JP7170016B2 - 成膜装置 - Google Patents
成膜装置 Download PDFInfo
- Publication number
- JP7170016B2 JP7170016B2 JP2020169055A JP2020169055A JP7170016B2 JP 7170016 B2 JP7170016 B2 JP 7170016B2 JP 2020169055 A JP2020169055 A JP 2020169055A JP 2020169055 A JP2020169055 A JP 2020169055A JP 7170016 B2 JP7170016 B2 JP 7170016B2
- Authority
- JP
- Japan
- Prior art keywords
- atmospheric
- chamber
- film forming
- forming apparatus
- cooling pipes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000008021 deposition Effects 0.000 title claims description 13
- 239000010408 film Substances 0.000 claims description 65
- 238000001816 cooling Methods 0.000 claims description 61
- 230000007246 mechanism Effects 0.000 claims description 39
- 239000000758 substrate Substances 0.000 claims description 17
- 230000015572 biosynthetic process Effects 0.000 claims description 13
- 238000004544 sputter deposition Methods 0.000 claims description 13
- 239000000110 cooling liquid Substances 0.000 claims description 12
- 238000000151 deposition Methods 0.000 claims description 12
- 239000010409 thin film Substances 0.000 claims description 9
- 230000008878 coupling Effects 0.000 claims description 7
- 238000010168 coupling process Methods 0.000 claims description 7
- 238000005859 coupling reaction Methods 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000013077 target material Substances 0.000 description 3
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3423—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020169055A JP7170016B2 (ja) | 2020-10-06 | 2020-10-06 | 成膜装置 |
| CN202111111518.9A CN114381698B (zh) | 2020-10-06 | 2021-09-23 | 成膜装置 |
| KR1020210131867A KR102701486B1 (ko) | 2020-10-06 | 2021-10-05 | 성막 장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020169055A JP7170016B2 (ja) | 2020-10-06 | 2020-10-06 | 成膜装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2022061206A JP2022061206A (ja) | 2022-04-18 |
| JP7170016B2 true JP7170016B2 (ja) | 2022-11-11 |
Family
ID=81194473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020169055A Active JP7170016B2 (ja) | 2020-10-06 | 2020-10-06 | 成膜装置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7170016B2 (ko) |
| KR (1) | KR102701486B1 (ko) |
| CN (1) | CN114381698B (ko) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013253316A (ja) | 2012-05-09 | 2013-12-19 | Iza Corp | スパッタリング装置 |
| JP2017521560A (ja) | 2014-07-09 | 2017-08-03 | ソレラス・アドヴァンスト・コーティングス・ビーヴイビーエー | 移動ターゲットを有するスパッタ装置 |
| JP2020105566A (ja) | 2018-12-27 | 2020-07-09 | キヤノントッキ株式会社 | 成膜装置、成膜方法、および電子デバイスの製造方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006322055A (ja) * | 2005-05-20 | 2006-11-30 | Kobe Steel Ltd | 連続成膜装置 |
| KR20090130559A (ko) * | 2008-06-16 | 2009-12-24 | 삼성모바일디스플레이주식회사 | 이송 장치 및 이를 구비하는 유기물 증착 장치 |
| CN102251218B (zh) * | 2010-05-18 | 2014-04-23 | 鸿富锦精密工业（深圳）有限公司 | 镀膜装置 |
| JP2012140671A (ja) * | 2010-12-28 | 2012-07-26 | Canon Tokki Corp | 成膜装置 |
| CN103695845B (zh) * | 2013-11-29 | 2015-12-09 | 东莞市汇成真空科技有限公司 | 一种立式真空离子镀膜机的无污染加热管装置 |
| JPWO2016204022A1 (ja) * | 2015-06-16 | 2018-01-25 | 株式会社アルバック | 成膜方法及び成膜装置 |
| JP6852018B2 (ja) * | 2018-05-31 | 2021-03-31 | キヤノントッキ株式会社 | 蒸着方法，電子デバイスの製造方法及び蒸着装置 |
| JP7193291B2 (ja) * | 2018-09-28 | 2022-12-20 | キヤノントッキ株式会社 | 成膜装置、成膜方法、および電子デバイスの製造方法 |
| JP7136648B2 (ja) * | 2018-09-28 | 2022-09-13 | キヤノントッキ株式会社 | 成膜装置、成膜方法、および電子デバイスの製造方法 |
| JP7229015B2 (ja) * | 2018-12-27 | 2023-02-27 | キヤノントッキ株式会社 | 成膜装置、成膜方法、および電子デバイスの製造方法 |
| JP7324593B2 (ja) * | 2019-03-05 | 2023-08-10 | キヤノントッキ株式会社 | 真空チャンバ内へのユーティリティライン導入機構、成膜装置、成膜システム |
-
2020
- 2020-10-06 JP JP2020169055A patent/JP7170016B2/ja active Active
-
2021
- 2021-09-23 CN CN202111111518.9A patent/CN114381698B/zh active Active
- 2021-10-05 KR KR1020210131867A patent/KR102701486B1/ko active IP Right Grant
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013253316A (ja) | 2012-05-09 | 2013-12-19 | Iza Corp | スパッタリング装置 |
| JP2017521560A (ja) | 2014-07-09 | 2017-08-03 | ソレラス・アドヴァンスト・コーティングス・ビーヴイビーエー | 移動ターゲットを有するスパッタ装置 |
| JP2020105566A (ja) | 2018-12-27 | 2020-07-09 | キヤノントッキ株式会社 | 成膜装置、成膜方法、および電子デバイスの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2022061206A (ja) | 2022-04-18 |
| CN114381698A (zh) | 2022-04-22 |
| CN114381698B (zh) | 2023-09-12 |
| KR20220045913A (ko) | 2022-04-13 |
| KR102701486B1 (ko) | 2024-08-30 |
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