JP7143954B2 - 伝送線路基板および電子機器 - Google Patents

伝送線路基板および電子機器 Download PDF

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Publication number
JP7143954B2
JP7143954B2 JP2021536858A JP2021536858A JP7143954B2 JP 7143954 B2 JP7143954 B2 JP 7143954B2 JP 2021536858 A JP2021536858 A JP 2021536858A JP 2021536858 A JP2021536858 A JP 2021536858A JP 7143954 B2 JP7143954 B2 JP 7143954B2
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JP
Japan
Prior art keywords
conductor
line
ground conductor
main surface
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021536858A
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English (en)
Japanese (ja)
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JPWO2021020019A1 (https=
JPWO2021020019A5 (https=
Inventor
康丞 大井
慎悟 伊藤
展正 小山
元郎 加藤
孝太郎 三島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2021020019A1 publication Critical patent/JPWO2021020019A1/ja
Publication of JPWO2021020019A5 publication Critical patent/JPWO2021020019A5/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/088—Stacked transmission lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/003—Coplanar lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/10—Wire waveguides, i.e. with a single solid longitudinal conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Waveguides (AREA)
JP2021536858A 2019-07-31 2020-07-02 伝送線路基板および電子機器 Active JP7143954B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019141239 2019-07-31
JP2019141239 2019-07-31
PCT/JP2020/025996 WO2021020019A1 (ja) 2019-07-31 2020-07-02 伝送線路基板および電子機器

Publications (3)

Publication Number Publication Date
JPWO2021020019A1 JPWO2021020019A1 (https=) 2021-02-04
JPWO2021020019A5 JPWO2021020019A5 (https=) 2022-01-12
JP7143954B2 true JP7143954B2 (ja) 2022-09-29

Family

ID=74230587

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021536858A Active JP7143954B2 (ja) 2019-07-31 2020-07-02 伝送線路基板および電子機器

Country Status (4)

Country Link
US (1) US12046792B2 (https=)
JP (1) JP7143954B2 (https=)
CN (1) CN217062060U (https=)
WO (1) WO2021020019A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3173143U (ja) 2010-12-03 2012-01-26 株式会社村田製作所 高周波信号線路
WO2016088592A1 (ja) 2014-12-01 2016-06-09 株式会社村田製作所 電子機器、電気素子および電気素子用トレイ
WO2019098012A1 (ja) 2017-11-16 2019-05-23 株式会社村田製作所 樹脂多層基板、電子部品およびその実装構造

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5041108B2 (ja) 2010-12-03 2012-10-03 株式会社村田製作所 高周波信号線路
JP6760540B2 (ja) * 2018-03-29 2020-09-23 株式会社村田製作所 伝送線路及びその実装構造

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3173143U (ja) 2010-12-03 2012-01-26 株式会社村田製作所 高周波信号線路
WO2016088592A1 (ja) 2014-12-01 2016-06-09 株式会社村田製作所 電子機器、電気素子および電気素子用トレイ
WO2019098012A1 (ja) 2017-11-16 2019-05-23 株式会社村田製作所 樹脂多層基板、電子部品およびその実装構造

Also Published As

Publication number Publication date
JPWO2021020019A1 (https=) 2021-02-04
US20220077555A1 (en) 2022-03-10
CN217062060U (zh) 2022-07-26
WO2021020019A1 (ja) 2021-02-04
US12046792B2 (en) 2024-07-23

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