JPWO2021020019A1 - - Google Patents

Info

Publication number
JPWO2021020019A1
JPWO2021020019A1 JP2021536858A JP2021536858A JPWO2021020019A1 JP WO2021020019 A1 JPWO2021020019 A1 JP WO2021020019A1 JP 2021536858 A JP2021536858 A JP 2021536858A JP 2021536858 A JP2021536858 A JP 2021536858A JP WO2021020019 A1 JPWO2021020019 A1 JP WO2021020019A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021536858A
Other languages
Japanese (ja)
Other versions
JP7143954B2 (ja
JPWO2021020019A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021020019A1 publication Critical patent/JPWO2021020019A1/ja
Publication of JPWO2021020019A5 publication Critical patent/JPWO2021020019A5/ja
Application granted granted Critical
Publication of JP7143954B2 publication Critical patent/JP7143954B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/088—Stacked transmission lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/003—Coplanar lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/10—Wire waveguides, i.e. with a single solid longitudinal conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Waveguides (AREA)
JP2021536858A 2019-07-31 2020-07-02 伝送線路基板および電子機器 Active JP7143954B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019141239 2019-07-31
JP2019141239 2019-07-31
PCT/JP2020/025996 WO2021020019A1 (ja) 2019-07-31 2020-07-02 伝送線路基板および電子機器

Publications (3)

Publication Number Publication Date
JPWO2021020019A1 true JPWO2021020019A1 (https=) 2021-02-04
JPWO2021020019A5 JPWO2021020019A5 (https=) 2022-01-12
JP7143954B2 JP7143954B2 (ja) 2022-09-29

Family

ID=74230587

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021536858A Active JP7143954B2 (ja) 2019-07-31 2020-07-02 伝送線路基板および電子機器

Country Status (4)

Country Link
US (1) US12046792B2 (https=)
JP (1) JP7143954B2 (https=)
CN (1) CN217062060U (https=)
WO (1) WO2021020019A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3173143U (ja) * 2010-12-03 2012-01-26 株式会社村田製作所 高周波信号線路
WO2016088592A1 (ja) * 2014-12-01 2016-06-09 株式会社村田製作所 電子機器、電気素子および電気素子用トレイ
WO2019098012A1 (ja) * 2017-11-16 2019-05-23 株式会社村田製作所 樹脂多層基板、電子部品およびその実装構造

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5041108B2 (ja) 2010-12-03 2012-10-03 株式会社村田製作所 高周波信号線路
JP6760540B2 (ja) * 2018-03-29 2020-09-23 株式会社村田製作所 伝送線路及びその実装構造

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3173143U (ja) * 2010-12-03 2012-01-26 株式会社村田製作所 高周波信号線路
WO2016088592A1 (ja) * 2014-12-01 2016-06-09 株式会社村田製作所 電子機器、電気素子および電気素子用トレイ
WO2019098012A1 (ja) * 2017-11-16 2019-05-23 株式会社村田製作所 樹脂多層基板、電子部品およびその実装構造

Also Published As

Publication number Publication date
JP7143954B2 (ja) 2022-09-29
US20220077555A1 (en) 2022-03-10
CN217062060U (zh) 2022-07-26
WO2021020019A1 (ja) 2021-02-04
US12046792B2 (en) 2024-07-23

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