JP7207560B2 - 熱流センサおよび熱流計測システム - Google Patents

熱流センサおよび熱流計測システム Download PDF

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Publication number
JP7207560B2
JP7207560B2 JP2021548039A JP2021548039A JP7207560B2 JP 7207560 B2 JP7207560 B2 JP 7207560B2 JP 2021548039 A JP2021548039 A JP 2021548039A JP 2021548039 A JP2021548039 A JP 2021548039A JP 7207560 B2 JP7207560 B2 JP 7207560B2
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heat flow
layer
magnetic field
field applying
flow detection
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Japanese (ja)
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JPWO2021059391A5 (https=
JPWO2021059391A1 (https=
Inventor
明宏 桐原
真彦 石田
悠真 岩崎
康智 大森
浩子 染谷
貞則 服部
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NEC Corp
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NEC Corp
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K17/00Measuring quantity of heat
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/36Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using magnetic elements, e.g. magnets, coils
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K17/00Measuring quantity of heat
    • G01K17/06Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Measuring Volume Flow (AREA)
  • Measuring Magnetic Variables (AREA)
JP2021548039A 2019-09-25 2019-09-25 熱流センサおよび熱流計測システム Active JP7207560B2 (ja)

Applications Claiming Priority (1)

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PCT/JP2019/037557 WO2021059391A1 (ja) 2019-09-25 2019-09-25 熱流センサ

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JPWO2021059391A1 JPWO2021059391A1 (https=) 2021-04-01
JPWO2021059391A5 JPWO2021059391A5 (https=) 2022-03-14
JP7207560B2 true JP7207560B2 (ja) 2023-01-18

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JP2021548039A Active JP7207560B2 (ja) 2019-09-25 2019-09-25 熱流センサおよび熱流計測システム

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US (1) US12352637B2 (https=)
JP (1) JP7207560B2 (https=)
WO (1) WO2021059391A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022165185A (ja) * 2021-04-19 2022-10-31 国立大学法人 東京大学 センサ素子及びセンサ装置
US12474223B2 (en) 2021-09-24 2025-11-18 Apple Inc. Temperature sensing systems and methods including multiple temperature sensors
US20230099638A1 (en) * 2021-09-24 2023-03-30 Apple Inc. System and method for temperature sensing using thermopile integrated with rigid printed circuit board
US20260107687A1 (en) * 2022-09-29 2026-04-16 Nitto Denko Corporation Thermoelectric conversion element and sensor
WO2024143143A1 (ja) * 2022-12-27 2024-07-04 TopoLogic株式会社 熱流測定装置及び熱流測定方法
CN120419341A (zh) * 2022-12-27 2025-08-01 拓扑逻辑株式会社 信号处理方法、信号处理系统以及信号处理程序
EP4727320A1 (en) * 2023-06-08 2026-04-15 Topologic Inc. Semiconductor module, abnormality determination system, and abnormality determination method
WO2025094582A1 (ja) * 2023-10-30 2025-05-08 TopoLogic株式会社 計測システム及びウエハの温度分布の調整方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019009308A1 (ja) 2017-07-03 2019-01-10 国立大学法人東京大学 熱電変換素子及び熱電変換デバイス

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000067416A (ja) * 1998-08-21 2000-03-03 Read Rite Smi Kk 磁気ヘッドの製造方法、並びに、スピンバルブ磁気ヘッドの特性安定化方法及び装置
JP6079995B2 (ja) 2012-09-28 2017-02-15 国立大学法人東北大学 熱電発電デバイス
JP6791116B2 (ja) * 2015-02-26 2020-11-25 日本電気株式会社 スピン流−電流変換構造、それを用いた熱電変換素子、およびその製造方法
JP6819549B2 (ja) 2017-11-16 2021-01-27 株式会社デンソー 熱流束センサおよび熱量計測装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019009308A1 (ja) 2017-07-03 2019-01-10 国立大学法人東京大学 熱電変換素子及び熱電変換デバイス

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US12352637B2 (en) 2025-07-08
WO2021059391A1 (ja) 2021-04-01
US20220326094A1 (en) 2022-10-13
JPWO2021059391A1 (https=) 2021-04-01

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