JP7212209B1 - 温度センサ、組付体、回転電機、および温度センサの製造方法 - Google Patents

温度センサ、組付体、回転電機、および温度センサの製造方法 Download PDF

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Publication number
JP7212209B1
JP7212209B1 JP2022548407A JP2022548407A JP7212209B1 JP 7212209 B1 JP7212209 B1 JP 7212209B1 JP 2022548407 A JP2022548407 A JP 2022548407A JP 2022548407 A JP2022548407 A JP 2022548407A JP 7212209 B1 JP7212209 B1 JP 7212209B1
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Japan
Prior art keywords
coil
pair
temperature sensor
extending
coil element
Prior art date
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Active
Application number
JP2022548407A
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English (en)
Japanese (ja)
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JPWO2023166650A5 (enrdf_load_stackoverflow
JPWO2023166650A1 (enrdf_load_stackoverflow
Inventor
孝正 吉原
雅典 桐原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Electronics Co Ltd
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Shibaura Electronics Co Ltd
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Publication date
Application filed by Shibaura Electronics Co Ltd filed Critical Shibaura Electronics Co Ltd
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Publication of JPWO2023166650A1 publication Critical patent/JPWO2023166650A1/ja
Publication of JPWO2023166650A5 publication Critical patent/JPWO2023166650A5/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/20—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for measuring, monitoring, testing, protecting or switching
    • H02K11/25—Devices for sensing temperature, or actuated thereby

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
JP2022548407A 2022-03-03 2022-03-03 温度センサ、組付体、回転電機、および温度センサの製造方法 Active JP7212209B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/009093 WO2023166650A1 (ja) 2022-03-03 2022-03-03 温度センサ、組付体、回転電機、および温度センサの製造方法

Publications (3)

Publication Number Publication Date
JP7212209B1 true JP7212209B1 (ja) 2023-01-24
JPWO2023166650A1 JPWO2023166650A1 (enrdf_load_stackoverflow) 2023-09-07
JPWO2023166650A5 JPWO2023166650A5 (enrdf_load_stackoverflow) 2024-02-06

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ID=84982675

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JP2022548407A Active JP7212209B1 (ja) 2022-03-03 2022-03-03 温度センサ、組付体、回転電機、および温度センサの製造方法

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JP (1) JP7212209B1 (enrdf_load_stackoverflow)
CN (1) CN116249881A (enrdf_load_stackoverflow)
WO (1) WO2023166650A1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024142573A (ja) * 2023-03-30 2024-10-11 本田技研工業株式会社 サーミスタ取付構造およびサーミスタユニット

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55155936U (enrdf_load_stackoverflow) * 1979-04-25 1980-11-10
JPH08292106A (ja) * 1995-04-25 1996-11-05 Nippondenso Co Ltd 温度センサ
JP2011033531A (ja) * 2009-08-04 2011-02-17 Mitsubishi Electric Corp 温度センサ一体型圧力センサ装置
WO2021070898A1 (ja) * 2019-10-10 2021-04-15 株式会社芝浦電子 温度センサおよび電動機

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018167903A1 (ja) * 2017-03-16 2018-09-20 株式会社芝浦電子 温度センサ
CN111316079B (zh) * 2018-08-02 2024-01-30 株式会社芝浦电子 温度检测装置和组装体
JP6712302B2 (ja) * 2018-10-10 2020-06-17 株式会社芝浦電子 温度検出装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55155936U (enrdf_load_stackoverflow) * 1979-04-25 1980-11-10
JPH08292106A (ja) * 1995-04-25 1996-11-05 Nippondenso Co Ltd 温度センサ
JP2011033531A (ja) * 2009-08-04 2011-02-17 Mitsubishi Electric Corp 温度センサ一体型圧力センサ装置
WO2021070898A1 (ja) * 2019-10-10 2021-04-15 株式会社芝浦電子 温度センサおよび電動機

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024142573A (ja) * 2023-03-30 2024-10-11 本田技研工業株式会社 サーミスタ取付構造およびサーミスタユニット
JP7638317B2 (ja) 2023-03-30 2025-03-03 本田技研工業株式会社 サーミスタ取付構造およびサーミスタユニット

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Publication number Publication date
CN116249881A (zh) 2023-06-09
WO2023166650A1 (ja) 2023-09-07
JPWO2023166650A1 (enrdf_load_stackoverflow) 2023-09-07

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