JP7152079B2 - ワイヤボンディング装置及び半導体装置の製造方法 - Google Patents

ワイヤボンディング装置及び半導体装置の製造方法 Download PDF

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JP7152079B2
JP7152079B2 JP2021539455A JP2021539455A JP7152079B2 JP 7152079 B2 JP7152079 B2 JP 7152079B2 JP 2021539455 A JP2021539455 A JP 2021539455A JP 2021539455 A JP2021539455 A JP 2021539455A JP 7152079 B2 JP7152079 B2 JP 7152079B2
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capillary
ball
wire
bonding
point
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JPWO2022013955A1 (enExample
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浩章 吉野
森介 手井
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Shinkawa Ltd
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Shinkawa Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/78—Apparatus for connecting with wire connectors
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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/484—Connecting portions
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    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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    • H01L2224/48476—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area
    • H01L2224/48477—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding)
    • H01L2224/48478—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball
    • H01L2224/48479—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball on the semiconductor or solid-state body
    • H—ELECTRICITY
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    • H01L2224/85009—Pre-treatment of the connector or the bonding area
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2924/0001—Technical content checked by a classifier
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
JP2021539455A 2020-07-15 2020-07-15 ワイヤボンディング装置及び半導体装置の製造方法 Active JP7152079B2 (ja)

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PCT/JP2020/027421 WO2022013955A1 (ja) 2020-07-15 2020-07-15 ワイヤボンディング装置及び半導体装置の製造方法

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JPWO2022013955A1 JPWO2022013955A1 (enExample) 2022-01-20
JP7152079B2 true JP7152079B2 (ja) 2022-10-12

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US (1) US12107070B2 (enExample)
JP (1) JP7152079B2 (enExample)
KR (1) KR102488240B1 (enExample)
CN (1) CN114207790A (enExample)
TW (1) TWI827950B (enExample)
WO (1) WO2022013955A1 (enExample)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060054665A1 (en) 2004-09-08 2006-03-16 Kulicke And Soffa Industries Inc. Methods for forming conductive bumps and wire loops
JP2006222128A (ja) 2005-02-08 2006-08-24 Shinkawa Ltd ワイヤボンディング方法
JP2006278407A (ja) 2005-03-28 2006-10-12 Renesas Technology Corp 半導体装置の製造方法
JP2019176111A (ja) 2018-03-29 2019-10-10 ヤマハモーターロボティクスホールディングス株式会社 ワイヤボンディング装置、半導体装置の製造方法、および、半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4860128U (enExample) 1971-11-09 1973-07-31
JP2004247674A (ja) * 2003-02-17 2004-09-02 Shinkawa Ltd ワイヤボンディング方法
JP3854232B2 (ja) * 2003-02-17 2006-12-06 株式会社新川 バンプ形成方法及びワイヤボンディング方法
KR100536898B1 (ko) 2003-09-04 2005-12-16 삼성전자주식회사 반도체 소자의 와이어 본딩 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060054665A1 (en) 2004-09-08 2006-03-16 Kulicke And Soffa Industries Inc. Methods for forming conductive bumps and wire loops
JP2006222128A (ja) 2005-02-08 2006-08-24 Shinkawa Ltd ワイヤボンディング方法
JP2006278407A (ja) 2005-03-28 2006-10-12 Renesas Technology Corp 半導体装置の製造方法
JP2019176111A (ja) 2018-03-29 2019-10-10 ヤマハモーターロボティクスホールディングス株式会社 ワイヤボンディング装置、半導体装置の製造方法、および、半導体装置

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KR102488240B1 (ko) 2023-01-13
KR20220009937A (ko) 2022-01-25
WO2022013955A1 (ja) 2022-01-20
JPWO2022013955A1 (enExample) 2022-01-20
US12107070B2 (en) 2024-10-01
TWI827950B (zh) 2024-01-01
US20220328450A1 (en) 2022-10-13
TW202220069A (zh) 2022-05-16
CN114207790A (zh) 2022-03-18

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