JPWO2021059391A5 - - Google Patents
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- Publication number
- JPWO2021059391A5 JPWO2021059391A5 JP2021548039A JP2021548039A JPWO2021059391A5 JP WO2021059391 A5 JPWO2021059391 A5 JP WO2021059391A5 JP 2021548039 A JP2021548039 A JP 2021548039A JP 2021548039 A JP2021548039 A JP 2021548039A JP WO2021059391 A5 JPWO2021059391 A5 JP WO2021059391A5
- Authority
- JP
- Japan
- Prior art keywords
- heat flow
- magnetic field
- field application
- layer
- application layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001514 detection method Methods 0.000 claims 13
- 239000004020 conductor Substances 0.000 claims 9
- 239000000696 magnetic material Substances 0.000 claims 8
- 238000009413 insulation Methods 0.000 claims 1
- 238000005259 measurement Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2019/037557 WO2021059391A1 (ja) | 2019-09-25 | 2019-09-25 | 熱流センサ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021059391A1 JPWO2021059391A1 (https=) | 2021-04-01 |
| JPWO2021059391A5 true JPWO2021059391A5 (https=) | 2022-03-14 |
| JP7207560B2 JP7207560B2 (ja) | 2023-01-18 |
Family
ID=75164886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021548039A Active JP7207560B2 (ja) | 2019-09-25 | 2019-09-25 | 熱流センサおよび熱流計測システム |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US12352637B2 (https=) |
| JP (1) | JP7207560B2 (https=) |
| WO (1) | WO2021059391A1 (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022165185A (ja) * | 2021-04-19 | 2022-10-31 | 国立大学法人 東京大学 | センサ素子及びセンサ装置 |
| US12474223B2 (en) | 2021-09-24 | 2025-11-18 | Apple Inc. | Temperature sensing systems and methods including multiple temperature sensors |
| US20230099638A1 (en) * | 2021-09-24 | 2023-03-30 | Apple Inc. | System and method for temperature sensing using thermopile integrated with rigid printed circuit board |
| US20260107687A1 (en) * | 2022-09-29 | 2026-04-16 | Nitto Denko Corporation | Thermoelectric conversion element and sensor |
| WO2024143143A1 (ja) * | 2022-12-27 | 2024-07-04 | ＴｏｐｏＬｏｇｉｃ株式会社 | 熱流測定装置及び熱流測定方法 |
| CN120419341A (zh) * | 2022-12-27 | 2025-08-01 | 拓扑逻辑株式会社 | 信号处理方法、信号处理系统以及信号处理程序 |
| EP4727320A1 (en) * | 2023-06-08 | 2026-04-15 | Topologic Inc. | Semiconductor module, abnormality determination system, and abnormality determination method |
| WO2025094582A1 (ja) * | 2023-10-30 | 2025-05-08 | ＴｏｐｏＬｏｇｉｃ株式会社 | 計測システム及びウエハの温度分布の調整方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000067416A (ja) * | 1998-08-21 | 2000-03-03 | Read Rite Smi Kk | 磁気ヘッドの製造方法、並びに、スピンバルブ磁気ヘッドの特性安定化方法及び装置 |
| JP6079995B2 (ja) | 2012-09-28 | 2017-02-15 | 国立大学法人東北大学 | 熱電発電デバイス |
| JP6791116B2 (ja) * | 2015-02-26 | 2020-11-25 | 日本電気株式会社 | スピン流−電流変換構造、それを用いた熱電変換素子、およびその製造方法 |
| WO2019009308A1 (ja) * | 2017-07-03 | 2019-01-10 | 国立大学法人東京大学 | 熱電変換素子及び熱電変換デバイス |
| JP6819549B2 (ja) | 2017-11-16 | 2021-01-27 | 株式会社デンソー | 熱流束センサおよび熱量計測装置 |
-
2019
- 2019-09-25 US US17/641,897 patent/US12352637B2/en active Active
- 2019-09-25 JP JP2021548039A patent/JP7207560B2/ja active Active
- 2019-09-25 WO PCT/JP2019/037557 patent/WO2021059391A1/ja not_active Ceased
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