JP7165341B2 - 黒鉛－銅複合材料、それを用いたヒートシンク部材、および黒鉛－銅複合材料の製造方法 - Google Patents

黒鉛－銅複合材料、それを用いたヒートシンク部材、および黒鉛－銅複合材料の製造方法 Download PDF

Info

Publication number
JP7165341B2
JP7165341B2 JP2021565603A JP2021565603A JP7165341B2 JP 7165341 B2 JP7165341 B2 JP 7165341B2 JP 2021565603 A JP2021565603 A JP 2021565603A JP 2021565603 A JP2021565603 A JP 2021565603A JP 7165341 B2 JP7165341 B2 JP 7165341B2
Authority
JP
Japan
Prior art keywords
copper
graphite
composite material
less
graphite particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021565603A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2021125196A1 (https=
Inventor
正文 吉村
太 稲森
健市 砂本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ube Corp
Original Assignee
Ube Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ube Corp filed Critical Ube Corp
Publication of JPWO2021125196A1 publication Critical patent/JPWO2021125196A1/ja
Application granted granted Critical
Publication of JP7165341B2 publication Critical patent/JP7165341B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/20—Graphite
    • C01B32/21—After-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/12—Metallic powder containing non-metallic particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C22C32/0084—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ carbon or graphite as the main non-metallic constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B22F2998/10—Processes characterised by the sequence of their steps
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/01—Particle morphology depicted by an image
    • C01P2004/03—Particle morphology depicted by an image obtained by SEM
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/20—Particle morphology extending in two dimensions, e.g. plate-like
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/32—Thermal properties
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/90—Other properties not specified above
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Geology (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Powder Metallurgy (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2021565603A 2019-12-17 2020-12-16 黒鉛－銅複合材料、それを用いたヒートシンク部材、および黒鉛－銅複合材料の製造方法 Active JP7165341B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2019227123 2019-12-17
JP2019227123 2019-12-17
JP2020133449 2020-08-06
JP2020133449 2020-08-06
PCT/JP2020/046847 WO2021125196A1 (ja) 2019-12-17 2020-12-16 黒鉛－銅複合材料、それを用いたヒートシンク部材、および黒鉛－銅複合材料の製造方法

Publications (2)

Publication Number Publication Date
JPWO2021125196A1 JPWO2021125196A1 (https=) 2021-06-24
JP7165341B2 true JP7165341B2 (ja) 2022-11-04

Family

ID=76478804

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021565603A Active JP7165341B2 (ja) 2019-12-17 2020-12-16 黒鉛－銅複合材料、それを用いたヒートシンク部材、および黒鉛－銅複合材料の製造方法

Country Status (5)

Country Link
US (1) US12534372B2 (https=)
EP (1) EP4079426A4 (https=)
JP (1) JP7165341B2 (https=)
CN (1) CN114761588A (https=)
WO (1) WO2021125196A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7741504B2 (ja) * 2021-03-31 2025-09-18 Ｕｂｅ株式会社 黒鉛－銅複合材料、それを用いたヒートシンク部材、および黒鉛－銅複合材料の製造方法
JP2023006510A (ja) * 2021-06-30 2023-01-18 日亜化学工業株式会社 発光モジュール、車両用灯具、及び、放熱部材
JP7786669B2 (ja) * 2021-09-01 2025-12-16 Ｕｂｅ株式会社 黒鉛－銅複合材料、それを用いたヒートシンク部材、および黒鉛－銅複合材料の製造方法
JP2024149121A (ja) * 2023-04-07 2024-10-18 Ｕｂｅ株式会社 複合材料、それを用いたヒートシンク部材、および複合材料の製造方法
US12565420B2 (en) 2023-06-16 2026-03-03 Connaught Electronics Ltd. MEMS packaging with actuator stator providing electrical connection point
US12552663B2 (en) 2023-10-24 2026-02-17 Connaught Electronics Ltd. MEMS packaging enabling vertical displacement of sensor and actuator rotor

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010067842A (ja) 2008-09-11 2010-03-25 Am Technology:Kk 黒鉛一金属複合体とアルミニウム押出材の組合せからなる放熱体。
JP2014118621A (ja) 2012-12-19 2014-06-30 Sanyo Special Steel Co Ltd Ｃｕ系磁気記録用合金およびスパッタリングターゲット材並びにそれを使用した垂直磁気記録媒体
JP2017155252A (ja) 2016-02-29 2017-09-07 株式会社アカネ 多軸通電焼結装置
JP2019026884A (ja) 2017-07-28 2019-02-21 昭和電工株式会社 金属−炭素粒子複合材
WO2019066543A1 (ko) 2017-09-29 2019-04-04 인동전자 주식회사 인조 흑연 분말을 이용한 열전도성 박막의 제조방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62207832A (ja) 1986-03-06 1987-09-12 Kobe Steel Ltd 半導体用銅−炭素複合材料およびその製造方法
JPH10168502A (ja) * 1996-12-10 1998-06-23 Osaka Gas Co Ltd 高熱伝導率複合材
KR100513298B1 (ko) * 1997-01-20 2005-09-09 가부시키가이샤 아카네 소결방법 및 소결장치
JP4441768B2 (ja) * 2007-10-18 2010-03-31 島根県 高熱伝導性を有する金属−黒鉛複合材料およびその製造方法
JP2017128802A (ja) 2016-01-15 2017-07-27 昭和電工株式会社 金属−黒鉛複合材料及びその製造方法
CN107502767B (zh) 2016-06-14 2019-03-19 宁波晨鑫维克工业科技有限公司 一种定向超高导热、高强度石墨-铜复合材料及其制备方法和应用
JP7138904B2 (ja) * 2017-11-28 2022-09-20 株式会社アカネ 薄層黒鉛の製造方法
CN110184494A (zh) 2019-06-20 2019-08-30 合肥工业大学 一种电子封装用石墨片/Cu基复合材料的制备方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010067842A (ja) 2008-09-11 2010-03-25 Am Technology:Kk 黒鉛一金属複合体とアルミニウム押出材の組合せからなる放熱体。
JP2014118621A (ja) 2012-12-19 2014-06-30 Sanyo Special Steel Co Ltd Ｃｕ系磁気記録用合金およびスパッタリングターゲット材並びにそれを使用した垂直磁気記録媒体
JP2017155252A (ja) 2016-02-29 2017-09-07 株式会社アカネ 多軸通電焼結装置
JP2019026884A (ja) 2017-07-28 2019-02-21 昭和電工株式会社 金属−炭素粒子複合材
WO2019066543A1 (ko) 2017-09-29 2019-04-04 인동전자 주식회사 인조 흑연 분말을 이용한 열전도성 박막의 제조방법

Also Published As

Publication number Publication date
CN114761588A (zh) 2022-07-15
EP4079426A1 (en) 2022-10-26
WO2021125196A1 (ja) 2021-06-24
EP4079426A4 (en) 2024-07-17
US20230031882A1 (en) 2023-02-02
US12534372B2 (en) 2026-01-27
JPWO2021125196A1 (https=) 2021-06-24

Similar Documents

Publication Publication Date Title
JP7165341B2 (ja) 黒鉛－銅複合材料、それを用いたヒートシンク部材、および黒鉛－銅複合材料の製造方法
JP4441768B2 (ja) 高熱伝導性を有する金属−黒鉛複合材料およびその製造方法
JP6982320B2 (ja) 黒鉛／グラフェン複合材、集熱体、伝熱体、放熱体および放熱システム
KR20160016857A (ko) 수지 함침 질화 붕소 소결체 및 그 용도
JPWO2017065139A1 (ja) アルミニウム−ダイヤモンド系複合体及びその製造方法
Yi et al. Microstructure and thermal/mechanical properties of hot-extruded aluminum/graphite composites with Al–Si alloy addition
CN117681510A (zh) 具有零膨胀、定向高热导和强韧性的反钙钛矿/金属-金属叠层复合材料及其制备
KR20220031478A (ko) 질화규소 소결체 기판 및 이의 제조방법
Kok et al. Green gelcasting of aluminum nitride using environmental sustainable ovalbumin natural binder
JP7786669B2 (ja) 黒鉛－銅複合材料、それを用いたヒートシンク部材、および黒鉛－銅複合材料の製造方法
JP7741504B2 (ja) 黒鉛－銅複合材料、それを用いたヒートシンク部材、および黒鉛－銅複合材料の製造方法
JP3913130B2 (ja) アルミニウム−炭化珪素質板状複合体
WO2024210118A1 (ja) 複合材料、それを用いたヒートシンク部材、および複合材料の製造方法
CN117136247B (zh) 石墨-铜复合材料、使用其的散热器构件、及石墨-铜复合材料的制造方法
Jiang et al. Novel carbon-aluminum composites with low coefficient of thermal expansion (CTE) and high thermal conductivity

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220324

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20220324

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220510

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20220707

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220725

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A711

Effective date: 20220725

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220804

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20220725

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20220804

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20220927

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20221013

R150 Certificate of patent or registration of utility model

Ref document number: 7165341

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250