JP7132122B2 - 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体 - Google Patents

導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体 Download PDF

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JP7132122B2
JP7132122B2 JP2018535199A JP2018535199A JP7132122B2 JP 7132122 B2 JP7132122 B2 JP 7132122B2 JP 2018535199 A JP2018535199 A JP 2018535199A JP 2018535199 A JP2018535199 A JP 2018535199A JP 7132122 B2 JP7132122 B2 JP 7132122B2
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conductive
conductive portion
particles
conductive particles
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JPWO2018235909A1 (ja
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嘉代 大秦
茂雄 真原
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/12—Adsorbed ingredients, e.g. ingredients on carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Combinations Of Printed Boards (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2018535199A 2017-06-22 2018-06-21 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体 Active JP7132122B2 (ja)

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JP2021159162A JP7288487B2 (ja) 2017-06-22 2021-09-29 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体

Applications Claiming Priority (3)

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JP2017122388 2017-06-22
JP2017122388 2017-06-22
PCT/JP2018/023660 WO2018235909A1 (ja) 2017-06-22 2018-06-21 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体

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JPWO2018235909A1 JPWO2018235909A1 (ja) 2020-04-16
JP7132122B2 true JP7132122B2 (ja) 2022-09-06

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JP2021159162A Active JP7288487B2 (ja) 2017-06-22 2021-09-29 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体

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JP (2) JP7132122B2 (zh)
KR (2) KR102356887B1 (zh)
CN (2) CN115458206A (zh)
TW (1) TWI768068B (zh)
WO (1) WO2018235909A1 (zh)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011175951A (ja) 2009-08-06 2011-09-08 Hitachi Chem Co Ltd 導電性微粒子及び異方性導電材料
JP2014132542A (ja) 2012-01-11 2014-07-17 Hitachi Chemical Co Ltd 導電粒子、絶縁被覆導電粒子及び異方導電性接着剤
JP2014241280A (ja) 2013-05-14 2014-12-25 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP2015160958A (ja) 2014-02-26 2015-09-07 日立金属株式会社 導電性粒子、導電性粉体、導電性高分子組成物および異方性導電シート
JP2016006764A (ja) 2014-05-27 2016-01-14 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP2016015312A (ja) 2014-06-11 2016-01-28 積水化学工業株式会社 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5619675B2 (ja) 2010-08-16 2014-11-05 株式会社日本触媒 導電性微粒子および異方性導電材料
KR101614675B1 (ko) * 2013-09-12 2016-04-21 세키스이가가쿠 고교가부시키가이샤 도전성 입자, 도전 재료 및 접속 구조체
JP6641164B2 (ja) * 2014-12-04 2020-02-05 積水化学工業株式会社 基材粒子、導電性粒子、導電材料及び接続構造体

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011175951A (ja) 2009-08-06 2011-09-08 Hitachi Chem Co Ltd 導電性微粒子及び異方性導電材料
JP2014132542A (ja) 2012-01-11 2014-07-17 Hitachi Chemical Co Ltd 導電粒子、絶縁被覆導電粒子及び異方導電性接着剤
JP2014241280A (ja) 2013-05-14 2014-12-25 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP2015160958A (ja) 2014-02-26 2015-09-07 日立金属株式会社 導電性粒子、導電性粉体、導電性高分子組成物および異方性導電シート
JP2016006764A (ja) 2014-05-27 2016-01-14 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP2016015312A (ja) 2014-06-11 2016-01-28 積水化学工業株式会社 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体

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Publication number Publication date
WO2018235909A1 (ja) 2018-12-27
CN115458206A (zh) 2022-12-09
JP2022008631A (ja) 2022-01-13
CN110603612B (zh) 2022-08-30
KR20220016999A (ko) 2022-02-10
JP7288487B2 (ja) 2023-06-07
CN110603612A (zh) 2019-12-20
JPWO2018235909A1 (ja) 2020-04-16
KR102356887B1 (ko) 2022-02-03
KR20200021440A (ko) 2020-02-28
TWI768068B (zh) 2022-06-21
TW201905142A (zh) 2019-02-01

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