JP7197055B2 - 酸基含有（メタ）アクリレート樹脂、硬化性樹脂組成物、絶縁材料、ソルダーレジスト用樹脂材料及びレジスト部材 - Google Patents

酸基含有（メタ）アクリレート樹脂、硬化性樹脂組成物、絶縁材料、ソルダーレジスト用樹脂材料及びレジスト部材 Download PDF

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JP7197055B2
JP7197055B2 JP2022512803A JP2022512803A JP7197055B2 JP 7197055 B2 JP7197055 B2 JP 7197055B2 JP 2022512803 A JP2022512803 A JP 2022512803A JP 2022512803 A JP2022512803 A JP 2022512803A JP 7197055 B2 JP7197055 B2 JP 7197055B2
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JPWO2021220922A5 (https=
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駿介 山田
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DIC Corp
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DIC Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/38—Polymerisation using regulators, e.g. chain terminating agents, e.g. telomerisation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/12—Polymers provided for in subclasses C08C or C08F
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/14—Esterification
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2022512803A 2020-05-01 2021-04-22 酸基含有（メタ）アクリレート樹脂、硬化性樹脂組成物、絶縁材料、ソルダーレジスト用樹脂材料及びレジスト部材 Active JP7197055B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020081120 2020-05-01
JP2020081120 2020-05-01
PCT/JP2021/016236 WO2021220922A1 (ja) 2020-05-01 2021-04-22 酸基含有（メタ）アクリレート樹脂、硬化性樹脂組成物、絶縁材料、ソルダーレジスト用樹脂材料及びレジスト部材

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JPWO2021220922A1 JPWO2021220922A1 (https=) 2021-11-04
JPWO2021220922A5 JPWO2021220922A5 (https=) 2022-06-16
JP7197055B2 true JP7197055B2 (ja) 2022-12-27

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JP2022512803A Active JP7197055B2 (ja) 2020-05-01 2021-04-22 酸基含有（メタ）アクリレート樹脂、硬化性樹脂組成物、絶縁材料、ソルダーレジスト用樹脂材料及びレジスト部材

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JP (1) JP7197055B2 (https=)
KR (1) KR20230004556A (https=)
CN (1) CN115461381A (https=)
WO (1) WO2021220922A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012198527A (ja) 2011-03-04 2012-10-18 Toyo Ink Sc Holdings Co Ltd 感光性組成物
JP2012211975A (ja) 2011-03-31 2012-11-01 Toyo Ink Sc Holdings Co Ltd カラーフィルタ用着色組成物、及びそれを用いたカラーフィルタ
JP2013182174A (ja) 2012-03-02 2013-09-12 Toyo Ink Sc Holdings Co Ltd 感光性樹脂組成物
JP2013210405A (ja) 2012-03-30 2013-10-10 Toyo Ink Sc Holdings Co Ltd 感光性樹脂組成物
JP2014118418A (ja) 2012-12-13 2014-06-30 Nagase Chemtex Corp シルセスキオキサン誘導体、それを用いたネガ型感光性樹脂組成物
JP2014210892A (ja) 2013-04-22 2014-11-13 昭和電工株式会社 （メタ）アクリレート系ポリマー、該ポリマーを含む組成物及びその用途
JP2016149388A (ja) 2015-02-10 2016-08-18 東洋インキＳｃホールディングス株式会社 電磁波シールドフィルム付き回路基板、およびその製造方法
JP2020027215A (ja) 2018-08-16 2020-02-20 東洋インキＳｃホールディングス株式会社 カラーフィルタ用着色組成物、カラーフィルタ

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3543409B2 (ja) 1995-03-24 2004-07-14 大日本インキ化学工業株式会社 活性エネルギ−線硬化型エポキシアクリレ−ト樹脂組成物
JP2012215833A (ja) * 2011-03-31 2012-11-08 Toyo Ink Sc Holdings Co Ltd 感光性樹脂組成物およびタッチパネル用絶縁膜
JP6028360B2 (ja) * 2011-06-29 2016-11-16 東洋インキＳｃホールディングス株式会社 感光性樹脂組成物とその硬化物、及び感光性樹脂の製造方法
JP2013076833A (ja) * 2011-09-30 2013-04-25 Toyo Ink Sc Holdings Co Ltd 感光性樹脂組成物とその硬化物、及び感光性樹脂の製造方法
JP2013137373A (ja) * 2011-12-28 2013-07-11 Toyo Ink Sc Holdings Co Ltd 感光性樹脂組成物とその硬化物、及び感光性樹脂の製造方法
JP2014130417A (ja) * 2012-12-28 2014-07-10 Toppan Printing Co Ltd タッチパネル用前面板、及び、これを備えた一体型センサー基板並びに表示装置
JP6259240B2 (ja) * 2013-09-30 2018-01-10 昭和電工株式会社 感光性樹脂の製造方法及びカラーフィルターの製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012198527A (ja) 2011-03-04 2012-10-18 Toyo Ink Sc Holdings Co Ltd 感光性組成物
JP2012211975A (ja) 2011-03-31 2012-11-01 Toyo Ink Sc Holdings Co Ltd カラーフィルタ用着色組成物、及びそれを用いたカラーフィルタ
JP2013182174A (ja) 2012-03-02 2013-09-12 Toyo Ink Sc Holdings Co Ltd 感光性樹脂組成物
JP2013210405A (ja) 2012-03-30 2013-10-10 Toyo Ink Sc Holdings Co Ltd 感光性樹脂組成物
JP2014118418A (ja) 2012-12-13 2014-06-30 Nagase Chemtex Corp シルセスキオキサン誘導体、それを用いたネガ型感光性樹脂組成物
JP2014210892A (ja) 2013-04-22 2014-11-13 昭和電工株式会社 （メタ）アクリレート系ポリマー、該ポリマーを含む組成物及びその用途
JP2016149388A (ja) 2015-02-10 2016-08-18 東洋インキＳｃホールディングス株式会社 電磁波シールドフィルム付き回路基板、およびその製造方法
JP2020027215A (ja) 2018-08-16 2020-02-20 東洋インキＳｃホールディングス株式会社 カラーフィルタ用着色組成物、カラーフィルタ

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WO2021220922A1 (ja) 2021-11-04
CN115461381A (zh) 2022-12-09
JPWO2021220922A1 (https=) 2021-11-04
KR20230004556A (ko) 2023-01-06

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