JP7183377B1 - ポリイミド系樹脂 - Google Patents

ポリイミド系樹脂 Download PDF

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Publication number
JP7183377B1
JP7183377B1 JP2021192532A JP2021192532A JP7183377B1 JP 7183377 B1 JP7183377 B1 JP 7183377B1 JP 2021192532 A JP2021192532 A JP 2021192532A JP 2021192532 A JP2021192532 A JP 2021192532A JP 7183377 B1 JP7183377 B1 JP 7183377B1
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Japan
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structural unit
formula
derived
group
film
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JP2021192532A
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English (en)
Japanese (ja)
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JP2023079092A (ja
Inventor
洋行 塚田
勇輔 小沼
敦弘 高田
裕太 高岡
皓史 宮本
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Sumitomo Chemical Co Ltd
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Sumitomo Chemical Co Ltd
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=84321887&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP7183377(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Sumitomo Chemical Co Ltd filed Critical Sumitomo Chemical Co Ltd
Priority to JP2021192532A priority Critical patent/JP7183377B1/ja
Priority to JP2022186762A priority patent/JP2023079194A/ja
Priority to KR1020220159470A priority patent/KR20230078554A/ko
Priority to TW111144995A priority patent/TW202337958A/zh
Priority to CN202211483429.1A priority patent/CN116178711A/zh
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Publication of JP7183377B1 publication Critical patent/JP7183377B1/ja
Publication of JP2023079092A publication Critical patent/JP2023079092A/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
    • B32B2379/08—Polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2021192532A 2021-11-26 2021-11-26 ポリイミド系樹脂 Active JP7183377B1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2021192532A JP7183377B1 (ja) 2021-11-26 2021-11-26 ポリイミド系樹脂
JP2022186762A JP2023079194A (ja) 2021-11-26 2022-11-22 ポリイミド系樹脂
KR1020220159470A KR20230078554A (ko) 2021-11-26 2022-11-24 폴리이미드계 수지
TW111144995A TW202337958A (zh) 2021-11-26 2022-11-24 聚醯亞胺系樹脂
CN202211483429.1A CN116178711A (zh) 2021-11-26 2022-11-24 聚酰亚胺系树脂

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021192532A JP7183377B1 (ja) 2021-11-26 2021-11-26 ポリイミド系樹脂

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022186762A Division JP2023079194A (ja) 2021-11-26 2022-11-22 ポリイミド系樹脂

Publications (2)

Publication Number Publication Date
JP7183377B1 true JP7183377B1 (ja) 2022-12-05
JP2023079092A JP2023079092A (ja) 2023-06-07

Family

ID=84321887

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021192532A Active JP7183377B1 (ja) 2021-11-26 2021-11-26 ポリイミド系樹脂
JP2022186762A Pending JP2023079194A (ja) 2021-11-26 2022-11-22 ポリイミド系樹脂

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022186762A Pending JP2023079194A (ja) 2021-11-26 2022-11-22 ポリイミド系樹脂

Country Status (4)

Country Link
JP (2) JP7183377B1 (https=)
KR (1) KR20230078554A (https=)
CN (1) CN116178711A (https=)
TW (1) TW202337958A (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005146025A (ja) 2003-11-11 2005-06-09 Kaneka Corp 接着フィルム及びそれから得られるフレキシブル金属張積層板
JP2014208793A (ja) 2013-03-29 2014-11-06 住友電気工業株式会社 ポリイミド前駆体樹脂組成物、ポリイミド樹脂膜、フレキシブルプリント配線板、回路付きサスペンション及びハードディスクドライブ
CN106543720A (zh) 2016-10-27 2017-03-29 武汉依麦德新材料科技有限责任公司 一种低热膨胀系数的聚酰亚胺薄膜及其制备方法
CN112375221A (zh) 2020-11-27 2021-02-19 桂林电器科学研究院有限公司 一种低介电性聚酰亚胺复合薄膜及其制备方法
CN112409621A (zh) 2020-11-27 2021-02-26 桂林电器科学研究院有限公司 高强度低介电性聚酰亚胺多层膜及其制备方法
CN112940316A (zh) 2021-02-19 2021-06-11 北京八亿时空液晶科技股份有限公司 一种聚酰亚胺薄膜及其制备方法与应用

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021161285A (ja) 2020-03-31 2021-10-11 株式会社大阪ソーダ ポリイミド系接着剤
JP7714391B2 (ja) * 2021-06-30 2025-07-29 日鉄ケミカル＆マテリアル株式会社 ポリアミド酸、ポリイミド、ポリイミドフィルム、金属張積層板及び回路基板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005146025A (ja) 2003-11-11 2005-06-09 Kaneka Corp 接着フィルム及びそれから得られるフレキシブル金属張積層板
JP2014208793A (ja) 2013-03-29 2014-11-06 住友電気工業株式会社 ポリイミド前駆体樹脂組成物、ポリイミド樹脂膜、フレキシブルプリント配線板、回路付きサスペンション及びハードディスクドライブ
CN106543720A (zh) 2016-10-27 2017-03-29 武汉依麦德新材料科技有限责任公司 一种低热膨胀系数的聚酰亚胺薄膜及其制备方法
CN112375221A (zh) 2020-11-27 2021-02-19 桂林电器科学研究院有限公司 一种低介电性聚酰亚胺复合薄膜及其制备方法
CN112409621A (zh) 2020-11-27 2021-02-26 桂林电器科学研究院有限公司 高强度低介电性聚酰亚胺多层膜及其制备方法
CN112940316A (zh) 2021-02-19 2021-06-11 北京八亿时空液晶科技股份有限公司 一种聚酰亚胺薄膜及其制备方法与应用

Also Published As

Publication number Publication date
TW202337958A (zh) 2023-10-01
KR20230078554A (ko) 2023-06-02
JP2023079092A (ja) 2023-06-07
CN116178711A (zh) 2023-05-30
JP2023079194A (ja) 2023-06-07

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