JP2011034914A - Contact and socket equipped with the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a contact and a socket hardly peeling off at a soldering part. <P>SOLUTION: A first spring part 32 supporting an LED (light emitting diode) from below is provided on one end of the soldering part 31 soldered to a wiring board 24, and a second spring part 33 supporting the LED from above is provided on the other end of the soldering part 31. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a contact for electrically connecting an electronic component and a wiring board, and a socket including the contact.

  Conventionally, a connector (socket) for an LED (light emitting diode) is known (see Patent Document 1 below).

  As shown in FIGS. 26 to 28, the connector 101 includes an insulator 103, a contact 105, and a light guide plate 107.

  The insulator 103 is substantially box-shaped and has two pairs of side wall portions 1031 and 1032. A plurality of contact accommodating chambers 1033 are formed at equal intervals on a pair of opposing side wall portions 1031 of the two pairs of side wall portions. An LED storage chamber 1037 is formed between the contact storage chamber 1033 of one side wall portion 1031 and the contact storage chamber 1033 of the other side wall portion 1031 (see FIG. 27). The contact accommodating chamber 1033 of both side wall portions 1031 communicates with the LED accommodating chamber 1037.

  The contact 105 includes a first contact portion 1051, a first spring portion 1052, a second contact portion 1053, a second spring portion 1054, and a bent portion 1055. The first contact portion 1051 is in contact with the terminal portion 10111 of the LED 1011. The first spring portion 1052 presses the first contact portion 1051 against the terminal portion 10111 of the LED 1011. The second contact portion 1053 is in contact with the terminal portion 10121 of the printed board 1012. The second spring portion 1054 presses the second contact portion 1053 against the terminal portion 10121 of the printed board 1012. The bent portion 1055 is bent into a U shape. By attaching the bent portion 1055 to the support portion 1038 provided in the contact accommodating chamber 1033, the contact 105 can be rotated by a predetermined rotation angle in the contact accommodating chamber 1033. As shown in FIG. 26, the light guide plate 107 has a light receiving portion 1071. The light receiving unit 1071 is located above the LED 1011 accommodated in the LED accommodating chamber 1037 when the light guide plate 107 is attached to the insulator 103.

  As shown in FIG. 26, when the LED 1011 is housed in the LED housing chamber 1037 of the insulator 103 and the second contact portion 1053 of the contact 105 is pressed against the printed circuit board 1012 with the light guide plate 107 mounted on the insulator 103, the contact 105 is Rotating in the contact housing chamber 1033, the first contact portion 1051 of the contact 105 is pressed against the terminal portion 10111 of the LED 1011, and the LED 1011 is electrically connected to the printed board 1012. The second contact portion 1053 of the contact 105 only contacts the printed board 1012 and is not soldered. Therefore, in order to keep the LED 1011 electrically connected to the printed circuit board 1012, the light guide plate 107 and the insulator 103 are fixed to the printed circuit board 1012 by a fixing means such as a bolt and nut (not shown).

  The above-mentioned connector is a type of socket that is not soldered to the printed circuit board. However, there are other types of sockets that are conventionally soldered in addition to this type of socket that is not soldered.

  A conventional soldered type socket includes a pair of contacts and a holding frame for holding a surface-mounted LED. The contact is bent in a staircase shape, and has a soldering portion positioned at the lower level, an intermediate level pressing portion positioned at the middle level, and an upper level pressing portion positioned at the upper level. The pair of contacts are arranged on the printed circuit board with a predetermined interval. The soldering part of the contact is soldered to the printed board. The middle pressing portion of the contact presses the lead of the LED mounted on the metal spring disposed on the printed circuit board. The upper pressing part of the contact holds the LED held by the pressing frame.

  When the LED is mounted on the printed circuit board using this socket, the LED lead is pressed against the middle pressing portion of the contact by the restoring force of the metal spring. As a result, the LED and the printed board are electrically connected.

JP 2004-227919 A

  In the above-described socket, the restoring force of the metal spring is transmitted from the middle pressing portion to the soldering portion and acts as a force for peeling the soldering portion, so that the soldering portion may be peeled off from the printed board. In particular, when an electronic component mounted on a printed circuit board is an electronic component with a large amount of heat generation such as a high-power LED, the soldered portion is easily peeled off as the temperature of the soldered portion increases.

  The present invention has been made in view of such circumstances, and an object thereof is to provide a contact in which a soldered portion is difficult to peel off and a socket including the contact.

  In order to solve the above-mentioned problems, the connector of the invention of claim 1 is a contact for electrically connecting a surface-mount type electronic component and a wiring board, and a soldering portion soldered to the wiring board; A first spring portion provided at one end of the attaching portion and supporting the electronic component from below; and a second spring portion provided at the other end of the soldering portion and supporting the electronic component from above. Features.

  As described above, since the first spring portion supports the electronic component from below and the second spring portion supports the electronic component from above, the electronic component is sandwiched between the first spring portion and the second spring portion. At this time, the spring force of the first spring portion acting on the electronic component and the spring force of the second spring portion acting on the electronic component cancel each other. As a result, the spring force of the first and second spring portions does not act as a force for peeling the soldered portion from the wiring board.

  According to a second aspect of the present invention, in the contact according to the first aspect, the first spring portion is in contact with an electrode formed on a lower surface of the electronic component.

  According to a third aspect of the present invention, in the contact according to the first aspect, the second spring portion contacts an upper surface of a lead formed on the electronic component.

  According to a fourth aspect of the present invention, in the contact according to any one of the first to third aspects, the first and second spring portions are virtual parallel to the thickness direction of the wiring board passing through the soldering portion. It is arranged on a straight line.

  According to a fifth aspect of the present invention, in the contact according to any one of the first to fourth aspects, the soldering portion has a flat plate shape.

  A sixth aspect of the invention is characterized in that the contact according to any one of the first to fifth aspects is formed by bending one metal plate.

  According to a seventh aspect of the present invention, a socket includes a plurality of contacts according to any one of the first to sixth aspects, and an insulating holding member that is disposed on the wiring board and holds the plurality of contacts. It is characterized by that.

  The invention according to claim 8 is the socket according to claim 7, wherein the electronic component is brought into contact with a heat transfer soldering portion soldered to the wiring board and a heat radiating portion formed under the electronic component. A heat transfer contact having a heat transfer contact portion supported from below is provided, and the heat transfer contact is held by the insulating holding member together with the plurality of contacts.

  According to a ninth aspect of the present invention, in the socket according to the seventh or eighth aspect, the contact and the heat transfer contact are formed of different metal materials.

  The invention of claim 10 is the socket according to claim 7 or 8, wherein the contact and the heat transfer contact are plated differently.

  The invention of claim 11 is the socket according to any one of claims 7 to 10, further comprising an insulating support member that is disposed between the insulating holding member and the electronic component and supports the electronic component. It is characterized by.

  According to a twelfth aspect of the present invention, in the contact for electrically connecting the surface-mount type electronic component and the wiring board, the soldering part to be soldered to the wiring board, provided at one end of the soldering part, It has the 1st spring part which presses an electronic component to the said soldering part from upper direction, It is characterized by the above-mentioned.

  According to a thirteenth aspect of the present invention, in the contact according to the twelfth aspect, the soldering portion is flat.

  According to a fourteenth aspect of the present invention, in the contact according to the twelfth or thirteenth aspect, one metal plate is bent.

  According to the present invention, the soldered portion is hardly peeled off.

FIG. 1 is a perspective view of a socket according to a first embodiment of the present invention. FIG. 2 is a perspective view showing a usage state of the socket shown in FIG. FIG. 3 is a front view showing a use state of the socket shown in FIG. FIG. 4 is a perspective view of an LED connected to the socket shown in FIG. FIG. 5 is a perspective view of a wiring board on which the socket shown in FIG. 1 is mounted. 6 is a perspective view showing a state in which a solder paste is applied on the pad of the wiring board shown in FIG. FIG. 7 is a perspective view showing a state in which the distance between the first spring portion and the second spring portion of the contact of the socket shown in FIG. 1 is widened. FIG. 8 is a front view showing a state in which the distance between the first spring portion and the second spring portion of the contact of the socket shown in FIG. FIG. 9 is a perspective view showing a state in which the distance between the first spring portion and the second spring portion of the contact of the socket shown in FIG. 1 is increased and LEDs are arranged on the first spring portion. FIG. 10 is a front view showing a state in which the distance between the first spring part and the second spring part of the contact of the socket shown in FIG. 1 is widened and LEDs are arranged on the first spring part. FIG. 11 is a perspective view of a socket according to a second embodiment of the present invention. FIG. 12 is an exploded perspective view of the socket shown in FIG. FIG. 13 is a perspective view showing a use state of the socket shown in FIG. FIG. 14 is a cross-sectional view showing a state in which the distance between the first spring portion and the second spring portion of the contact of the socket shown in FIG. 11 is widened by an insulating support member, and is a perspective view. FIG. 15 is a cross-sectional view showing a state in which the distance between the first spring portion and the second spring portion of the contact of the socket shown in FIG. 11 is widened by the insulating support member. FIG. 16 is an enlarged view showing an engagement state between the second spring portion of the contact shown in FIG. 14 and the engagement portion of the insulating support member. 17 is a cross-sectional view showing a state in which the insulating support member of the socket shown in FIG. 15 is pushed down. FIG. 18 is a perspective view showing a state where the LED is held by the contact. FIG. 19 is a cross-sectional view showing a state where the LED is held by the contact, and is a perspective view. FIG. 20 is a cross-sectional view showing a state where the LED is held by the contact. FIG. 21 is a perspective view of a socket according to a third embodiment of the present invention. FIG. 22 is a perspective view showing a usage state of the socket shown in FIG. 23 is a cross-sectional view of the socket, LED, and wiring board shown in FIG. FIG. 24 is a perspective view showing a state before the socket contact of FIG. 21 is bent. FIG. 25 is a perspective view of a socket according to a fourth embodiment of the present invention. FIG. 26 is a cross-sectional view showing a conventional connector in use. 27 is a perspective view showing a state in which the insulator of the connector shown in FIG. 26 is cut. FIG. 28 is a perspective view of the contact of the connector shown in FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  As shown in FIGS. 1 and 2, the socket 1 of the first embodiment includes four contacts 3 and two heat transfer contacts 9. The socket 1 is mounted on a wiring board 24 and electrically connects, for example, an electronic component such as a surface mount type LED (light emitting diode) 22 and the wiring board 24.

  As shown in FIG. 4, the LED 22 includes a package 221, a lens 222 provided on the upper surface thereof, leads 223 protruding from both side surfaces of the package 221, and a heat die (heat radiation part) 224 formed on the lower surface of the package 221. With.

  As shown in FIG. 5, the wiring board 24 has four pads 241 and one pad 242. The four pads 241 are electrical pads, and the pads 242 are heat dissipation pads for the LEDs 22.

  As shown in FIGS. 2 and 3, the contact 3 includes a soldering portion 31, a first spring portion 32, a second spring portion 33, and an operation portion 34. The contact 3 is formed by punching and bending one metal plate. As the material of the contact 3, a metal material having elasticity and excellent conductivity, for example, phosphor bronze is suitable. The surface of the contact 3 may be plated, for example, gold plating.

  The soldering part 31 has a flat plate shape and is soldered to the pad 241 of the wiring board 24. The first spring portion 32 is connected to one end of the soldering portion 31 and is bent toward the other end side of the soldering portion 31. The first spring portion 32 supports the lead 223 of the LED 22 from below. The first spring portion 32 is electrically connected to the lead 223.

  The second spring portion 33 continues to the other end of the soldering portion 31 and is bent toward one end of the soldering portion 31. The second spring portion 33 supports the lead 223 of the LED 22 from above. The second spring part 33 is electrically connected to the lead 223.

  The first spring portion 32 and the second spring portion 33 are arranged on an imaginary straight line L (see FIG. 3) parallel to the thickness direction of the wiring board 24 that passes through the soldering portion 31.

  The operation part 34 is connected to the second spring part 33 and is bent substantially in an S shape.

  The heat transfer contact 9 has a shape formed by folding a rectangular metal plate in half, and includes a heat transfer soldering portion 91 and a heat transfer spring portion 92. As a material for the heat transfer contact 9, a metal material excellent in elasticity and thermal conductivity, for example, pure copper is suitable. The surface of the heat transfer contact 9 may be plated, for example, nickel plating.

  In order to mount the socket 1 on the wiring board 24, first, as shown in FIG. 6, the solder paste 26 is applied to predetermined locations of the pads 241 and the pads 242 of the wiring board 24, and then the contacts 3 and the heat transfer are used. The contacts 9 are arranged at predetermined positions on the wiring board 24, respectively. Finally, the soldering portion 31 of the contact 3 is reflow soldered to the pad 241, and the heat transfer soldering portion 91 of the heat transfer contact 9 is reflow soldered to the pad 242.

  To attach the LED 22 to the socket 1, first, as shown in FIG. 7, the operation part 34 of the contact 3 is tilted away from the heat transfer contact 9, and the first spring part 32 and the second spring part 33 are connected. Increase the spacing.

  Next, as shown in FIG. 8, the LED 22 is inserted into the socket 1 from above the socket 1, and the lead 223 of the LED 22 is placed on the first spring portion 32 of the contact 3 as shown in FIGS. 9 and 10. Put.

  Finally, the force applied to the operation part 34 of the contact 3 is gradually weakened to return the second spring part 33 to the original position. As a result, as shown in FIGS. 2 and 3, the lead 223 of the LED 22 is sandwiched between the first spring portion 32 and the second spring portion 33 by the spring force of the contact 3, and the heat die 224 of the LED 22 is the heat transfer contact. 9 is in contact with the heat transfer spring portion 92. Thereby, the lead 223 of the LED 22 is electrically connected to the pad 241 of the wiring board 24 through the contact 3, and the heat generated in the LED 22 is transmitted to the wiring board 24 through the heat transfer contact 9.

  In the socket 1 of the first embodiment, the first spring portion 32 and the second spring portion 33 sandwich the lead 223 of the LED 22 so that the contact 3 and the LED 22 are electrically connected. When the lead 223 is sandwiched between the portion 32 and the second spring portion 33, the spring force of the first and second spring portions 32, 33 is canceled out, so the springs of the first and second spring portions 32, 33 are The force hardly acts as a force for peeling the soldering portion 31 from the wiring board 24.

  According to the first embodiment, the contact 3 is unlikely to be peeled off from the wiring board 24.

  Further, since the socket 1 includes the contact 3 and the heat transfer contact 9, a metal material having excellent conductivity can be used as the contact 3, and a metal material having excellent heat transfer property can be used as the material of the heat transfer contact 9. Since it can be used, a higher heat dissipation effect can be obtained as compared with the contact 3 also serving as a heat transfer contact.

  Further, since the first and second spring portions 32 and 33 are arranged on a virtual straight line L parallel to the thickness direction of the wiring board 24 passing through the soldering portion 31, the soldering portion 31 is made to depend on the weight of the LED 22. Generation of a moment in the peeling direction can be suppressed, and the soldering part 31 is more difficult to peel off from the wiring board 24.

  In the first embodiment, the heat transfer contact 9 is provided. However, the heat transfer contact 9 is not necessarily required, and the heat transfer contact 9 may be omitted.

  In the first embodiment, the first and second spring portions 32 and 33 are arranged on the imaginary straight line L parallel to the thickness direction of the wiring board 24 passing through the soldering portion 31. There is no need to configure.

  In the first embodiment, the contact 3 is formed by punching and bending one metal plate. However, the contact 3 is not necessarily configured in this way, and the contact is configured by a plurality of parts. May be.

  Next explained is the second embodiment of the invention. Portions common to the first embodiment are denoted by the same reference numerals and description thereof is omitted. Only the main differences from the first embodiment will be described below.

  As shown in FIGS. 11 and 12, the socket 201 includes an insulating holding member 205 and an insulating support member 208.

  The insulating holding member 205 has a rectangular plate shape. A first spring portion 32 of a contact 203 is embedded in the insulating holding member 205 leaving its upper surface. As a result, the contact 203 is held by the insulating holding member 205. The insulating holding member 205 is embedded with a heat transfer contact 9 leaving its upper and lower surfaces. Posts 206 are attached to the four corners of the insulating holding member 205. A female screw (not shown) is formed on the column 206, and a bolt 207 is screwed into the female screw.

  The insulating support member 208 is substantially frame-shaped and has an LED housing portion 281 at the center. The LED housing portion 281 houses the LED 22. Two concave portions 282 and two contact accommodating portions 283 are formed on both sides of the insulating support member 208, respectively. The concave portion 282 communicates with the LED housing portion 281 and the contact housing portion 283. The recess 282 allows the lead 223 of the LED 22 housed in the LED housing portion 281 to pass through the contact housing portion 283. The contact accommodating portion 283 accommodates a part of the contact 203 (mainly the second spring portion 233). Engaging portions 284 projecting into the contact accommodating portion 283 are formed on both side portions of the insulating support member 208. Insertion holes 285 are formed at the four corners of the insulating support member 208. The inner diameter of the upper part of the insertion hole 285 is slightly larger than the outer diameter of the head of the bolt 207, and the inner diameter of the lower part of the insertion hole 285 is slightly larger than the outer diameter of the column 206.

  To assemble the socket 201, the bolt 207 is removed from the support 206, the support 206 is inserted into the insertion hole 285 of the insulating support member 208, and then the bolt 207 is screwed into the support 206 in the insertion hole 285. The insulating support member 208 of the assembled socket 201 can move by a predetermined distance in the thickness direction of the insulating holding member 205.

  In order to mount the LED 22 on the wiring board 24 using the socket 201, as shown in FIGS. 13, 14, and 15, the operating portion 34 of the contact 203 is pressed away from the insulating support member 208, and in this state The insulating support member 208 is lifted up until the insulating support member 208 holding the LED 22 hits the head of the bolt 207. As a result, as shown in FIG. 16, the lower end portion 34a of the operation portion 34 and the engaging portion 284 of the insulating support member 208 are in contact with each other, and the contacts 203 facing each other with the insulating support member 208 interposed therebetween are insulative with each other. The supporting members 208 are pressed in the horizontal direction and their forces are balanced, and the insulating supporting member 208 is brought to a standstill in a lifted state.

  Next, as shown in FIG. 17, when the insulating support member 208 is pushed down, the engagement state between the lower end portion 34a of the operation portion 34 and the engaging portion 284 of the insulating support member 208 is released, and the insulating support member 208 descends downward, and the second spring portion 233 of the contact 203 moves toward the soldering portion 31 by the spring force. At this time, the engaging portion 284 of the insulating support member 208 relatively passes through the notch 233a of the second spring portion 233 of the contact 203, so that the contact 203 does not hit the insulating support member 208.

  As shown in FIGS. 18, 19, and 20, the second spring portion 233 of the contact 203 presses the lead 223 of the LED 22 against the first spring portion 32. As a result, the LED 22 is electrically connected to the wiring board 24 via the contact 203.

  According to the second embodiment, the same effects as in the first embodiment can be obtained, the LED 22 can be easily positioned by the insulating support member 208, and the contact 203 is opened by the insulating support member 208 (second embodiment). The spring part 233 can be kept away from the first spring part 32). Therefore, the LED 22 can be easily attached to and detached from the socket 201.

  In the second embodiment, the contact 203 and the heat transfer contact 9 are embedded in the insulating holding member 205, but the contact 203 and the heat transfer contact 9 do not necessarily have to be embedded in the insulating holding member 205. .

  Next explained is the third embodiment of the invention. Portions common to the first embodiment are denoted by the same reference numerals and description thereof is omitted. Only the main differences from the first embodiment will be described below.

  As shown in FIGS. 21, 22, and 23, the socket 301 includes two contacts 303, one heat transfer contact 11, and an insulating holding member 305.

  The socket 301 electrically connects the surface mount type LED (electronic component) 42 and the wiring board 44. The LED 42 includes a package 421 and a lens 422. A heat die (heat radiating part) (not shown) is formed at the center of the lower surface of the package 421. Electrodes (not shown) are formed on both sides of the lower surface of the package 421.

  Two pads 441 and 442 are formed on the wiring board 44. Conductive paths 444 and 445 are connected to the pads 441 and 442, respectively. In addition, a substantially H-shaped heat radiation pattern 443 is formed on the wiring board 44 so as to surround the pads 441 and 442 and the conductive paths 444 and 445. The heat radiation pattern 443 is formed of, for example, a copper thin film.

  The contact 303 has a soldering portion 31, a first spring portion 332, and a second spring portion 333. The contact 303 is formed by punching and bending one metal plate. As a material for the contact 303, for example, phosphor bronze is suitable. The surface of the contact 303 may be plated, for example, gold plating.

  The soldering part 31 of one contact 303 is connected to the pad 441 of the wiring board 44 by solder 46, and the soldering part 31 of the other contact 303 is connected to the pad 442 of the wiring board 44 by solder (not shown). Yes.

  The first spring portion 332 is connected to one end of the soldering portion 31 and is bent in a substantially U shape. The first spring portion 332 has a contact 332a. The first spring portion 332 supports the LED 42 from below. At this time, the contact 332a contacts an electrode (not shown) of the LED 42.

  The second spring portion 333 is connected to the other end of the soldering portion 31 and is bent in a substantially U shape. The second spring portion 333 supports the package 421 of the LED 42 from above.

  The first spring part 332 and the second spring part 333 are arranged on a virtual straight line (not shown) parallel to the thickness direction of the wiring board 44 passing through the soldering part 31.

  The heat transfer contact 11 includes a heat transfer soldering portion 111, a first spring portion (heat transfer spring portion) 112, and a second spring portion 113. The heat transfer contact 11 is formed by punching and bending one metal plate. As a material for the heat transfer contact 11, for example, pure copper is suitable. The surface of the heat transfer contact 11 may be plated, for example, nickel plated.

  The heat transfer soldering part 111 is soldered to the heat radiation pattern 443 of the wiring board 44.

  The first spring portion 112 is connected to one end of the heat transfer soldering portion 111 and is bent toward the other end of the heat transfer soldering portion 111. The first spring portion 112 has a contact 112a. The first spring portion 112 supports the LED 42 from below. At this time, the contact 112a contacts a heat die (heat radiating part) (not shown) of the LED 42.

  The second spring portion 113 is connected to the other end of the heat transfer soldering portion 111 and is bent in a substantially U shape. The second spring portion 113 supports the package 421 of the LED 42 from above.

  The two insulating holding members 305 connect the two contacts 303 and the one heat transfer contact 11 so as to integrate them.

  To manufacture the socket 301, first, the contact 303 and the heat transfer contact 11 are each punched out from a metal plate (not shown). As shown in FIG. 24, the contact 303 before being punched from the metal plate and the heat transfer contact 11 are integrated by a so-called mold-in molding method.

  Then, if the contact 303 and the heat transfer contact 11 are bent at the same time, the socket 301 shown in FIG. 21 is completed.

  In order to attach the LED 42 to the socket 301, the LED 42 may be inserted between the first spring portion 332 and the second spring portion 333 from the side of the contact 303.

  According to the third embodiment, the same effect as the first embodiment can be obtained, and the LED 42 can be easily inserted into and removed from the socket 301 without operating the second spring portion 333.

  Further, if the insulating holding member 305 is fixed to the wiring board 44, the soldering part 31 and the heat transfer soldering part 111 are less likely to be peeled off from the wiring board 44.

  Next explained is the fourth embodiment of the invention. Portions common to the first embodiment are denoted by the same reference numerals and description thereof is omitted. Only the main differences from the first embodiment will be described below.

  As shown in FIG. 25, the socket 401 according to the fourth embodiment includes four contacts 403.

  The contact 403 includes a soldering portion 31 and a pair of first spring portions 432. The contact 403 is formed by punching and bending one metal plate.

  The pair of first spring portions 432 are respectively connected to one end of the soldering portion 31 and are bent in a substantially C-shaped cross section. A predetermined gap is formed between the pair of first spring portions 432, and the lead 223 of the LED 22 is disposed between the gaps. A protruding piece 432 a is formed at the tip of the first spring portion 432. The protruding piece 432 a presses the lead 223 disposed between the pair of first spring portions 432 against the soldering portion 31.

  In order to attach the LED 22 to the socket 401, the lead 223 of the LED 22 may be inserted into the gap between the pair of first spring portions 432. At this time, the protruding piece 432a engages with the lead 223 and the first spring portion 432 is elastically deformed in the width direction, so that the lead 223 can pass through the gap between the two protruding pieces 432a. When the lead 223 passes through the gap between the two protruding pieces 432a, the lead 223 is pressed against the soldering portion 31 by the protruding piece 432a. As a result, the lead 223 is sandwiched between the soldering part 31 and the first spring part 432. At this time, most of the spring force of the first spring portion 432 is used to sandwich the lead 223, so that the spring force of the first spring portion 432 hardly acts as a force for peeling the soldering portion 31 from the pad 241.

  According to the fourth embodiment, the same effect as the first embodiment can be obtained, and the configuration is simple, so that the socket 401 can be provided at low cost.

1, 301, 301, 401 Socket 3, 203, 303, 403 Contact 31 Soldering part 32, 332, 432 First spring part 332a Contact 432a Protruding piece 33, 233, 333 Second spring part 233a Notch 333a Pressing part 34 Operation Part 205, 305 Insulating holding member 251 Window hole 206 Column 207 Bolt 208 Insulating support member 281 LED housing part 282 Recessed part 283 Contact housing part 284 Engaging part 285 Inserting part 22, 42 LED (electronic component)
221, 421 Package 222, 422 Lens 223 Lead terminal 224 Heat die (heat dissipation part)
24, 44 Printed circuit board (wiring board)
241, 441 Pad 242, 442 Pad 443 Heat dissipation pattern 444, 445 Conductive path 26, 46 Solder 9, 11 Heat transfer contact 91, 111 Heat transfer soldering part 92 Heat transfer spring part 112 First spring part (heat transfer) Spring part)
112a Contact 113 Second spring part L Virtual straight line 101 Connector 103 Insulator 1031, 1032 Side wall part 1033 Contact accommodation room 1037 LED accommodation room 1038 Support part 105 Contact 1051 First contact part 1052 First spring part 1053 Second contact part 1054 Second Spring part 1055 Bending part 1011 LED
10111 Terminal section 1012 Printed circuit board 10121 Terminal section

Claims (14)

In contacts that electrically connect surface-mount electronic components and wiring boards,
A soldering portion to be soldered to the wiring board;
A first spring portion provided at one end of the soldering portion and supporting the electronic component from below;
And a second spring portion provided at the other end of the soldering portion and supporting the electronic component from above.   The contact according to claim 1, wherein the first spring portion is in contact with an electrode formed on a lower surface of the electronic component.   The contact according to claim 1, wherein the second spring portion contacts an upper surface of a lead formed on the electronic component.   4. The device according to claim 1, wherein the first and second spring portions are arranged on an imaginary straight line parallel to a thickness direction of the wiring board that passes through the soldering portion. Contact described. The contact according to claim 1, wherein the soldering portion has a flat plate shape.   The contact according to any one of claims 1 to 5, wherein the contact is formed by bending one metal plate.   A socket, comprising: a plurality of contacts according to claim 1; and an insulating holding member that is disposed on the wiring board and holds the plurality of contacts. A heat transfer soldering portion soldered to the wiring board and a heat transfer contact portion that contacts a heat dissipation portion formed at a lower portion of the electronic component and supports the electronic component from below. With contacts,
The socket according to claim 7, wherein the heat transfer contact is held by the insulating holding member together with the plurality of contacts.   The socket according to claim 7 or 8, wherein the contact and the heat transfer contact are made of different metal materials.   The socket according to claim 7 or 8, wherein the contact and the heat transfer contact are plated differently. 11. The socket according to claim 7, further comprising: an insulating support member that is disposed between the insulating holding member and the electronic component and supports the electronic component. In contacts that electrically connect surface-mount electronic components and wiring boards,
A soldering portion to be soldered to the wiring board;
And a first spring portion that is provided at one end of the soldering portion and presses the electronic component against the soldering portion from above. The contact according to claim 12, wherein the soldering portion has a flat plate shape.   14. The contact according to claim 12, wherein the contact is formed by bending one metal plate.

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