JP7197053B2 - 半導体装置および半導体装置の製造方法 - Google Patents
半導体装置および半導体装置の製造方法 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims description 115
- 238000000034 method Methods 0.000 title claims description 23
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 239000000758 substrate Substances 0.000 claims description 75
- 229910052751 metal Inorganic materials 0.000 claims description 61
- 239000002184 metal Substances 0.000 claims description 61
- 239000000463 material Substances 0.000 claims description 18
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 251
- 230000015572 biosynthetic process Effects 0.000 description 13
- 238000000231 atomic layer deposition Methods 0.000 description 10
- 230000006866 deterioration Effects 0.000 description 7
- 239000012790 adhesive layer Substances 0.000 description 4
- 230000003749 cleanliness Effects 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical group C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
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- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
- H01L21/76879—Filling of holes, grooves or trenches, e.g. vias, with conductive material by selective deposition of conductive material in the vias, e.g. selective C.V.D. on semiconductor material, plating
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45527—Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations
- C23C16/45529—Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations specially adapted for making a layer stack of alternating different compositions or gradient compositions
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76871—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers
- H01L21/76876—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers for deposition from the gas phase, e.g. CVD
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
- H01L23/53242—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being a noble metal, e.g. gold
- H01L23/53252—Additional layers associated with noble-metal layers, e.g. adhesion, barrier, cladding layers
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
- H01L21/76846—Layer combinations
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Description
実施の形態1に係る半導体装置の構成を説明する。実施の形態1に係る半導体装置は図1に示した半導体装置10である。図1は半導体装置10の断面図である。
実施の形態2に係る半導体装置について説明する。実施の形態2に係る半導体装置は、バイアホールが形成された半導体基板を有する点が、実施の形態1の半導体装置10と異なる。ここではこの点も含め、主に実施の形態1との違いを記載する。
12,52 半導体基板
14,54 第1の表面
16,56 第2の表面
18,58 密着層
20,60 第1の層
22,62 第2の層
24,64 金属層
66 電極
68 バイアホール
70 面
72 側面
Claims (5)
- 互いに対向する第1の面と第2の面を有する半導体基板と、
前記第1の面の上に順に、どちらも導電性を有する第1の層と第2の層が交互に同数積層された密着層と
前記密着層の上に形成された金属層と、を備え、
前記第1の層は、前記半導体基板を構成する元素を含む材料から成り、
前記第2の層は前記第1の層より、前記金属層との密着性が高く、
前記密着層は、前記第1の層および前記第2の層を合わせて4層以上有し、
前記密着層を構成する前記第1の層および前記第2の層の中では、前記金属層に接する前記第2の層を除くと前記半導体基板に接する前記第1の層の膜厚が最も厚く、前記半導体基板に接する前記第1の層を除くと前記金属層に接する前記第2の層の膜厚が最も厚く、
前記半導体基板はSiCから成り、
前記金属層はAuから成り、
前記第1の層はSiまたはWSiから成り、
前記第2の層はTiまたはNiから成る半導体装置。 - 前記半導体基板に接する前記第1の層および前記金属層に接する前記第2の層は、どちらも膜厚が10nm以上である請求項1に記載の半導体装置。
- 前記半導体基板には、前記第1の面から前記第2の面まで貫通するバイアホールが設けられ、
前記第2の面に、前記バイアホールを覆う電極が設けられ、
前記密着層は、前記電極の前記バイアホールに臨む面、前記バイアホールの側面および前記第1の面の上に形成された請求項1または2に記載の半導体装置。 - 半導体基板の上に順に、どちらも導電性を有する第1の層と第2の層を交互に同数成膜する第1の工程と、
前記第1の工程で最後に成膜した前記第2の層の上に金属層を形成する第2の工程と、を備え、
前記第1の層は、前記半導体基板を構成する元素を含む材料から成り、
前記第2の層は前記第1の層より、前記金属層との密着性が高く、
前記第1の工程では、前記第1の層および前記第2の層を合わせて4層以上、ALD法を用いて、同一チャンバ内で連続して成膜し、
前記第1の工程で成膜した前記第1の層および前記第2の層の中では、前記金属層に接する前記第2の層を除くと前記半導体基板に接する前記第1の層の膜厚が最も厚く、前記半導体基板に接する前記第1の層を除くと前記金属層に接する前記第2の層の膜厚が最も厚く
前記半導体基板はSiCから成り、
前記金属層はAuから成り、
前記第1の層はSiまたはWSiから成り、
前記第2の層はTiまたはNiから成る半導体装置の製造方法。 - 前記第1の工程と前記第2の工程の間に、前記第1の工程で前記第1の層と前記第2の層を成膜する際の成膜上限温度より高い温度で熱処理する工程を備えた請求項4に記載の半導体装置の製造方法。
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2006086183A (ja) | 2004-09-14 | 2006-03-30 | Shindengen Electric Mfg Co Ltd | SiC半導体装置およびSiC半導体装置の製造方法 |
JP2006202883A (ja) | 2005-01-19 | 2006-08-03 | Shindengen Electric Mfg Co Ltd | 半導体装置および半導体装置の製造方法 |
JP2015070026A (ja) | 2013-09-27 | 2015-04-13 | 豊田合成株式会社 | 半導体装置およびその製造方法 |
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JPH06151355A (ja) * | 1992-10-30 | 1994-05-31 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2006086183A (ja) | 2004-09-14 | 2006-03-30 | Shindengen Electric Mfg Co Ltd | SiC半導体装置およびSiC半導体装置の製造方法 |
JP2006202883A (ja) | 2005-01-19 | 2006-08-03 | Shindengen Electric Mfg Co Ltd | 半導体装置および半導体装置の製造方法 |
JP2015070026A (ja) | 2013-09-27 | 2015-04-13 | 豊田合成株式会社 | 半導体装置およびその製造方法 |
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CN115244665A (zh) | 2022-10-25 |
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JPWO2021186503A1 (ja) | 2021-09-23 |
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