JP7142453B2 - 放熱絶縁性樹脂組成物、及びそれを用いたプリント配線板 - Google Patents

放熱絶縁性樹脂組成物、及びそれを用いたプリント配線板 Download PDF

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Publication number
JP7142453B2
JP7142453B2 JP2018070150A JP2018070150A JP7142453B2 JP 7142453 B2 JP7142453 B2 JP 7142453B2 JP 2018070150 A JP2018070150 A JP 2018070150A JP 2018070150 A JP2018070150 A JP 2018070150A JP 7142453 B2 JP7142453 B2 JP 7142453B2
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Prior art keywords
heat
resin composition
dissipating
insulating resin
volume
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JP2018070150A
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English (en)
Japanese (ja)
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JP2019179910A (ja
JP2019179910A5 (enExample
Inventor
義和 大胡
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Taiyo Holdings Co Ltd
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Taiyo Ink Mfg Co Ltd
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Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Priority to JP2018070150A priority Critical patent/JP7142453B2/ja
Priority to PCT/JP2019/012839 priority patent/WO2019189171A1/ja
Priority to KR1020207030064A priority patent/KR102679624B1/ko
Priority to CN201980016406.XA priority patent/CN111788870B/zh
Priority to TW108111133A priority patent/TWI813658B/zh
Publication of JP2019179910A publication Critical patent/JP2019179910A/ja
Publication of JP2019179910A5 publication Critical patent/JP2019179910A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/10—Liquid materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Inorganic Insulating Materials (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Structure Of Printed Boards (AREA)
JP2018070150A 2018-03-30 2018-03-30 放熱絶縁性樹脂組成物、及びそれを用いたプリント配線板 Active JP7142453B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2018070150A JP7142453B2 (ja) 2018-03-30 2018-03-30 放熱絶縁性樹脂組成物、及びそれを用いたプリント配線板
PCT/JP2019/012839 WO2019189171A1 (ja) 2018-03-30 2019-03-26 放熱絶縁性樹脂組成物、及びそれを用いたプリント配線板
KR1020207030064A KR102679624B1 (ko) 2018-03-30 2019-03-26 방열 절연성 수지 조성물, 및 그것을 사용한 프린트 배선판
CN201980016406.XA CN111788870B (zh) 2018-03-30 2019-03-26 散热绝缘性树脂组合物和使用其的印刷电路板
TW108111133A TWI813658B (zh) 2018-03-30 2019-03-29 散熱絕緣性樹脂組成物及使用其之印刷配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018070150A JP7142453B2 (ja) 2018-03-30 2018-03-30 放熱絶縁性樹脂組成物、及びそれを用いたプリント配線板

Publications (3)

Publication Number Publication Date
JP2019179910A JP2019179910A (ja) 2019-10-17
JP2019179910A5 JP2019179910A5 (enExample) 2021-05-06
JP7142453B2 true JP7142453B2 (ja) 2022-09-27

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ID=68061822

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JP2018070150A Active JP7142453B2 (ja) 2018-03-30 2018-03-30 放熱絶縁性樹脂組成物、及びそれを用いたプリント配線板

Country Status (5)

Country Link
JP (1) JP7142453B2 (enExample)
KR (1) KR102679624B1 (enExample)
CN (1) CN111788870B (enExample)
TW (1) TWI813658B (enExample)
WO (1) WO2019189171A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102546928B1 (ko) 2020-04-28 2023-06-23 주식회사 파루인쇄전자 고열전도성 절연 페이스트를 이용한 방열장치
CN118055972B (zh) * 2021-10-04 2024-11-19 东京油墨株式会社 散热性间隙填料用树脂组合物、散热性间隙填料和物品

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007191519A (ja) 2006-01-17 2007-08-02 Taiyo Ink Mfg Ltd 放熱絶縁性樹脂組成物、及びそれを用いたプリント配線板
JP2012111807A (ja) 2010-11-22 2012-06-14 Uniplus Electronics Co Ltd 熱硬化性樹脂組成物及びその熱硬化性樹脂組成物を使用したプリプレグシート又は積層板
JP2017219862A (ja) 2017-08-29 2017-12-14 互応化学工業株式会社 感光性樹脂組成物、ドライフィルム、プリント配線板、及びプリント配線板の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06224561A (ja) 1993-01-25 1994-08-12 Ibiden Co Ltd 放熱構造プリント配線板及びその製造方法
JP3659825B2 (ja) 1997-12-19 2005-06-15 太陽インキ製造株式会社 アルカリ現像可能な光硬化性・熱硬化性組成物及びそれから得られる硬化皮膜
JP3989349B2 (ja) * 2002-09-30 2007-10-10 京セラケミカル株式会社 電子部品封止装置
JP5104507B2 (ja) * 2007-04-26 2012-12-19 日立化成工業株式会社 セミｉｐｎ型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにこれを用いたプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板
JP5497300B2 (ja) * 2008-02-07 2014-05-21 日東電工株式会社 無機−ポリマー複合材、粘着剤層および粘着フィルム
JP2012214612A (ja) * 2011-03-31 2012-11-08 Aica Kogyo Co Ltd シリコーン放熱部材
KR101333260B1 (ko) * 2012-02-10 2013-11-26 동현전자 주식회사 고열 전도성 절연 재료용 수지 조성물 및 절연 필름
KR101687394B1 (ko) * 2013-06-17 2016-12-16 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물 및 드라이 필름 솔더 레지스트
JP6428032B2 (ja) * 2014-08-06 2018-11-28 Jnc株式会社 樹脂組成物、それを用いた放熱塗料および電子部品

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007191519A (ja) 2006-01-17 2007-08-02 Taiyo Ink Mfg Ltd 放熱絶縁性樹脂組成物、及びそれを用いたプリント配線板
JP2012111807A (ja) 2010-11-22 2012-06-14 Uniplus Electronics Co Ltd 熱硬化性樹脂組成物及びその熱硬化性樹脂組成物を使用したプリプレグシート又は積層板
JP2017219862A (ja) 2017-08-29 2017-12-14 互応化学工業株式会社 感光性樹脂組成物、ドライフィルム、プリント配線板、及びプリント配線板の製造方法

Also Published As

Publication number Publication date
JP2019179910A (ja) 2019-10-17
TW201945511A (zh) 2019-12-01
CN111788870A (zh) 2020-10-16
KR20200136946A (ko) 2020-12-08
KR102679624B1 (ko) 2024-07-01
CN111788870B (zh) 2024-09-03
TWI813658B (zh) 2023-09-01
WO2019189171A1 (ja) 2019-10-03

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