate 12, and both electrode plates 11, 12 is held at the bottom of the housing 102.

  A holding member 25 holding the terminal 20 is held in the support hole 14 formed in the first electrode plate 11 and the support hole 15 formed in the second electrode plate 12. 6 and 7, the first conductive protrusion 14 a provided on the first electrode plate 11 conducts to one of the terminals 20 and is provided on the second electrode plate 12. The second conductive protrusion 15 a is electrically connected to one of the terminals 20.

  In the electronic component socket 101 shown in FIG. 8, the relay member mounting portion 6 a is not provided, and the base end piece 23 of the terminal 20 appears at the bottom of the housing 102. The electronic component socket 101 is installed directly on the main board (motherboard) without using the relay member 40, and the conductive piece 23a of the terminal 20 is individually provided on the main electrode portion provided on the main board. Soldered.

  In the electronic component socket 1 of the first embodiment and the electronic component socket 101 of the second embodiment, the peripheral portion of the first electrode plate 11 set to the ground potential is bent upward. Thus, the contact portion between the terminal 20 and the component electrode portion 31 of the electronic component 30 may be shielded.

  Further, in the electronic component socket 1 according to the first embodiment, the first electrode plate 11 may be stacked on the lower side and the second electrode plate 12 may be stacked on the upper side.

  In addition, in the electronic component socket 1 of the first embodiment and the electronic component socket 101 of the second embodiment, a conductive protrusion is formed integrally with the terminal 20, and the conductive protrusion of either terminal is formed. May be brought into contact with the first electrode plate 11 to be conducted, and conduction projections of other terminals may be brought into contact with the second electrode plate 12 to be conducted. In this case, a terminal having a conductive protrusion formed at a different position in the height direction is used, a terminal having a conductive protrusion on the top is in contact with the first electrode plate 11, and a terminal having a conductive protrusion on the bottom is the second. The structure comes into contact with the electrode plate 12.

DESCRIPTION OF SYMBOLS 1,101 Electronic component socket 2,102 Housing 5a Component support part 5b Terminal deformation space 6a Relay member mounting part 6b Terminal connection space 10 Support plate 11 First electrode plate 12 Second electrode plate 13 Dielectric layer 14 First Support hole 14a first conduction protrusion 15 second support hole 15a second conduction protrusion 20 terminal 21 intermediate piece 22 elastic piece 23 base end piece 25 holding member 26 fitting portion 26a distal end portion 27 recess 30 electronic component 31 component Electrode part 40 Relay member 41 Upper connection electrode part 42 Lower connection electrode part 43 Internal wiring layer

Claims (7)

In an electronic component socket provided with a housing in which an electronic component is installed, and a plurality of terminals provided in the housing and in contact with a plurality of component electrode portions provided on a bottom surface of the electronic component,
A support plate having a plurality of support holes is fixed to the insulating housing, and an insulating holding member holding the terminals is inserted and held in the support holes,
The support plate includes a first electrode plate, a second electrode plate, and a dielectric layer sandwiched therebetween, and any one of a plurality of terminals is electrically connected to the first electrode plate, The terminal for the electronic component is electrically connected to the second electrode plate.   The first electrode plate is provided with a first conductive protrusion that protrudes into the support hole, and the second electrode plate is provided with a second conductive protrusion that protrudes into the support hole. The electronic component socket according to claim 1, wherein the first conductive protrusion and the second conductive protrusion are in contact with different terminals.   The holding member is formed with a concave portion that is continuous from the front end portion in the insertion direction to the support hole toward the rear, the terminal is exposed in the concave portion, and the holding member is inserted into the support hole. The electronic component socket according to claim 2, wherein the first conductive protrusion or the second conductive protrusion enters the concave portion and contacts the terminal.   The electronic component socket according to claim 3, wherein the depth dimension from the front end to the rear of all the recesses is the same.   5. The electronic component socket according to claim 1, wherein a grounding terminal among a plurality of terminals is electrically connected to the first electrode plate, and the first electrode plate functions as a shield plate.   The electronic component socket according to claim 5, wherein a power terminal or a signal terminal among the plurality of terminals is electrically connected to the second electrode plate.   The electronic component socket according to claim 5 or 6, wherein a side portion of the first electrode plate is bent to cover the terminal from the side.

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