JP7138407B2 - 接着剤組成物、接着シート、及び封止体 - Google Patents

接着剤組成物、接着シート、及び封止体 Download PDF

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Publication number
JP7138407B2
JP7138407B2 JP2019521263A JP2019521263A JP7138407B2 JP 7138407 B2 JP7138407 B2 JP 7138407B2 JP 2019521263 A JP2019521263 A JP 2019521263A JP 2019521263 A JP2019521263 A JP 2019521263A JP 7138407 B2 JP7138407 B2 JP 7138407B2
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JP
Japan
Prior art keywords
component
adhesive
adhesive composition
mass
sealing body
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Active
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JP2019521263A
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English (en)
Japanese (ja)
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JPWO2018221574A1 (ja
Inventor
健太 西嶋
樹 長谷川
幹広 樫尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
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Lintec Corp
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Publication date
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Publication of JPWO2018221574A1 publication Critical patent/JPWO2018221574A1/ja
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Publication of JP7138407B2 publication Critical patent/JP7138407B2/ja
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/04Sealing arrangements, e.g. against humidity
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
JP2019521263A 2017-05-31 2018-05-30 接着剤組成物、接着シート、及び封止体 Active JP7138407B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017107482 2017-05-31
JP2017107482 2017-05-31
PCT/JP2018/020734 WO2018221574A1 (ja) 2017-05-31 2018-05-30 接着剤組成物、接着シート、及び封止体

Publications (2)

Publication Number Publication Date
JPWO2018221574A1 JPWO2018221574A1 (ja) 2020-04-02
JP7138407B2 true JP7138407B2 (ja) 2022-09-16

Family

ID=64455333

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019521263A Active JP7138407B2 (ja) 2017-05-31 2018-05-30 接着剤組成物、接着シート、及び封止体

Country Status (4)

Country Link
JP (1) JP7138407B2 (zh)
KR (1) KR102483032B1 (zh)
TW (1) TWI758483B (zh)
WO (1) WO2018221574A1 (zh)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000007840A (ja) 1998-06-26 2000-01-11 Kureha Elastomer Kk ゴムシート
JP2001240838A (ja) 1999-12-21 2001-09-04 Tomoegawa Paper Co Ltd 半導体装置用接着剤組成物及び接着シート
JP2005260204A (ja) 2004-02-10 2005-09-22 Lintec Corp 半導体装置の製造方法
JP2008163344A (ja) 2008-01-22 2008-07-17 Nitto Denko Corp 電子部品固定用反応性接着剤組成物及びその接着シート
JP2016125042A (ja) 2015-01-08 2016-07-11 横浜ゴム株式会社 接着剤組成物、これを用いる光制御パネル、その製造方法、光学結像装置
WO2018047919A1 (ja) 2016-09-07 2018-03-15 リンテック株式会社 接着剤組成物、封止シート、及び封止体
WO2018047868A1 (ja) 2016-09-07 2018-03-15 リンテック株式会社 接着剤組成物、封止シート、及び封止体

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6361017A (ja) * 1986-08-29 1988-03-17 Sumitomo Chem Co Ltd 液状エポキシ封止材
JP5768718B2 (ja) 2009-11-18 2015-08-26 味の素株式会社 樹脂組成物
KR101045262B1 (ko) * 2009-12-21 2011-06-29 제일모직주식회사 스텔스 다이싱용 반도체용 접착 조성물 및 이를 이용한 접착 필름
CN107075335B (zh) * 2014-09-24 2020-02-14 东亚合成株式会社 粘接剂组合物和使用了其的带有粘接剂层的层叠体
WO2016175612A1 (ko) * 2015-04-29 2016-11-03 주식회사 엘지화학 반도체용 접착 필름

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000007840A (ja) 1998-06-26 2000-01-11 Kureha Elastomer Kk ゴムシート
JP2001240838A (ja) 1999-12-21 2001-09-04 Tomoegawa Paper Co Ltd 半導体装置用接着剤組成物及び接着シート
JP2005260204A (ja) 2004-02-10 2005-09-22 Lintec Corp 半導体装置の製造方法
JP2008163344A (ja) 2008-01-22 2008-07-17 Nitto Denko Corp 電子部品固定用反応性接着剤組成物及びその接着シート
JP2016125042A (ja) 2015-01-08 2016-07-11 横浜ゴム株式会社 接着剤組成物、これを用いる光制御パネル、その製造方法、光学結像装置
WO2018047919A1 (ja) 2016-09-07 2018-03-15 リンテック株式会社 接着剤組成物、封止シート、及び封止体
WO2018047868A1 (ja) 2016-09-07 2018-03-15 リンテック株式会社 接着剤組成物、封止シート、及び封止体

Also Published As

Publication number Publication date
TW201903103A (zh) 2019-01-16
TWI758483B (zh) 2022-03-21
KR102483032B1 (ko) 2022-12-29
KR20200015453A (ko) 2020-02-12
WO2018221574A1 (ja) 2018-12-06
JPWO2018221574A1 (ja) 2020-04-02

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