JP7168624B2 - 薄膜蒸着用組成物、薄膜蒸着用組成物を用いた薄膜の製造方法、薄膜蒸着用組成物から製造された薄膜、および薄膜を含む半導体素子 - Google Patents
薄膜蒸着用組成物、薄膜蒸着用組成物を用いた薄膜の製造方法、薄膜蒸着用組成物から製造された薄膜、および薄膜を含む半導体素子 Download PDFInfo
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Description
前記第2薄膜蒸着用組成物は、チタン、ジルコニウム、ハフニウム、ニオブ、タンタル、またはこれらの組み合わせを含む第2有機金属化合物を含むことができる。
前記反応ガスは、水蒸気(H2O)、酸素(O2)、オゾン(O3)、プラズマ、過酸化水素(H2O2)、アンモニア(NH3)またはヒドラジン(N2H4)、またはこれらの組み合わせを含むことができる。
・粘度測定計:RVDV-II(BROOKFIELD社)
・Spindle No.:CPA-40Z
・Torque/RPM:20~80% Torque/1~100 RPM
・測定温度(sample cup温度):25℃。
(実施例1-1~1-7および比較例1)
下記表1に記載された組成で、下記化学式2-1の有機金属化合物(SR8820、EREZTECH社;TGA 50wt%減量温度=265℃、常温で固体)とトリヘプチルアミン(I0361、TCI社;TGA 50wt%減量温度=243℃、常温で液体)を混合、および攪拌して薄膜蒸着用組成物(常温で液体)を製造した。
下記表2に記載された組成で、前記化学式2-1の有機金属化合物とトリオクチルアミン(I0362、TCI社;TGA 50wt%減量温度=269℃、常温で液体)を混合、および攪拌して薄膜蒸着用組成物(常温で液体)を製造した。
下記表3に記載された組成で、前記化学式2-1の有機金属化合物とトリエチルアミン(I0424、TCI社;TGA 50wt%減量温度=40.4℃、常温で液体)を混合、および攪拌して薄膜蒸着用組成物(常温で液体)を製造した。
前記実施例および比較例による薄膜蒸着用組成物の粘度をそれぞれ下記粘度測定条件で測定して前記表1~表3、および図1にその結果を示した。
・粘度測定計:RVDV-II(BROOKFIELD社)
・Spindle No.:CPA-40Z
・Torque/RPM:20~80% Torque/1~100 RPM
・測定温度(sample cup温度):25℃。
前記実施例および比較例による薄膜蒸着用組成物の気化様相をAr(アルゴン)ガス下、1気圧で熱重量分析法(thermogravimetric analysis、TGA)によって評価する。(測定装備:TG209F3、NETZSCH社)。
前記実施例1-1~2-7による薄膜蒸着用組成物をバブラータイプの300ccキャニスタに200g充填し、ALD装備を使用して薄膜を製造した。
Claims (18)
- 前記有機金属化合物は、置換もしくは非置換のシクロペンタジエン系リガンド、置換もしくは非置換のβ-ジケトネート系リガンド、置換もしくは非置換のケトイミネート系リガンド、置換もしくは非置換のピロール系リガンド、置換もしくは非置換のイミダゾール系リガンド、置換もしくは非置換のアミジネート系リガンド、置換もしくは非置換のアルコキシド系リガンド、置換もしくは非置換のアミド系リガンド、またはこれらの組み合わせを含む、請求項1に記載の薄膜蒸着用組成物。
- Ra~Reのうちの少なくとも一つは、置換もしくは非置換の炭素数3~30の分枝状アルキル基である、請求項3に記載の薄膜蒸着用組成物。
- 前記化学式1中、R1~R3は互いに同一である、請求項1~4のいずれか1項に記載の薄膜蒸着用組成物。
- R1~R3は、置換もしくは非置換のペンチル基、置換もしくは非置換のヘキシル基、置換もしくは非置換のヘプチル基、置換もしくは非置換のオクチル基、置換もしくは非置換のノニル基、または置換もしくは非置換のデシル基である、請求項1~5のいずれか1項に記載の薄膜蒸着用組成物。
- 前記有機金属化合物(m1)と前記非共有電子対含有化合物(m2)のモル当量比(m2/m1)が0.1~5である、請求項1~6のいずれか1項に記載の薄膜蒸着用組成物。
- アルゴンガス雰囲気下、1気圧で熱重量分析法(thermogravimetric analysis;TGA)測定時、前記有機金属化合物の初期重量に対する50%の重量減少が起こる温度と、前記非共有電子対含有化合物の初期重量に対する50%の重量減少が起こる温度との差が、90℃以下である、請求項1~7のいずれか1項に記載の薄膜蒸着用組成物。
- アルゴンガス雰囲気下、1気圧で熱重量分析法(thermogravimetric analysis)測定時、前記薄膜蒸着用組成物の初期重量に対する50%の重量減少が起こる温度は、前記有機金属化合物の初期重量に対する50%の重量減少が起こる温度、および前記非共有電子対含有化合物の初期重量に対する50%の重量減少が起こる温度より低い、請求項1~8のいずれか1項に記載の薄膜蒸着用組成物。
- 前記薄膜蒸着用組成物の下記条件によって測定された粘度が500cps以下である、請求項1~9のいずれか1項に記載の薄膜蒸着用組成物。
[粘度測定条件]
・粘度測定計:RVDV-II(BROOKFIELD社)
・Spindle No.:CPA-40Z
・Torque/RPM:20~80% Torque/1~100RPM
・測定温度(sample cup温度):25℃ - 請求項1~10のうちのいずれか1項による第1薄膜蒸着用組成物を気化させる段階、および
前記気化された第1薄膜蒸着用組成物を基板上に蒸着させる段階を含む、薄膜の製造方法。 - 前記薄膜の製造方法は、第2薄膜蒸着用組成物を気化させる段階、および
前記気化された第2薄膜蒸着用組成物を前記基板上に蒸着させる段階をさらに含み、
前記第2薄膜蒸着用組成物は、チタン、ジルコニウム、ハフニウム、ニオブ、タンタル、またはこれらの組み合わせを含む第2有機金属化合物を含む、請求項11に記載の薄膜の製造方法。 - 前記気化された第1薄膜蒸着用組成物と前記気化された第2薄膜蒸着用組成物は、基板上に共にまたはそれぞれ独立して蒸着される、請求項12に記載の薄膜の製造方法。
- 前記第1薄膜蒸着用組成物を気化させる段階は、前記第1薄膜蒸着用組成物を300℃以下の温度で加熱する段階を含む、請求項11~13のいずれか1項に記載の薄膜の製造方法。
- 前記気化された第1薄膜蒸着用組成物を基板上に蒸着させる段階は、前記気化された第1薄膜蒸着用組成物を反応ガスと反応させる段階をさらに含み、
前記反応ガスは、水蒸気(H2O)、酸素(O2)、オゾン(O3)、プラズマ、過酸化水素(H2O2)、アンモニア(NH3)またはヒドラジン(N2H4)、またはこれらの組み合わせを含む、請求項11~14のいずれか1項に記載の薄膜の製造方法。 - 前記気化された第1薄膜蒸着用組成物を基板上に蒸着させる段階は、原子層蒸着法(Atomic Layer Deposition;ALD)または有機金属化学蒸着法(Metal Organic Chemical Vapor Depositionition;MOCVD)を用いて行われる、請求項11~15のいずれか1項に記載の薄膜の製造方法。
- 請求項1~10のうちのいずれか1項による薄膜蒸着用組成物から製造される薄膜。
- 請求項17による薄膜を含む半導体素子。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR10-2019-0125525 | 2019-10-10 | ||
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TW202115276A (zh) | 2021-04-16 |
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JP2021064787A (ja) | 2021-04-22 |
KR20210042680A (ko) | 2021-04-20 |
US11482593B2 (en) | 2022-10-25 |
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US20210111244A1 (en) | 2021-04-15 |
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