JP7217565B1 - 樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品 - Google Patents

樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品 Download PDF

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Publication number
JP7217565B1
JP7217565B1 JP2022173402A JP2022173402A JP7217565B1 JP 7217565 B1 JP7217565 B1 JP 7217565B1 JP 2022173402 A JP2022173402 A JP 2022173402A JP 2022173402 A JP2022173402 A JP 2022173402A JP 7217565 B1 JP7217565 B1 JP 7217565B1
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component
group
meth
resin composition
epoxy
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Japanese (ja)
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JP2024064648A (ja
Inventor
健斗 目黒
篤志 齊藤
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Namics Corp
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Namics Corp
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Priority to JP2022173402A priority Critical patent/JP7217565B1/ja
Priority to PCT/JP2022/047359 priority patent/WO2024089905A1/fr
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02Polycondensates containing more than one epoxy group per molecule
    • C08G59/04Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02Polythioethers
    • C08G75/04Polythioethers from mercapto compounds or metallic derivatives thereof
    • C08G75/045Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2022173402A 2022-10-28 2022-10-28 樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品 Active JP7217565B1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022173402A JP7217565B1 (ja) 2022-10-28 2022-10-28 樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品
PCT/JP2022/047359 WO2024089905A1 (fr) 2022-10-28 2022-12-22 Composition de résine, adhésif, agent d'étanchéité, produit durci, dispositif à semi-conducteur et composant électronique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022173402A JP7217565B1 (ja) 2022-10-28 2022-10-28 樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品

Publications (2)

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JP7217565B1 true JP7217565B1 (ja) 2023-02-03
JP2024064648A JP2024064648A (ja) 2024-05-14

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JP2022173402A Active JP7217565B1 (ja) 2022-10-28 2022-10-28 樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品

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JP (1) JP7217565B1 (fr)
WO (1) WO2024089905A1 (fr)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008001867A (ja) 2006-06-26 2008-01-10 Three Bond Co Ltd 硬化性樹脂組成物
WO2012164869A1 (fr) 2011-05-31 2012-12-06 日油株式会社 Composition de résine durcissable
JP2014141621A (ja) 2013-01-25 2014-08-07 Toyo Ink Sc Holdings Co Ltd 紫外線硬化性組成物
JP2017101112A (ja) 2015-11-30 2017-06-08 味の素株式会社 光および熱硬化性樹脂組成物
JP2018095829A (ja) 2016-12-09 2018-06-21 日油株式会社 粘着剤組成物、及びこれを用いた積層体
WO2021033329A1 (fr) 2019-08-21 2021-02-25 ナミックス株式会社 Composition de résine époxy
JP2021075698A (ja) 2019-10-31 2021-05-20 味の素株式会社 硬化性組成物

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3367531B2 (ja) * 1992-10-22 2003-01-14 味の素株式会社 エポキシ樹脂組成物
JP3367532B2 (ja) 1992-10-22 2003-01-14 味の素株式会社 エポキシ樹脂組成物
JP2009051954A (ja) * 2007-08-28 2009-03-12 Three Bond Co Ltd 光および加熱硬化性組成物とその硬化物
JP2012153794A (ja) 2011-01-26 2012-08-16 Sakai Chem Ind Co Ltd 樹脂組成物、樹脂硬化物および樹脂成形体
CN103525315B (zh) * 2012-06-29 2016-06-22 第一毛织株式会社 用于偏振板的粘合剂组合物、使用其的偏振板和光学元件
KR101509483B1 (ko) * 2013-09-26 2015-04-08 주식회사 신광화학산업 금속과 수지의 이종 재질간 고접착력이 유지되는 이중 경화형 에폭시 접착제 조성물을 이용한 금속과 수지의 접착 방법
CN109153842A (zh) * 2016-07-05 2019-01-04 积水保力马科技株式会社 密封材料组合物及密封材料
JP2019156965A (ja) 2018-03-13 2019-09-19 ナミックス株式会社 エポキシ樹脂組成物
JP7226899B2 (ja) 2018-04-27 2023-02-21 ラピスセミコンダクタ株式会社 電子機器及び配線基板
KR102271763B1 (ko) * 2020-02-18 2021-07-01 한국기술교육대학교 산학협력단 열경화성 급속 경화 접착제 조성물
JPWO2022210261A1 (fr) * 2021-03-30 2022-10-06

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008001867A (ja) 2006-06-26 2008-01-10 Three Bond Co Ltd 硬化性樹脂組成物
WO2012164869A1 (fr) 2011-05-31 2012-12-06 日油株式会社 Composition de résine durcissable
JP2014141621A (ja) 2013-01-25 2014-08-07 Toyo Ink Sc Holdings Co Ltd 紫外線硬化性組成物
JP2017101112A (ja) 2015-11-30 2017-06-08 味の素株式会社 光および熱硬化性樹脂組成物
JP2018095829A (ja) 2016-12-09 2018-06-21 日油株式会社 粘着剤組成物、及びこれを用いた積層体
WO2021033329A1 (fr) 2019-08-21 2021-02-25 ナミックス株式会社 Composition de résine époxy
JP2021075698A (ja) 2019-10-31 2021-05-20 味の素株式会社 硬化性組成物

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WO2024089905A1 (fr) 2024-05-02
JP2024064648A (ja) 2024-05-14

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