JP7179862B2 - 複数の異なる誘電充填材を含む溶融加工可能な熱可塑性複合材 - Google Patents
複数の異なる誘電充填材を含む溶融加工可能な熱可塑性複合材 Download PDFInfo
- Publication number
- JP7179862B2 JP7179862B2 JP2020545117A JP2020545117A JP7179862B2 JP 7179862 B2 JP7179862 B2 JP 7179862B2 JP 2020545117 A JP2020545117 A JP 2020545117A JP 2020545117 A JP2020545117 A JP 2020545117A JP 7179862 B2 JP7179862 B2 JP 7179862B2
- Authority
- JP
- Japan
- Prior art keywords
- thermoplastic composite
- particle size
- thermoplastic
- melt
- volume
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/58—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising fillers only, e.g. particles, powder, beads, flakes, spheres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
- B29C70/882—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
- B33Y70/10—Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
- C08L23/0815—Copolymers of ethene with aliphatic 1-olefins
- C08L23/0823—Copolymers of ethene with aliphatic cyclic olefins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/06—Polystyrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/16—Condensation polymers of aldehydes or ketones with phenols only of ketones with phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/002—Inhomogeneous material in general
- H01B3/006—Other inhomogeneous material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/301—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen or carbon in the main chain of the macromolecule, not provided for in group H01B3/302
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/306—Polyimides or polyesterimides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
- H01B3/427—Polyethers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2071/00—Use of polyethers, e.g. PEEK, i.e. polyether-etherketone or PEK, i.e. polyetherketone or derivatives thereof, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2079/00—Use of polymers having nitrogen, with or without oxygen or carbon only, in the main chain, not provided for in groups B29K2061/00 - B29K2077/00, as moulding material
- B29K2079/08—PI, i.e. polyimides or derivatives thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2081/00—Use of polymers having sulfur, with or without nitrogen, oxygen or carbon only, in the main chain, as moulding material
- B29K2081/04—Polysulfides, e.g. PPS, i.e. polyphenylene sulfide or derivatives thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2081/00—Use of polymers having sulfur, with or without nitrogen, oxygen or carbon only, in the main chain, as moulding material
- B29K2081/06—PSU, i.e. polysulfones; PES, i.e. polyethersulfones or derivatives thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2101/00—Use of unspecified macromolecular compounds as moulding material
- B29K2101/12—Thermoplastic materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2223/00—Use of polyalkenes or derivatives thereof as reinforcement
- B29K2223/04—Polymers of ethylene
- B29K2223/06—PE, i.e. polyethylene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2505/00—Use of metals, their alloys or their compounds, as filler
- B29K2505/08—Transition metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2509/00—Use of inorganic materials not provided for in groups B29K2503/00 - B29K2507/00, as filler
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
- B29K2995/0006—Dielectric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3456—Antennas, e.g. radomes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/14—Polyamide-imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/54—Inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/66—Substances characterised by their function in the composition
- C08L2666/72—Fillers; Inorganic pigments; Reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0263—Details about a collection of particles
- H05K2201/0266—Size distribution
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Composite Materials (AREA)
- Inorganic Chemistry (AREA)
- Civil Engineering (AREA)
- Ceramic Engineering (AREA)
- Structural Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Description
一実施形態では、熱可塑性複合材は、熱可塑性ポリマーと、複数の異なる粒子サイズ分布を有する誘電性充填材であって、複数の異なる粒子サイズ分布の第1モードのピークは、複数の異なる粒子サイズ分布の第2モードのピークの少なくとも7倍である、誘電性充填材と、流動性改質剤とを含む。
熱可塑性複合材を含む物品には、アンテナ及びフィラメントが含まれ得る。
上記の特徴及び利点ならびに他の特徴及び利点は、以下の詳細な説明、図、及び特許請求の範囲から容易に明らかである。
実施例では、指定された特性を判定するために次の試験方法が使用された。
メルトフローレートは、ASTM D1238-13の手順Aに従って、2.16kgの負荷、400℃で測定された。
ノルボルネンとエチレンに由来する繰り返し単位を含んでなる環状オレフィンコポリマーと、様々な量の誘電性充填材とを含む熱可塑性複合材を準備し、表1に示した。表において、TiO2-3.5は3.5マイクロメートルの平均粒子サイズを有する二酸化チタンであり、TiO2-2.7は2.7マイクロメートルの平均粒子サイズを有する二酸化チタンであり、そしてTiO2-0.2は0.2マイクロメートルの平均粒子サイズを有する二酸化チタンである。
ノルボルネンとエチレンから誘導される繰り返し単位を含んでなる環状オレフィンコポリマーと、様々な量の誘電性充填材とを含む熱可塑性複合材を準備した。10GHzでの誘電率が様々な組成で決定され、結果を図1に示す。
ポリ(エーテルエーテルケトン)と様々な量の誘電性充填材とを含む熱可塑性複合材を調製した。様々な組成に対して10GHzでの誘電率を決定し、結果を図2に示す。
表2に示されるような充填材組成物を有する5つのポリ(エーテルエーテルケトン)組成物が調製された。充填材の相対量は、全充填材体積に基づく。充填材の総量は、組成物の総体積に対する値であり、23℃、10GHzでの誘電率が15になるように調整された。
表2は、複数の異なる充填材組成物を利用することにより、モールドへの組成物の流量を増加させることができ、モールドを100%充填するのに必要な圧力を低減できることを示している。例えば、2モードの粒子サイズ分布を有する二酸化チタンの実施例10,11は、大きな粒子サイズの二酸化チタンのみを含む実施例9と比較して流量が増加し、金型の100%を充填するために必要な充填圧力が、小粒子サイズの二酸化チタンのみを含む実施例12に比べて低下した。実施例12に関して、12.1以下の充填圧力では、組成物は溶融加工できず、射出成形できず、100%の充填を達成するために著しく高い充填圧力を必要とした。表2はまた、実施例10の組成物が実施例9~13のすべての中で最高の流量を有し、優れた流動性を有していることも示している。
態様1: 熱可塑性ポリマーと、複数の異なる粒子サイズ分布を有する誘電性充填材であって、複数の異なる粒子サイズ分布の第1モードのピークは、複数の異なる粒子サイズ分布の第2モードのピークの少なくとも7倍である誘電性充填材と、流動性改質剤とを含むことを要旨とする。
態様7: 液晶ポリマーが液晶ポリエステルを含む、態様6に記載の熱可塑性複合材を要旨とする。
態様10: 誘電性充填材がシリカを含む、上記の態様のいずれか1つ以上の熱可塑性複合材を要旨とする。
態様13: 態様11の熱可塑性複合材において、第1の複数の粒子及び第2の複数の粒子は二酸化チタンを含むことを要旨とする。
態様15: 第1のモードのピークが1~10マイクロメートルであり、第2のモードのピークが0.01~1マイクロメートルである、上記の態様のいずれか1つ以上の熱可塑性複合材を要旨とする。
態様21: 導電層が熱可塑性複合材の少なくとも片側に配置されている、態様20の物品を要旨とする。
態様24: 態様20~24のいずれか1つの物品の製造方法であって、態様1~19のいずれか1つ以上の態様の熱可塑性複合材を溶融形態で金型に射出する工程と、金型を冷却して物品を成形する工程とを備えることを要旨とする。
態様27: 例えばポリオレフィンを含む熱可塑性複合材において、49s-1の周波数、270℃の温度でASTM D3835に従って測定された測定された粘度が3,000Pa・s以下である、上記の態様のいずれか1つの熱可塑性複合材を要旨とする。
態様32: 1つのモードのみを有した誘電充填材のみを含む、対応する組成物と比較して、低い粘度、より滑らかな成形表面、及び延性破壊モードの少なくとも1つによって証明されるなど、成形性の改善が見られる、上記の態様のいずれかの熱可塑性複合材を要旨とする。
一般に、組成物、方法、及び物品は、代替的に、本明細書で開示される任意の成分、ステップ、又は構成要素を含む、それらからなる、又は本質的にそれらからなることができる。組成物、方法、及び物品は、追加的又は代替的に、請求項に係る発明の機能又は目的の達成に必要ではない任意の成分、工程、又は構成要素を欠く、又は実質的に含まないように処方、実施、又は製造することができる。
特定の実施形態が説明されてきたが、代替案、修正、変形、改善、及び現在予期されないか又は予想されない可能性のある実質的な等価物が、出願人又は他の当業者に生じ得る。したがって、提出され、修正される可能性がある添付の特許請求の範囲は、そのようなすべての代替、修正、変形、改良、及び実質的な同等物を包含することを意図している。
Claims (9)
- 溶融加工可能な熱可塑性複合材であって、
熱可塑性ポリマーと、
複数の異なる粒子サイズ分布を有する誘電性充填材であって、前記複数の異なる粒子サイズ分布の第1モードのピークの粒子サイズは、前記複数の異なる粒子サイズ分布の第2モードのピークの粒子サイズの少なくとも7倍であり、前記誘電性充填材はシリカを含んでなる、前記誘電性充填材と、
流動性改質剤とを含み、
前記第1モードのピークが1~10マイクロメートルであり、前記第2モードのピークが0.01~1マイクロメートルであり、
前記誘電性充填材は、第1の平均粒子サイズを有する第1の複数の粒子及び第2の平均粒子サイズを有する第2の複数の粒子を含み、前記第1の平均粒子サイズは前記第1モードのピークに対応し、前記第2の平均粒子サイズは前記第2モードのピークに対応し、
前記熱可塑性複合材は、前記熱可塑性複合材の総体積に対して、30~40体積%の前記第1の複数の粒子及び10~20体積%の前記第2の複数の粒子を含む、溶融加工可能な熱可塑性複合材。 - 前記熱可塑性複合材が、500MHz~10GHzで、5以上、好適には10~20、又は、500MHz~10GHzで15~25の誘電率を有し、誘電損失は500MHz~10GHzで0.007以下である、請求項1に記載の溶融加工可能な熱可塑性複合材。
- 前記熱可塑性ポリマーは、ポリ(アリール)エーテルケトン、ポリスルホン、ポリ(フェニレンスルフィド)、ポリ(エーテルイミド)、ポリ(アミドイミド)、フルオロポリマー、ポリオレフィン、又は上記のものの少なくとも1つを含む組み合わせを含み、
前記誘電性充填材は二酸化チタン及びチタン酸バリウムのうちの少なくとも一方をさらに含む、請求項1又は2に記載の溶融加工可能な熱可塑性複合材。 - 前記熱可塑性複合材は、前記熱可塑性複合材の総体積に対して30~50体積%の前記熱可塑性ポリマーを含み、
前記熱可塑性複合材は、前記熱可塑性複合材の総重量に対して50~70体積%の誘電性充填材を含む、請求項1~3のいずれか一項に記載の溶融加工可能な熱可塑性複合材。 - 前記複数の異なる粒子サイズ分布の前記第1モードのピークは、前記複数の異なる粒子サイズ分布の前記第2モードのピークの10~20倍である、請求項1~4のいずれか一項に記載の溶融加工可能な熱可塑性複合材。
- 前記流動性改質剤は、フルオロポリマー、シルセスキオキサン、又は上記のものの少なくとも1つを含む組み合わせを含む、請求項1~5のいずれか一項に記載の溶融加工可能な熱可塑性複合材。
- 請求項1~6の少なくともいずれか一項に記載の溶融加工可能な熱可塑性複合材を含んでなる物品。
- 前記物品はアンテナ、又は3D印刷用のフィラメント又は粉末である、請求項7に記載の物品。
- 請求項7又は8に記載の物品の製造方法であって、
前記溶融加工可能な熱可塑性複合材を溶融形態で金型に射出し、前記金型を冷却して物品を形成する工程、又は
前記溶融加工可能な熱可塑性複合材を溶融し付加製造システムを使用して層ごとに物品を印刷する工程、又は、
前記溶融加工可能な熱可塑性複合材の押出を行う工程を備える、方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862646406P | 2018-03-22 | 2018-03-22 | |
US62/646,406 | 2018-03-22 | ||
PCT/US2019/023120 WO2019183192A1 (en) | 2018-03-22 | 2019-03-20 | Melt processable thermoplastic composite comprising a multimodal dielectric filler |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2021516711A JP2021516711A (ja) | 2021-07-08 |
JPWO2019183192A5 JPWO2019183192A5 (ja) | 2022-09-30 |
JP7179862B2 true JP7179862B2 (ja) | 2022-11-29 |
Family
ID=66001372
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020545117A Active JP7179862B2 (ja) | 2018-03-22 | 2019-03-20 | 複数の異なる誘電充填材を含む溶融加工可能な熱可塑性複合材 |
Country Status (8)
Country | Link |
---|---|
US (1) | US11198263B2 (ja) |
JP (1) | JP7179862B2 (ja) |
KR (1) | KR102441151B1 (ja) |
CN (1) | CN111886659B (ja) |
DE (1) | DE112019001476T5 (ja) |
GB (2) | GB2586711A (ja) |
TW (1) | TWI779179B (ja) |
WO (1) | WO2019183192A1 (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111786102A (zh) | 2019-04-03 | 2020-10-16 | 莱尔德电子材料(深圳)有限公司 | 低介电、低损耗天线罩 |
GB201911130D0 (en) * | 2019-08-05 | 2019-09-18 | Qinetiq Ltd | MAterials and methods |
GB201911127D0 (en) * | 2019-08-05 | 2019-09-18 | Qinetiq Ltd | Materials and methods |
KR20220105642A (ko) * | 2019-11-22 | 2022-07-27 | 로저스코포레이션 | 조사를 통해 가교된 성형된 유전성 컴포넌트 및 이의 제조 방법 |
US11130296B1 (en) * | 2020-03-24 | 2021-09-28 | Prince Mohammad Bin Fahd University | Method of forming electrically and thermally conductive polyolefin-perovskite nanomaterial composites having increased dielectric permittivity and breakdown-induced electrical and thermal conduction pathways |
CN111320862A (zh) * | 2020-04-10 | 2020-06-23 | 上海恒什塑料技术有限公司 | 一种柔性电路板用薄膜及其制备方法 |
US20220184890A1 (en) * | 2020-12-11 | 2022-06-16 | Raven 3D, LLC | Systems and methods for three dimensional printing using microwave assisted deposition |
CN113136011A (zh) * | 2021-05-13 | 2021-07-20 | 东南大学 | 一种用于低损耗天线制造的3d打印树脂及其应用 |
CN113636850B (zh) * | 2021-08-31 | 2022-08-12 | 浙江锦诚新材料股份有限公司 | 一种刚玉-尖晶石窑口耐火浇注料及预制件的制备方法 |
EP4141058A1 (en) * | 2021-08-31 | 2023-03-01 | SHPP Global Technologies B.V. | High dielectric thermoplastic composition with ceramic titanate and the shaped article thereof |
TWM651069U (zh) * | 2021-09-29 | 2024-02-01 | 美商雷爾德科技有限公司 | 低介電、低損耗天線罩 |
WO2023055597A1 (en) * | 2021-09-29 | 2023-04-06 | Laird Technologies, Inc. | Low dielectric, low loss radomes, materials and methods for making low dielectric, low loss radomes |
CN116162361B (zh) * | 2021-11-25 | 2024-04-09 | 广东中塑新材料有限公司 | 低介电lcp树脂材料及其制备方法 |
US20230407181A1 (en) * | 2022-06-21 | 2023-12-21 | Ticona Llc | Liquid Crystalline Polymer Composition having a Low Dielectric Constant |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000510639A (ja) | 1996-05-07 | 2000-08-15 | ヘキスト・セラニーズ・コーポレーション | 温度安定性誘電率を有するポリマー組成物 |
WO2003044099A1 (de) | 2001-11-23 | 2003-05-30 | Deutsche Amphibolin-Werke Von Robert Murjahn Gmbh & Co. Kg | Beschichtungsmasse enthaltend nanopartikel, verwendung der beschichtungsmasse und verfahren zur herstellung von beschichtungen |
WO2004102589A1 (ja) | 2003-05-19 | 2004-11-25 | Hitachi Chemical Co., Ltd. | 絶縁材料、フィルム、回路基板及びこれらの製造方法 |
JP2008525550A (ja) | 2004-12-23 | 2008-07-17 | ソルヴェイ・ソレクシス・インコーポレイテッド | 熱可塑性ハロゲン化ポリマー組成物 |
JP2009122573A (ja) | 2007-11-19 | 2009-06-04 | Toray Ind Inc | 情報伝達配線接続装置またはその構成部品およびその製造方法 |
JP2011063699A (ja) | 2009-09-16 | 2011-03-31 | Jx Nippon Oil & Energy Corp | 液晶ポリエステル樹脂組成物の成形方法および成形体 |
JP2013072032A (ja) | 2011-09-28 | 2013-04-22 | Aron Kasei Co Ltd | 熱伝導性エラストマー組成物及び成形体 |
JP2013519756A (ja) | 2010-02-11 | 2013-05-30 | スリーエム イノベイティブ プロパティズ カンパニー | 分散多モード表面改質ナノ粒子を含む樹脂系 |
JP2014240134A (ja) | 2013-06-11 | 2014-12-25 | ポリプラスチックス株式会社 | 金属樹脂複合成形体及びその製造方法 |
JP2015074763A (ja) | 2013-10-11 | 2015-04-20 | パナソニックIpマネジメント株式会社 | 光反射体用成形材料、光反射体及び照明器具 |
Family Cites Families (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FI845161A0 (fi) | 1984-12-28 | 1984-12-28 | Ksv Chemicals Oy | Ytbehandlingsmedel. |
US5939193A (en) * | 1994-12-23 | 1999-08-17 | Rexam Graphics Inc. | Overhead transparency for color laser printers and copiers |
AU1022297A (en) | 1995-11-28 | 1997-06-19 | Hoechst Celanese Corporation | Poly(phenylene sulfide) composites having a high dielectric constant |
US5962122A (en) | 1995-11-28 | 1999-10-05 | Hoechst Celanese Corporation | Liquid crystalline polymer composites having high dielectric constant |
WO1998026431A1 (en) | 1996-12-13 | 1998-06-18 | Hoechst Celanese Corporation | Cyclic olefin polymer composites having a high dielectric constant |
WO1999054888A1 (fr) | 1998-04-16 | 1999-10-28 | Tdk Corporation | Composition a base d'un materiau dielectrique composite, film, substrat, composants electroniques et moulages faits avec cette composition |
EP1091915B1 (en) | 1998-05-29 | 2004-09-29 | Nokia Corporation | Composite injection mouldable material |
JP2001250423A (ja) | 2000-03-03 | 2001-09-14 | Achilles Corp | 耐熱性誘電発泡体 |
JP2001279014A (ja) | 2000-03-31 | 2001-10-10 | Achilles Corp | 改良された寸法安定性を有する誘電発泡成形品 |
AU2001276844A1 (en) | 2000-07-18 | 2002-01-30 | Cabot Corporation | Polymer matrix composites |
JP2002037667A (ja) | 2000-07-26 | 2002-02-06 | Philips Japan Ltd | 誘電体磁器組成物 |
JP3664094B2 (ja) | 2000-10-18 | 2005-06-22 | 株式会社村田製作所 | 複合誘電体成形物、その製造方法、およびそれを用いたレンズアンテナ |
EP1231637A3 (en) | 2001-02-08 | 2004-08-25 | Hitachi, Ltd. | High dielectric constant composite material and multilayer wiring board using the same |
WO2002088225A1 (en) | 2001-04-30 | 2002-11-07 | Georgia Tech Research Corporation | High dielectric polymer composites and methods of preparation thereof |
JP2003151352A (ja) | 2001-11-09 | 2003-05-23 | Tdk Corp | 複合誘電体材料、基板、基板の製造方法 |
JP4127995B2 (ja) | 2001-10-22 | 2008-07-30 | Tdk株式会社 | 複合誘電体材料および基板 |
JP4158893B2 (ja) | 2001-10-24 | 2008-10-01 | 古河電気工業株式会社 | 樹脂−セラミックス粉末複合材 |
JP4020000B2 (ja) | 2002-04-17 | 2007-12-12 | 株式会社村田製作所 | 複合誘電体材料、複合誘電体成形物、およびこれを用いたレンズアンテナ、並びにこれを用いた表面実装型アンテナ |
KR100467834B1 (ko) | 2002-12-23 | 2005-01-25 | 삼성전기주식회사 | 커패시터 내장형 인쇄회로기판 및 그 제조 방법 |
KR100455890B1 (ko) | 2002-12-24 | 2004-11-06 | 삼성전기주식회사 | 커패시터 내장형 인쇄회로기판 및 그 제조 방법 |
US7164197B2 (en) | 2003-06-19 | 2007-01-16 | 3M Innovative Properties Company | Dielectric composite material |
JP2005029700A (ja) | 2003-07-04 | 2005-02-03 | Tdk Corp | 複合誘電体、複合誘電体シート、複合誘電体ペースト、金属層付き複合誘電体シート、配線板及び多層配線板 |
JP2005126700A (ja) | 2003-09-30 | 2005-05-19 | Tdk Corp | 複合誘電体基板 |
US7026032B2 (en) | 2003-11-05 | 2006-04-11 | E. I. Du Pont De Nemours And Company | Polyimide based compositions useful as electronic substrates, derived in part from (micro-powder) fluoropolymer, and methods and compositions relating thereto |
US7557154B2 (en) | 2004-12-23 | 2009-07-07 | Sabic Innovative Plastics Ip B.V. | Polymer compositions, method of manufacture, and articles formed therefrom |
JP3767606B2 (ja) | 2004-02-25 | 2006-04-19 | 株式会社村田製作所 | 誘電体アンテナ |
JP4152920B2 (ja) * | 2004-06-02 | 2008-09-17 | 電気化学工業株式会社 | 窒化ホウ素粉末及びその用途 |
JP2006019198A (ja) | 2004-07-05 | 2006-01-19 | Matsushita Electric Ind Co Ltd | 高誘電体複合材料 |
JP2006019621A (ja) | 2004-07-05 | 2006-01-19 | Rikogaku Shinkokai | キャパシタ用ポリマーセラミックコンポジット材料、多層配線板及びモジュール基板 |
US20060258327A1 (en) | 2005-05-11 | 2006-11-16 | Baik-Woo Lee | Organic based dielectric materials and methods for minaturized RF components, and low temperature coefficient of permittivity composite devices having tailored filler materials |
JP2007009172A (ja) | 2005-05-31 | 2007-01-18 | Sekisui Chem Co Ltd | 高誘電性複合成形体 |
US8025814B2 (en) | 2008-06-23 | 2011-09-27 | Sumitomo Chemical Company, Limited | Resin composition and molded article using the same |
CN102100130B (zh) | 2008-07-18 | 2014-02-26 | 环球产权公司 | 电路材料、电路层合体及其制造方法 |
CN102186776B (zh) | 2008-09-05 | 2015-01-21 | 住友电气工业株式会社 | 含有陶瓷粉末的介电性复合材料、以及电介质天线 |
JP2010270271A (ja) | 2009-05-25 | 2010-12-02 | Nippon Zeon Co Ltd | 複合誘電セラミックス含有重合性組成物、樹脂成形体、積層体、及び誘電体デバイス |
JP2010270270A (ja) | 2009-05-25 | 2010-12-02 | Nippon Zeon Co Ltd | 複合誘電セラミックス含有重合性組成物、樹脂成形体、積層体、及び誘電体デバイス |
FR2955330B1 (fr) | 2010-01-19 | 2012-01-20 | Arkema France | Composition de poudre thermoplastique et objets tridimensionnels fabriques par frittage d'une telle composition |
CA2830269A1 (en) | 2011-03-23 | 2012-10-26 | The Curators Of The University Of Missouri | High dielectric constant composite materials and methods of manufacture |
EP2615133A1 (fr) * | 2012-01-12 | 2013-07-17 | Bruker Biospin (Société par Actions Simplifiée) | Matériau composite à conductivité améliorée, pièce formée à partir d'un tel matériau et applications |
JP6538337B2 (ja) * | 2014-12-08 | 2019-07-03 | 昭和電工株式会社 | 樹脂組成物及びその製造方法 |
US10020115B2 (en) | 2015-05-26 | 2018-07-10 | The Penn State Research Foundation | High temperature dielectric materials, method of manufacture thereof and articles comprising the same |
-
2019
- 2019-03-19 US US16/357,929 patent/US11198263B2/en active Active
- 2019-03-20 KR KR1020207024428A patent/KR102441151B1/ko active IP Right Grant
- 2019-03-20 DE DE112019001476.5T patent/DE112019001476T5/de not_active Ceased
- 2019-03-20 CN CN201980019619.8A patent/CN111886659B/zh active Active
- 2019-03-20 WO PCT/US2019/023120 patent/WO2019183192A1/en active Application Filing
- 2019-03-20 GB GB2014429.1A patent/GB2586711A/en not_active Withdrawn
- 2019-03-20 JP JP2020545117A patent/JP7179862B2/ja active Active
- 2019-03-20 GB GB2212035.6A patent/GB2608293B8/en active Active
- 2019-03-21 TW TW108109766A patent/TWI779179B/zh active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000510639A (ja) | 1996-05-07 | 2000-08-15 | ヘキスト・セラニーズ・コーポレーション | 温度安定性誘電率を有するポリマー組成物 |
WO2003044099A1 (de) | 2001-11-23 | 2003-05-30 | Deutsche Amphibolin-Werke Von Robert Murjahn Gmbh & Co. Kg | Beschichtungsmasse enthaltend nanopartikel, verwendung der beschichtungsmasse und verfahren zur herstellung von beschichtungen |
WO2004102589A1 (ja) | 2003-05-19 | 2004-11-25 | Hitachi Chemical Co., Ltd. | 絶縁材料、フィルム、回路基板及びこれらの製造方法 |
JP2008525550A (ja) | 2004-12-23 | 2008-07-17 | ソルヴェイ・ソレクシス・インコーポレイテッド | 熱可塑性ハロゲン化ポリマー組成物 |
JP2009122573A (ja) | 2007-11-19 | 2009-06-04 | Toray Ind Inc | 情報伝達配線接続装置またはその構成部品およびその製造方法 |
JP2011063699A (ja) | 2009-09-16 | 2011-03-31 | Jx Nippon Oil & Energy Corp | 液晶ポリエステル樹脂組成物の成形方法および成形体 |
JP2013519756A (ja) | 2010-02-11 | 2013-05-30 | スリーエム イノベイティブ プロパティズ カンパニー | 分散多モード表面改質ナノ粒子を含む樹脂系 |
JP2013072032A (ja) | 2011-09-28 | 2013-04-22 | Aron Kasei Co Ltd | 熱伝導性エラストマー組成物及び成形体 |
JP2014240134A (ja) | 2013-06-11 | 2014-12-25 | ポリプラスチックス株式会社 | 金属樹脂複合成形体及びその製造方法 |
JP2015074763A (ja) | 2013-10-11 | 2015-04-20 | パナソニックIpマネジメント株式会社 | 光反射体用成形材料、光反射体及び照明器具 |
Also Published As
Publication number | Publication date |
---|---|
GB2608293B (en) | 2023-03-29 |
GB2586711A (en) | 2021-03-03 |
KR20200135773A (ko) | 2020-12-03 |
US11198263B2 (en) | 2021-12-14 |
GB202014429D0 (en) | 2020-10-28 |
TW201940573A (zh) | 2019-10-16 |
GB2608293B8 (en) | 2023-07-05 |
JP2021516711A (ja) | 2021-07-08 |
DE112019001476T5 (de) | 2020-12-03 |
GB2608293A (en) | 2022-12-28 |
WO2019183192A1 (en) | 2019-09-26 |
GB202212035D0 (en) | 2022-10-05 |
CN111886659A (zh) | 2020-11-03 |
CN111886659B (zh) | 2023-03-28 |
KR102441151B1 (ko) | 2022-09-07 |
US20190291364A1 (en) | 2019-09-26 |
GB2608293A8 (en) | 2023-07-05 |
TWI779179B (zh) | 2022-10-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7179862B2 (ja) | 複数の異なる誘電充填材を含む溶融加工可能な熱可塑性複合材 | |
US20220315823A1 (en) | Dielectric layer with improved thermally conductivity | |
US9596755B2 (en) | Magneto-dielectric substrate, circuit material, and assembly having the same | |
TWI720109B (zh) | 包含六方晶系鐵氧體纖維之磁介電材料、其製作及使用方法 | |
US10834854B2 (en) | Methods for the manufacture of thermal interfaces, thermal interfaces, and articles comprising the same | |
US20160276072A1 (en) | Magneto-dielectric substrate, circuit material, and assembly having the same | |
US11574752B2 (en) | Magneto-dielectric materials, methods of making, and uses thereof | |
TW201939532A (zh) | 核-殼粒子、磁-介電材料、其製造方法、以及其用途 | |
TW201625408A (zh) | 可撓性金屬疊層板及彼之製備方法 | |
TW202013666A (zh) | 基板上之電磁介電結構及其製作方法 | |
WO2010141432A1 (en) | Thermally conductive circuit subassemblies, method of manufacture thereof, and articles formed therefrom | |
TW202138451A (zh) | 經由輻照交聯的成形介電組件、彼之製造方法及包含彼之製品 | |
JP2022061412A (ja) | 液状組成物の製造方法及び積層体の製造方法 | |
US20230399237A1 (en) | Y-type hexaferrite, method of manufacture, and uses thereof | |
US20230242709A1 (en) | Thermoset composite comprising a crosslinked imide extended compound |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220209 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220209 |
|
A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20220209 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220315 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220613 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220628 |
|
A524 | Written submission of copy of amendment under article 19 pct |
Free format text: JAPANESE INTERMEDIATE CODE: A524 Effective date: 20220921 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20221018 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20221116 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7179862 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |