JP7176615B2 - 電子機器 - Google Patents

電子機器 Download PDF

Info

Publication number
JP7176615B2
JP7176615B2 JP2021508237A JP2021508237A JP7176615B2 JP 7176615 B2 JP7176615 B2 JP 7176615B2 JP 2021508237 A JP2021508237 A JP 2021508237A JP 2021508237 A JP2021508237 A JP 2021508237A JP 7176615 B2 JP7176615 B2 JP 7176615B2
Authority
JP
Japan
Prior art keywords
heating element
electronic device
housing
coo
connecting portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021508237A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2020195301A1 (https=
Inventor
真弘 蜂矢
実 吉川
隆 大塚
信夫 金子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of JPWO2020195301A1 publication Critical patent/JPWO2020195301A1/ja
Application granted granted Critical
Publication of JP7176615B2 publication Critical patent/JP7176615B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Human Computer Interaction (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2021508237A 2019-03-28 2020-02-14 電子機器 Active JP7176615B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019062948 2019-03-28
JP2019062948 2019-03-28
PCT/JP2020/005719 WO2020195301A1 (ja) 2019-03-28 2020-02-14 電子機器

Publications (2)

Publication Number Publication Date
JPWO2020195301A1 JPWO2020195301A1 (https=) 2020-10-01
JP7176615B2 true JP7176615B2 (ja) 2022-11-22

Family

ID=72608756

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021508237A Active JP7176615B2 (ja) 2019-03-28 2020-02-14 電子機器

Country Status (3)

Country Link
US (1) US20220151113A1 (https=)
JP (1) JP7176615B2 (https=)
WO (1) WO2020195301A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025048428A1 (ko) * 2023-08-28 2025-03-06 주식회사 기가테라라이팅 조명 장치
KR20250032850A (ko) * 2023-08-28 2025-03-07 주식회사 기가테라라이팅 조명 장치

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11644249B2 (en) * 2018-04-02 2023-05-09 Nec Corporation Electronic apparatus
EP4089664B1 (en) * 2020-01-06 2025-08-27 LG Electronics Inc. Display device
US12315779B1 (en) * 2021-02-18 2025-05-27 Amazon Technologies, Inc. Vapor chamber heat spreader for bare die processors
US12408301B2 (en) * 2023-05-19 2025-09-02 Apple Inc. Thermal module and joining method for hermetically sealed enclosure of a thermal module using a capillary joint
US20250294687A1 (en) * 2024-03-12 2025-09-18 Micron Technology, Inc. Chemical shielding structure for immersion cooling

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006261457A (ja) 2005-03-17 2006-09-28 Fujitsu Ltd 受熱体、受熱装置及び電子機器
JP2008518468A (ja) 2004-10-29 2008-05-29 スリーエム イノベイティブ プロパティズ カンパニー 浸漬冷却装置
JP2009139005A (ja) 2007-12-05 2009-06-25 Yokohama National Univ 冷却器及びその冷却器を備える冷却装置
JP2009206369A (ja) 2008-02-28 2009-09-10 Panasonic Corp 半導体装置
WO2015174423A1 (ja) 2014-05-12 2015-11-19 国立大学法人横浜国立大学 冷却器及びそれを用いた冷却装置、並びに、発熱体の冷却方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5000256A (en) * 1990-07-20 1991-03-19 Minnesota Mining And Manufacturing Company Heat transfer bag with thermal via
US7157793B2 (en) * 2003-11-12 2007-01-02 U.S. Monolithics, L.L.C. Direct contact semiconductor cooling
US7079393B2 (en) * 2004-11-16 2006-07-18 International Business Machines Corporation Fluidic cooling systems and methods for electronic components
US8014150B2 (en) * 2009-06-25 2011-09-06 International Business Machines Corporation Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling
JP4801797B1 (ja) * 2010-03-10 2011-10-26 パナソニック株式会社 半導体装置及びその製造方法
US8981556B2 (en) * 2013-03-19 2015-03-17 Toyota Motor Engineering & Manufacturing North America, Inc. Jet impingement cooling apparatuses having non-uniform jet orifice sizes
JP6627901B2 (ja) * 2018-02-23 2020-01-08 日本電気株式会社 電子機器および電子装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008518468A (ja) 2004-10-29 2008-05-29 スリーエム イノベイティブ プロパティズ カンパニー 浸漬冷却装置
JP2006261457A (ja) 2005-03-17 2006-09-28 Fujitsu Ltd 受熱体、受熱装置及び電子機器
JP2009139005A (ja) 2007-12-05 2009-06-25 Yokohama National Univ 冷却器及びその冷却器を備える冷却装置
JP2009206369A (ja) 2008-02-28 2009-09-10 Panasonic Corp 半導体装置
WO2015174423A1 (ja) 2014-05-12 2015-11-19 国立大学法人横浜国立大学 冷却器及びそれを用いた冷却装置、並びに、発熱体の冷却方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025048428A1 (ko) * 2023-08-28 2025-03-06 주식회사 기가테라라이팅 조명 장치
KR20250032850A (ko) * 2023-08-28 2025-03-07 주식회사 기가테라라이팅 조명 장치
KR102796126B1 (ko) * 2023-08-28 2025-04-18 주식회사 마루라이팅 조명 장치

Also Published As

Publication number Publication date
JPWO2020195301A1 (https=) 2020-10-01
US20220151113A1 (en) 2022-05-12
WO2020195301A1 (ja) 2020-10-01

Similar Documents

Publication Publication Date Title
JP7176615B2 (ja) 電子機器
JP7156368B2 (ja) 電子機器
US10727160B2 (en) Thermal management component
CN110911363B (zh) 半导体封装结构
US7561425B2 (en) Encapsulated multi-phase electronics heat-sink
US7603775B2 (en) Heat spreader with vapor chamber and method of manufacturing the same
US12322675B2 (en) Electronic module comprising a pulsating heat pipe
US20080236795A1 (en) Low-profile heat-spreading liquid chamber using boiling
US6317322B1 (en) Plate type heat pipe and a cooling system using same
JP2022145713A (ja) ベーパーチャンバー製造用金属部材
JP7839840B2 (ja) 積層体
WO2015049807A1 (ja) サーバ装置
US20050274487A1 (en) Method and apparatus for reducing thermal resistance in a vertical heat sink assembly
JP2020123653A (ja) 電子機器
US20250336755A1 (en) Semiconductor package with double-sided thermal solution and method for forming the same
JP2006245356A (ja) 電子デバイスの冷却装置
CN1677654B (zh) 散热模块
CN120113049A (zh) 传热部件及传热部件的制造方法
JP5682409B2 (ja) ループ型ヒートパイプ及び電子装置
TW200845874A (en) Circuit board having heat-dissipating structure and manufacturing method thereof
JP5434725B2 (ja) 半導体装置
US20150034288A1 (en) Flat Plate Cooling Device and Method for Using the Same
US20250157883A1 (en) Semiconductor device
US20240298426A1 (en) Device for Dissipating Heat From Electronic Components in an Electronics Housing
WO2025023130A1 (ja) 電子機器

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210909

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210909

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220802

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220922

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20221011

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20221024

R151 Written notification of patent or utility model registration

Ref document number: 7176615

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151