JP7127498B2 - 放熱部材及び電気接続箱 - Google Patents

放熱部材及び電気接続箱 Download PDF

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Publication number
JP7127498B2
JP7127498B2 JP2018211604A JP2018211604A JP7127498B2 JP 7127498 B2 JP7127498 B2 JP 7127498B2 JP 2018211604 A JP2018211604 A JP 2018211604A JP 2018211604 A JP2018211604 A JP 2018211604A JP 7127498 B2 JP7127498 B2 JP 7127498B2
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Japan
Prior art keywords
heat
substrate
long wall
wall portion
opposing plate
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Active
Application number
JP2018211604A
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English (en)
Japanese (ja)
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JP2020077820A (ja
Inventor
純也 愛知
潤 池田
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Sumitomo Wiring Systems Ltd
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Sumitomo Wiring Systems Ltd
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Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd filed Critical Sumitomo Wiring Systems Ltd
Priority to JP2018211604A priority Critical patent/JP7127498B2/ja
Priority to CN201910998852.7A priority patent/CN111180401B/zh
Priority to US16/665,407 priority patent/US11227811B2/en
Priority to DE102019129948.9A priority patent/DE102019129948A1/de
Publication of JP2020077820A publication Critical patent/JP2020077820A/ja
Application granted granted Critical
Publication of JP7127498B2 publication Critical patent/JP7127498B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Connection Or Junction Boxes (AREA)
JP2018211604A 2018-11-09 2018-11-09 放熱部材及び電気接続箱 Active JP7127498B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018211604A JP7127498B2 (ja) 2018-11-09 2018-11-09 放熱部材及び電気接続箱
CN201910998852.7A CN111180401B (zh) 2018-11-09 2019-10-21 散热部件及电连接箱
US16/665,407 US11227811B2 (en) 2018-11-09 2019-10-28 Heat radiating member and electrical junction box
DE102019129948.9A DE102019129948A1 (de) 2018-11-09 2019-11-06 Wärme abstrahlendes Bauelement und elektrischer Verteilerkasten

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018211604A JP7127498B2 (ja) 2018-11-09 2018-11-09 放熱部材及び電気接続箱

Publications (2)

Publication Number Publication Date
JP2020077820A JP2020077820A (ja) 2020-05-21
JP7127498B2 true JP7127498B2 (ja) 2022-08-30

Family

ID=70469142

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018211604A Active JP7127498B2 (ja) 2018-11-09 2018-11-09 放熱部材及び電気接続箱

Country Status (4)

Country Link
US (1) US11227811B2 (zh)
JP (1) JP7127498B2 (zh)
CN (1) CN111180401B (zh)
DE (1) DE102019129948A1 (zh)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009135141A (ja) 2007-11-28 2009-06-18 Panasonic Corp 半導体モジュールおよびその実装体
WO2010067725A1 (ja) 2008-12-12 2010-06-17 株式会社 村田製作所 回路モジュール
JP2011130558A (ja) 2009-12-16 2011-06-30 Autonetworks Technologies Ltd 電気接続箱
JP2015126095A (ja) 2013-12-26 2015-07-06 株式会社デンソー 電子制御装置
JP2016063064A (ja) 2014-09-18 2016-04-25 シャープ株式会社 放熱構造体、放熱構造体付き回路基板、および、テレビ装置
JP2016146427A (ja) 2015-02-09 2016-08-12 株式会社ジェイデバイス 半導体装置

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US6853068B1 (en) 2002-05-22 2005-02-08 Volterra Semiconductor Corporation Heatsinking and packaging of integrated circuit chips
JP4155048B2 (ja) * 2003-02-14 2008-09-24 住友電装株式会社 パワーモジュール及びその製造方法
JP4029822B2 (ja) 2003-10-27 2008-01-09 三菱電機株式会社 電子回路装置
JP4473141B2 (ja) * 2005-01-04 2010-06-02 日立オートモティブシステムズ株式会社 電子制御装置
PT2153115T (pt) * 2007-05-04 2021-09-06 Signify Holding Bv Luminárias baseadas em led e métodos relacionados para gestão térmica
US20090103267A1 (en) * 2007-10-17 2009-04-23 Andrew Dean Wieland Electronic assembly and method for making the electronic assembly
KR101463075B1 (ko) * 2008-02-04 2014-11-20 페어차일드코리아반도체 주식회사 히트 싱크 패키지
DE102011012673A1 (de) * 2010-03-17 2011-09-22 Hitachi Automotive Systems, Ltd. Elektronische Steuereinrichtung für Fahrzeuge
JP5418851B2 (ja) 2010-09-30 2014-02-19 株式会社デンソー 電子制御ユニット
JP4954356B1 (ja) * 2011-10-12 2012-06-13 日本碍子株式会社 大容量モジュールの周辺回路用の回路基板、及び当該回路基板を用いる周辺回路を含む大容量モジュール
JP5935598B2 (ja) * 2012-08-27 2016-06-15 株式会社デンソー 半導体装置
US9964266B2 (en) * 2013-07-05 2018-05-08 DMF, Inc. Unified driver and light source assembly for recessed lighting
US20150173243A1 (en) * 2013-12-13 2015-06-18 General Electric Company Integrated heat exchange assembly and an associated method thereof
DE102014105594A1 (de) 2014-04-17 2015-10-22 Conti Temic Microelectronic Gmbh Elektronisches system
US10520167B2 (en) * 2014-12-03 2019-12-31 Hubbell Incorporated Luminaire
JP6693706B2 (ja) * 2015-04-06 2020-05-13 株式会社デンソー 電子制御装置
WO2016163135A1 (ja) 2015-04-08 2016-10-13 三菱電機株式会社 電子モジュール及び電子装置
CA3102022C (en) * 2015-05-29 2023-04-25 DMF, Inc. Lighting module for recessed lighting systems
WO2017109878A1 (ja) * 2015-12-24 2017-06-29 三菱電機株式会社 高周波回路の電磁シールド構造及び高周波モジュール
CA2956668A1 (en) * 2016-01-29 2017-07-29 Systemex Energies International Inc. Apparatus and methods for cooling of an integrated circuit
JP2018063982A (ja) 2016-10-11 2018-04-19 本田技研工業株式会社 電子装置
JP6620725B2 (ja) * 2016-11-14 2019-12-18 株式会社オートネットワーク技術研究所 電気接続箱
CN106507651B (zh) 2016-12-30 2019-11-29 韩端科技（深圳）有限公司 电子设备
JP6958164B2 (ja) * 2017-05-23 2021-11-02 株式会社オートネットワーク技術研究所 コイル装置、基板付きコイル装置及び電気接続箱
JP6921710B2 (ja) * 2017-10-30 2021-08-18 日立Astemo株式会社 電子制御装置
CN109757043B (zh) * 2017-11-01 2021-03-23 光宝科技股份有限公司 开关装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009135141A (ja) 2007-11-28 2009-06-18 Panasonic Corp 半導体モジュールおよびその実装体
WO2010067725A1 (ja) 2008-12-12 2010-06-17 株式会社 村田製作所 回路モジュール
JP2011130558A (ja) 2009-12-16 2011-06-30 Autonetworks Technologies Ltd 電気接続箱
JP2015126095A (ja) 2013-12-26 2015-07-06 株式会社デンソー 電子制御装置
JP2016063064A (ja) 2014-09-18 2016-04-25 シャープ株式会社 放熱構造体、放熱構造体付き回路基板、および、テレビ装置
JP2016146427A (ja) 2015-02-09 2016-08-12 株式会社ジェイデバイス 半導体装置

Also Published As

Publication number Publication date
JP2020077820A (ja) 2020-05-21
US20200152544A1 (en) 2020-05-14
CN111180401B (zh) 2023-06-27
DE102019129948A1 (de) 2020-05-14
CN111180401A (zh) 2020-05-19
US11227811B2 (en) 2022-01-18

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