TWM638036U - Electronic part with carrier structure - Google Patents

Abstract

An electronic part with carrier structure including a photoelectric component and a carrier is provided. The photoelectric component has a housing and a plurality of pins. The plurality of pins is disposed on a bottom surface of the housing. The carrier has a groove and a plurality of through holes, the groove is form on a top surface of the carrier. The plurality of through holes is communicated with groove by penetrating a bottom surface of the carrier. The housing is disposed in the groove and the pins are respectively disposed through the corresponding through holes. The pins are bent relative to the carrier for touching the bottom surface of the carrier.

Description

Electronic components with carrier structures

The present invention relates to a carrier structure, and in particular to a packaging carrier for carrying a light-emitting semiconductor element and a light-receiving semiconductor element.

The top of the existing optoelectronic components is equipped with an optical lens, which is good for transmitting and receiving optical signals. However, most of the pin patterns of the existing optoelectronic components are linear pins. The connection direction of the board is fixed, which is not conducive to changing the transmission direction of the optical signal. In addition, in order to reduce the size of the product and improve automation, most of the current circuit board production is made by surface mount technology, and the optoelectronic components with linear pins cannot be applied to the existing automatic circuit board production line.

This new creation provides an electronic component with a carrier structure, which can be applied to the circuit board manufacturing process using surface mount technology, and can be installed on the circuit board at different angles according to requirements, so as to adjust the direction of signal transmission or reception.

The electronic component with a carrier structure created by the present invention includes a photoelectric element and a carrier. The photoelectric element has a shell and multiple pins. A plurality of pins are arranged on a bottom surface of the shell. The carrier has a groove and a plurality of through holes, the groove is formed on a top surface of the carrier, and the plurality of through holes penetrate a bottom surface of the carrier to communicate with the groove. The shell is disposed in the groove, and a plurality of pins pass through the corresponding plurality of through holes respectively. The plurality of pins are bent relative to the carrier so as to face-contact the bottom surface of the carrier.

In an embodiment of the new creation, the above-mentioned carrier has a plurality of positioning grooves formed on the bottom surface of the carrier and communicating with corresponding plurality of through holes respectively.

In an embodiment of the new creation, the above-mentioned plurality of pins are arranged in corresponding plurality of positioning grooves, a part of the plurality of pins contacts a front side of the carrier, and another part of the plurality of stitches contacts a rear of the carrier. side.

In an embodiment of the new creation, a part of the plurality of positioning grooves described above extends to the front side, and another part of the plurality of positioning grooves extends to the rear side.

In an embodiment of the new creation, the above-mentioned carrier is made of electrically insulating composite material.

In an embodiment of the new creation, the above-mentioned carrier has a first bearing part and a second bearing part, the first bearing part has a groove and a mounting hole connecting the groove, and the second bearing part has a protruding ring and two retaining walls, the protruding ring is fastened to the installation hole and has a plurality of perforations, the two retaining walls are located on opposite sides of the protruding ring and engaged with the second housing, and an outer ring surface of the housing contacts the first bearing part .

In an embodiment of the new creation, the above-mentioned second carrying portion has a plurality of positioning grooves formed on the bottom surface of the second carrying portion and communicating with corresponding plurality of through holes respectively.

In an embodiment of the new creation, the above-mentioned plurality of stitches are respectively arranged in corresponding plurality of positioning grooves, a part of the plurality of stitches contacts a front side of one of the retaining walls, and the other part of the plurality of positioning grooves contacts A rear side of the other retaining wall.

In an embodiment of the new creation, a part of the plurality of positioning grooves described above extends to the front side, and another part of the plurality of positioning grooves extends to the rear side.

In an embodiment of the new creation, the above-mentioned first bearing part is made of metal material, and the second bearing part is made of electrically insulating composite material.

In an embodiment of the present invention, the depth of each positioning groove is smaller than the thickness of each stitch, and each stitch part protrudes from each positioning groove.

Based on the above, the electronic component with a carrier structure created by the present invention has a photoelectric element and a carrier. The photoelectric element is installed on the carrier and a plurality of stitches of the photoelectric element penetrate the carrier, and the plurality of stitches are bent to contact the bottom surface of the carrier. The bent multiple pins can be soldered to the circuit board by surface mount technology.

Since multiple pins of the photoelectric element are bent, they can be installed horizontally, vertically or obliquely on the circuit board according to requirements, so as to adjust the direction of the photoelectric element to transmit and receive signals.

FIG. 1A is an exploded schematic view of an electronic component with a carrier structure according to an embodiment of the present invention. FIG. 1B is an exploded view of another direction of the electronic component with the carrier structure in FIG. 1A . FIG. 1C is a schematic diagram of the assembly of the electronic component with the carrier structure in FIG. 1A . FIG. 1D is a schematic diagram of the assembly of the electronic component with the carrier structure in FIG. 1B .

FIG. 2A is a schematic top plan view of the electronic component with the carrier structure shown in FIG. 1C . 2B is a schematic cross-sectional view of the electronic component with the carrier structure in FIG. 1C along line A-A.

Referring to FIG. 1A and FIG. 1B , the electronic component 100 with a carrier structure of the present invention includes a photoelectric element 110 and a carrier 120 .

The photoelectric element 110 has a housing 111 and a plurality of pins 112 . The housing 111 is suitable for installing an optical lens or a mirror window for transmitting and receiving optical signals. A plurality of stitches 112 are disposed on a bottom surface S1 of the housing 111 , and the plurality of stitches 112 extend linearly along a normal direction of the bottom surface S1 .

The carrier 120 has a groove 121 and a plurality of through holes 122 . The groove 121 is formed on a top surface TS of the carrier 120 and is circular. A plurality of through holes 122 penetrate through a bottom surface S2 of the carrier 120 to communicate with the groove 121 , wherein the plurality of pins 112 respectively correspond to the plurality of through holes 122 .

Referring to FIG. 1C, FIG. 1D and FIG. 2A, after the optoelectronic element 110 and the carrier 120 are combined, the housing 111 of the optoelectronic element 110 is disposed in the groove 121 of the carrier 120 and a plurality of pins 112 are respectively inserted in corresponding plurality of perforation 122 . Next, an external force is applied to the plurality of stitches 112 through a machine (not shown in the figure), so that the plurality of stitches 112 are bent relative to the carrier 120 so as to face-contact the bottom surface S2 of the carrier 120 . After the plurality of pins 112 are bent relative to the carrier 120 , the photoelectric element 110 is tightly fitted in the groove 121 of the carrier 120 , and the plurality of pins 112 can be soldered to the plurality of electrodes 210 of the circuit board 200 by surface mount technology.

Referring to FIG. 1D and FIG. 2B , the carrier 120 has a plurality of positioning grooves 123 formed on the bottom surface S2 of the carrier 120 and communicating with corresponding plurality of through holes 122 respectively. The plurality of pins 112 are respectively arranged in the corresponding plurality of positioning grooves 123 after being bent. In detail, through the positioning of the positioning grooves 123, each pin 112 can be ensured to be located at a predetermined position, so as to facilitate matching electrodes of the circuit board 200 210 position, in addition, the depth D of each positioning groove 123 is smaller than the thickness T of each stitch 112 , so that each stitch 112 partially protrudes from each positioning groove 123 .

Further, a part of the plurality of stitches 112 is in contact with a front side FS of the carrier 120, and another part of the plurality of stitches 112 is in contact with a rear side RS of the carrier 120. Since the plurality of stitches 112 have been bent to the front side FS and The rear side RS, then the photoelectric element 110 can be soldered to the circuit board 200 with multiple pins 112 on the front side FS and the rear side RS, or insert multiple pins 112 on the front side FS and the rear side RS into the circuit board 200 The socket is not limited to be soldered to the circuit board 200 with a plurality of pins 112 on the bottom surface S2.

In short, after the photoelectric element 110 and the carrier 120 of this embodiment undergo a bending process, the plurality of pins 112 attached to the bottom surface S2, the front side FS, and the rear side RS of the carrier 120 can all be applied to the circuit board. The surface mount process can control the transmission height and direction of the optical signal of the photoelectric element 110 .

Furthermore, the carrier 120 is made of an electrically insulating and heat-resistant composite material. In addition to avoiding the short circuit between the carrier 120 and the photoelectric element 110, and the thermal deformation temperature of the carrier 120 reaches 300 degrees, it can effectively absorb the photoelectric element 110 when it is in operation. waste heat generated.

In other embodiments, a part of the plurality of positioning grooves extends to the front side of the carrier, and another part of the plurality of positioning grooves extends to the rear side of the carrier, so that the accommodating surface contacts the plurality of pins on the front side and the rear side.

FIG. 3A is an exploded schematic diagram of an electronic component with a carrier structure according to another embodiment of the present invention. FIG. 3B is an exploded view of another direction of the electronic component with the carrier structure in FIG. 3A . FIG. 3C is a schematic diagram of the assembly of the electronic component with the carrier structure in FIG. 3A . FIG. 3D is a schematic diagram of the assembly of the electronic component with the carrier structure in FIG. 3B .

FIG. 4A is a schematic top plan view of the electronic component with the carrier structure shown in FIG. 3C . 4B is a schematic cross-sectional view of the electronic component with the carrier structure in FIG. 3C along line B-B.

Referring to FIG. 3A and FIG. 3B, the electronic component 100A with a carrier structure of the present embodiment is different from the electronic component 100 with a carrier structure shown in FIG. 122a. The first carrying portion 121a has a groove G and an installation hole IH communicating with the groove G. As shown in FIG. The second carrying portion 122a has a protruding ring R and two retaining walls W. The protruding ring R is fastened to the installation hole IH and has a plurality of through holes 123a. Two retaining walls W are located on opposite sides of the protruding ring R and are fastened to the first bearing portion 121a.

Furthermore, a plurality of through holes 123a penetrate through a bottom surface S2 of the second carrying portion 122a to communicate with the groove G of the first carrying portion 121a, wherein the plurality of pins 112a of the optical element 110a respectively correspond to the plurality of through holes 123a.

With reference to FIG. 3C, FIG. 3D and FIG. 4A, after the photoelectric element 110a and the carrier 120a are combined with each other, the housing 111a of the photoelectric element 110a is arranged in the groove G of the first bearing part 121a and an outer ring surface of the housing 111a contacts The inner surface of the first carrying portion 121a. The plurality of pins 112a of the photoelectric element 110a are respectively passed through the corresponding plurality of through holes 123a. Next, an external force is applied to the plurality of stitches 112a through a machine (not shown in the figure), so that the plurality of stitches 112a are bent relative to the second bearing portion 122a to surface-contact the bottom surface S2 of the second bearing portion 122a. After the plurality of pins 112a are bent relative to the second carrying portion 122a, the photoelectric element 110a is tightly fitted in the groove G of the first carrying portion 121a and the two retaining walls W of the second carrying portion 122a. In addition, the plurality of pins 112a can be soldered to the plurality of electrodes 210 of the circuit board 200 by surface mount technology.

Referring to FIG. 3D and FIG. 4B , the second bearing portion 122a has a plurality of positioning grooves PG formed on the bottom surface S2 of the second bearing portion 122a and communicating with corresponding plurality of through holes 123a respectively. The plurality of pins 112a are respectively arranged in the corresponding plurality of positioning grooves PG after being bent. Specifically, through the limitation of each positioning groove PG, each pin 112a can be ensured to be located at a predetermined position, so as to facilitate the matching of the circuit board 200. In addition, the depth D of each positioning groove PG is smaller than the thickness T of each pin 112a, so that each pin 112a partially protrudes from each positioning groove PG.

Further, a part of the plurality of stitches 112a contacts a front side FS of one of the retaining walls W, and another part of the plurality of stitches 112a contacts a rear side RS of the other retaining wall W, since the plurality of stitches 112a have been Bending to the front side FS and the rear side RS, the photoelectric element 110a can be soldered to the circuit board with a plurality of pins 112a on the front side FS and the rear side RS, or a plurality of pins 112a on the front side FS and the rear side RS It is inserted into a socket on the circuit board 200 , and is not limited to being soldered to the circuit board 200 with a plurality of pins 112 a on the bottom surface S2 .

In short, after the photoelectric element 110a and the carrier 120a of this embodiment undergo a bending process, the plurality of stitches 112a attached to the bottom surface S2, the front side, and the rear side of the carrier 120a can all be applied to the surface of the circuit board. process, so that the transmission height and direction of the optical signal of the photoelectric element 110a can be controlled.

Furthermore, the first carrying portion 121a is made of metal material and is in contact with the housing 111a of the photoelectric element 110a. Since the first carrying portion 121a has a high thermal conductivity, it can transfer the waste heat generated during the operation of the photoelectric element 110a to the The first bearing part 121a of the metal substrate is used to dissipate heat for the photoelectric element 110a and slow down the aging phenomenon of the photoelectric element 110a. The second bearing part 122a is made of electrically insulating and heat-resistant composite material. In addition to avoiding the short circuit between the carrier 120a and the photoelectric element 110a, and the thermal deformation temperature of the second bearing part 122a reaches 300 degrees, it will not easily deform.

In other embodiments, a part of the plurality of positioning grooves extends to the front side of one of the retaining walls, and another part of the plurality of positioning grooves extends to the rear side of the other retaining wall, so that the receiving surface contacts the front side and the rear side more. pins.

To sum up, the electronic component with a carrier structure created by the present invention has a photoelectric element and a carrier, the photoelectric element is mounted on the carrier and a plurality of stitches of the photoelectric element penetrate the carrier, and the plurality of stitches are bent to contact the bottom surface of the carrier , the bent multiple pins can be soldered to the circuit board by surface mount technology.

Since multiple pins of the photoelectric element are bent, it can be installed horizontally, vertically or obliquely on the circuit board according to the requirements, and the direction of the photoelectric element to transmit and receive signals can be freely adjusted.

100, 100A: electronic parts with carrier structure 110, 110a: photoelectric components 111, 111a: shell 112, 112a: pins 120, 120a: carrier 121, G: Groove 122: perforation 123, PG: positioning groove 121a: the first bearing part 122a: the second carrying part 123a: Perforation 200: circuit board 210: electrode D: Depth R: convex ring W: retaining wall T: Thickness FS: front side RS: rear side IH: Mounting hole S1, S2: bottom surface TS: top surface

FIG. 1A is an exploded schematic view of an electronic component with a carrier structure according to an embodiment of the present invention. FIG. 1B is an exploded view of another direction of the electronic component with the carrier structure in FIG. 1A . FIG. 1C is a schematic diagram of the assembly of the electronic component with the carrier structure in FIG. 1A . FIG. 1D is a schematic diagram of the assembly of the electronic component with the carrier structure in FIG. 1B . FIG. 2A is a schematic top plan view of the electronic component with the carrier structure shown in FIG. 1C . 2B is a schematic cross-sectional view of the electronic component with the carrier structure in FIG. 1C along line A-A. FIG. 3A is an exploded schematic diagram of an electronic component with a carrier structure according to another embodiment of the present invention. FIG. 3B is an exploded view of another direction of the electronic component with the carrier structure in FIG. 3A . FIG. 3C is a schematic diagram of the assembly of the electronic component with the carrier structure in FIG. 3A . FIG. 3D is a schematic diagram of the assembly of the electronic component with the carrier structure in FIG. 3B . FIG. 4A is a schematic top plan view of the electronic component with the carrier structure shown in FIG. 3C . 4B is a schematic cross-sectional view of the electronic component with the carrier structure in FIG. 3C along line B-B.

100: Electronic components with carrier structures

110: Photoelectric components

111: shell

112: Pin

120: carrier

121: Groove

122: perforation

123: positioning slot

S2: bottom surface

TS: top surface

Claims (11)

An electronic component with a carrier structure, comprising: A photoelectric element has a housing and a plurality of pins, and the pins are arranged on a bottom surface of the housing; and A carrier has a groove and a plurality of perforations, the groove is formed on a top surface of the carrier, and the perforations pass through a bottom surface of the carrier to communicate with the groove, wherein the shell is disposed in the groove and the The stitches are respectively set in the corresponding perforations, Wherein, the pins are bent relative to the carrier so as to face-contact the bottom surface of the carrier. The electronic component with a carrier structure as claimed in claim 1, wherein the carrier has a plurality of positioning grooves formed on the bottom surface of the carrier and communicating with corresponding through holes respectively. The electronic component with a carrier structure as described in claim 2, wherein the pins are respectively arranged in the corresponding positioning grooves, a part of the pins touches a front side of the carrier, and another part of the pins touches a rear side of the carrier. The electronic component with a carrier structure as claimed in claim 3, wherein a part of the positioning grooves extends to the front side, and another part of the positioning grooves extends to the rear side. The electronic component with a carrier structure as claimed in Claim 1, wherein the carrier is made of an electrically insulating composite material. The electronic component with a carrier structure as claimed in claim 1, wherein the carrier has a first bearing part and a second bearing part, the first bearing part has the groove and a mounting hole communicating with the groove, the The second bearing part has a protruding ring and two retaining walls. The protruding ring is fastened to the installation hole and has the through holes. The two retaining walls are located on opposite sides of the protruding ring and are engaged with the first bearing. part, an outer ring surface of the casing contacts the first bearing part. The electronic component with a carrier structure as claimed in claim 6, wherein the second carrying part has a plurality of positioning grooves formed on the bottom surface of the second carrying part and communicating with the corresponding through holes respectively. The electronic component with a carrier structure as described in claim 7, wherein the pins are respectively arranged in the corresponding positioning grooves, and a part of the pins touches a front side of one of the retaining walls, and the positioning grooves The other part is in contact with a rear side of the other retaining wall. The electronic component with a carrier structure as claimed in claim 8, wherein a part of the positioning grooves extends to the front side, and another part of the positioning grooves extends to the rear side. The electronic component with carrier structure as claimed in claim 6, wherein the first carrier part is made of metal material, and the second carrier part is made of electrically insulating composite material. The electronic component with carrier structure as claimed in claim 3 or 8, wherein the depth of each of the positioning grooves is smaller than the thickness of each of the pins, and each of the pins protrudes from each of the positioning grooves.

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