JPWO2021125196A1 - - Google Patents

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Publication number
JPWO2021125196A1
JPWO2021125196A1 JP2021565603A JP2021565603A JPWO2021125196A1 JP WO2021125196 A1 JPWO2021125196 A1 JP WO2021125196A1 JP 2021565603 A JP2021565603 A JP 2021565603A JP 2021565603 A JP2021565603 A JP 2021565603A JP WO2021125196 A1 JPWO2021125196 A1 JP WO2021125196A1
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JP
Japan
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Application number
JP2021565603A
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Japanese (ja)
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JP7165341B2 (ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/20—Graphite
    • C01B32/21—After-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/12—Metallic powder containing non-metallic particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C22C32/0084—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ carbon or graphite as the main non-metallic constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B22F2998/10—Processes characterised by the sequence of their steps
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/01—Particle morphology depicted by an image
    • C01P2004/03—Particle morphology depicted by an image obtained by SEM
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/20—Particle morphology extending in two dimensions, e.g. plate-like
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/32—Thermal properties
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/90—Other properties not specified above
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Geology (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Powder Metallurgy (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2021565603A 2019-12-17 2020-12-16 黒鉛－銅複合材料、それを用いたヒートシンク部材、および黒鉛－銅複合材料の製造方法 Active JP7165341B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2019227123 2019-12-17
JP2019227123 2019-12-17
JP2020133449 2020-08-06
JP2020133449 2020-08-06
PCT/JP2020/046847 WO2021125196A1 (ja) 2019-12-17 2020-12-16 黒鉛－銅複合材料、それを用いたヒートシンク部材、および黒鉛－銅複合材料の製造方法

Publications (2)

Publication Number Publication Date
JPWO2021125196A1 true JPWO2021125196A1 (https=) 2021-06-24
JP7165341B2 JP7165341B2 (ja) 2022-11-04

Family

ID=76478804

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021565603A Active JP7165341B2 (ja) 2019-12-17 2020-12-16 黒鉛－銅複合材料、それを用いたヒートシンク部材、および黒鉛－銅複合材料の製造方法

Country Status (5)

Country Link
US (1) US12534372B2 (https=)
EP (1) EP4079426A4 (https=)
JP (1) JP7165341B2 (https=)
CN (1) CN114761588A (https=)
WO (1) WO2021125196A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7741504B2 (ja) * 2021-03-31 2025-09-18 Ｕｂｅ株式会社 黒鉛－銅複合材料、それを用いたヒートシンク部材、および黒鉛－銅複合材料の製造方法
JP2023006510A (ja) * 2021-06-30 2023-01-18 日亜化学工業株式会社 発光モジュール、車両用灯具、及び、放熱部材
JP7786669B2 (ja) * 2021-09-01 2025-12-16 Ｕｂｅ株式会社 黒鉛－銅複合材料、それを用いたヒートシンク部材、および黒鉛－銅複合材料の製造方法
JP2024149121A (ja) * 2023-04-07 2024-10-18 Ｕｂｅ株式会社 複合材料、それを用いたヒートシンク部材、および複合材料の製造方法
US12565420B2 (en) 2023-06-16 2026-03-03 Connaught Electronics Ltd. MEMS packaging with actuator stator providing electrical connection point
US12552663B2 (en) 2023-10-24 2026-02-17 Connaught Electronics Ltd. MEMS packaging enabling vertical displacement of sensor and actuator rotor

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62207832A (ja) * 1986-03-06 1987-09-12 Kobe Steel Ltd 半導体用銅−炭素複合材料およびその製造方法
JPH10168502A (ja) * 1996-12-10 1998-06-23 Osaka Gas Co Ltd 高熱伝導率複合材
JP2010067842A (ja) * 2008-09-11 2010-03-25 Am Technology:Kk 黒鉛一金属複合体とアルミニウム押出材の組合せからなる放熱体。
JP2014118621A (ja) * 2012-12-19 2014-06-30 Sanyo Special Steel Co Ltd Ｃｕ系磁気記録用合金およびスパッタリングターゲット材並びにそれを使用した垂直磁気記録媒体
JP2017155252A (ja) * 2016-02-29 2017-09-07 株式会社アカネ 多軸通電焼結装置
JP2019026884A (ja) * 2017-07-28 2019-02-21 昭和電工株式会社 金属−炭素粒子複合材
WO2019066543A1 (ko) * 2017-09-29 2019-04-04 인동전자 주식회사 인조 흑연 분말을 이용한 열전도성 박막의 제조방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100513298B1 (ko) * 1997-01-20 2005-09-09 가부시키가이샤 아카네 소결방법 및 소결장치
JP4441768B2 (ja) * 2007-10-18 2010-03-31 島根県 高熱伝導性を有する金属−黒鉛複合材料およびその製造方法
JP2017128802A (ja) 2016-01-15 2017-07-27 昭和電工株式会社 金属−黒鉛複合材料及びその製造方法
CN107502767B (zh) 2016-06-14 2019-03-19 宁波晨鑫维克工业科技有限公司 一种定向超高导热、高强度石墨-铜复合材料及其制备方法和应用
JP7138904B2 (ja) * 2017-11-28 2022-09-20 株式会社アカネ 薄層黒鉛の製造方法
CN110184494A (zh) 2019-06-20 2019-08-30 合肥工业大学 一种电子封装用石墨片/Cu基复合材料的制备方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62207832A (ja) * 1986-03-06 1987-09-12 Kobe Steel Ltd 半導体用銅−炭素複合材料およびその製造方法
JPH10168502A (ja) * 1996-12-10 1998-06-23 Osaka Gas Co Ltd 高熱伝導率複合材
JP2010067842A (ja) * 2008-09-11 2010-03-25 Am Technology:Kk 黒鉛一金属複合体とアルミニウム押出材の組合せからなる放熱体。
JP2014118621A (ja) * 2012-12-19 2014-06-30 Sanyo Special Steel Co Ltd Ｃｕ系磁気記録用合金およびスパッタリングターゲット材並びにそれを使用した垂直磁気記録媒体
JP2017155252A (ja) * 2016-02-29 2017-09-07 株式会社アカネ 多軸通電焼結装置
JP2019026884A (ja) * 2017-07-28 2019-02-21 昭和電工株式会社 金属−炭素粒子複合材
WO2019066543A1 (ko) * 2017-09-29 2019-04-04 인동전자 주식회사 인조 흑연 분말을 이용한 열전도성 박막의 제조방법

Also Published As

Publication number Publication date
CN114761588A (zh) 2022-07-15
EP4079426A1 (en) 2022-10-26
WO2021125196A1 (ja) 2021-06-24
EP4079426A4 (en) 2024-07-17
US20230031882A1 (en) 2023-02-02
US12534372B2 (en) 2026-01-27
JP7165341B2 (ja) 2022-11-04

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