TW202337958A - 聚醯亞胺系樹脂 - Google Patents
聚醯亞胺系樹脂 Download PDFInfo
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- TW202337958A TW202337958A TW111144995A TW111144995A TW202337958A TW 202337958 A TW202337958 A TW 202337958A TW 111144995 A TW111144995 A TW 111144995A TW 111144995 A TW111144995 A TW 111144995A TW 202337958 A TW202337958 A TW 202337958A
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- 239000009719 polyimide resin Substances 0.000 title claims abstract description 20
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims abstract description 55
- 150000004985 diamines Chemical class 0.000 claims abstract description 44
- 235000010290 biphenyl Nutrition 0.000 claims abstract description 28
- 239000004305 biphenyl Substances 0.000 claims abstract description 28
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- -1 tetracarboxylic anhydride Chemical class 0.000 claims description 110
- 239000002243 precursor Substances 0.000 claims description 86
- 125000005843 halogen group Chemical group 0.000 claims description 78
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- 238000010438 heat treatment Methods 0.000 claims description 19
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Classifications
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- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
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- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
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- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C—CHEMISTRY; METALLURGY
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G73/1075—Partially aromatic polyimides
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
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- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Landscapes
- Chemical & Material Sciences (AREA)
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- Health & Medical Sciences (AREA)
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- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Laminated Bodies (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
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| CN106543720B (zh) | 2016-10-27 | 2019-08-23 | 武汉依麦德新材料科技有限责任公司 | 一种低热膨胀系数的聚酰亚胺薄膜及其制备方法 |
| JP2021161285A (ja) | 2020-03-31 | 2021-10-11 | 株式会社大阪ソーダ | ポリイミド系接着剤 |
| CN112375221B (zh) | 2020-11-27 | 2023-05-02 | 桂林电器科学研究院有限公司 | 一种低介电性聚酰亚胺复合薄膜及其制备方法 |
| CN112409621B (zh) | 2020-11-27 | 2022-09-09 | 桂林电器科学研究院有限公司 | 高强度低介电性聚酰亚胺多层膜及其制备方法 |
| CN112940316B (zh) | 2021-02-19 | 2022-07-29 | 上海八亿时空先进材料有限公司 | 一种聚酰亚胺薄膜及其制备方法与应用 |
| JP7714391B2 (ja) * | 2021-06-30 | 2025-07-29 | 日鉄ケミカル&マテリアル株式会社 | ポリアミド酸、ポリイミド、ポリイミドフィルム、金属張積層板及び回路基板 |
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2021
- 2021-11-26 JP JP2021192532A patent/JP7183377B1/ja active Active
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2022
- 2022-11-22 JP JP2022186762A patent/JP2023079194A/ja active Pending
- 2022-11-24 CN CN202211483429.1A patent/CN116178711A/zh active Pending
- 2022-11-24 TW TW111144995A patent/TW202337958A/zh unknown
- 2022-11-24 KR KR1020220159470A patent/KR20230078554A/ko active Pending
Also Published As
| Publication number | Publication date |
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| JP7183377B1 (ja) | 2022-12-05 |
| KR20230078554A (ko) | 2023-06-02 |
| JP2023079092A (ja) | 2023-06-07 |
| CN116178711A (zh) | 2023-05-30 |
| JP2023079194A (ja) | 2023-06-07 |
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