JP7124080B2 - 垂直集積マルチスペクトル撮像センサ、および垂直集積マルチスペクトル撮像センサを製造する方法 - Google Patents
垂直集積マルチスペクトル撮像センサ、および垂直集積マルチスペクトル撮像センサを製造する方法 Download PDFInfo
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- 238000000701 chemical imaging Methods 0.000 title claims description 34
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 102
- 229910021389 graphene Inorganic materials 0.000 claims description 101
- 239000002184 metal Substances 0.000 claims description 90
- 229910052751 metal Inorganic materials 0.000 claims description 90
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 48
- 239000000463 material Substances 0.000 claims description 34
- 229910052681 coesite Inorganic materials 0.000 claims description 24
- 229910052906 cristobalite Inorganic materials 0.000 claims description 24
- 239000000377 silicon dioxide Substances 0.000 claims description 24
- 235000012239 silicon dioxide Nutrition 0.000 claims description 24
- 229910052682 stishovite Inorganic materials 0.000 claims description 24
- 229910052905 tridymite Inorganic materials 0.000 claims description 24
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 23
- 229910052593 corundum Inorganic materials 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 23
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 23
- 238000000151 deposition Methods 0.000 claims description 19
- YBNMDCCMCLUHBL-UHFFFAOYSA-N (2,5-dioxopyrrolidin-1-yl) 4-pyren-1-ylbutanoate Chemical compound C=1C=C(C2=C34)C=CC3=CC=CC4=CC=C2C=1CCCC(=O)ON1C(=O)CCC1=O YBNMDCCMCLUHBL-UHFFFAOYSA-N 0.000 claims description 18
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 17
- 238000000059 patterning Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 16
- 238000000231 atomic layer deposition Methods 0.000 claims description 11
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 10
- 239000011148 porous material Substances 0.000 claims description 6
- 238000001228 spectrum Methods 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 137
- 238000009792 diffusion process Methods 0.000 description 18
- 230000004888 barrier function Effects 0.000 description 17
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- WILFBXOGIULNAF-UHFFFAOYSA-N copper sulfanylidenetin zinc Chemical compound [Sn]=S.[Zn].[Cu] WILFBXOGIULNAF-UHFFFAOYSA-N 0.000 description 1
- 238000002059 diagnostic imaging Methods 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000001429 visible spectrum Methods 0.000 description 1
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Description
Claims (18)
- 垂直集積マルチスペクトル撮像センサであって、
基板上に配置された第1の金属コンタクト層と、
前記第1の金属コンタクト層上に配置され、第1の検出器素子がその内部の孔に埋め込まれたSiO2層と、
前記第1の検出器素子を覆う第1のグラフェン層と、
前記第1のグラフェン層の一方の側で前記SiO2層上に配置された第2の金属コンタクト層であって、前記第2の金属コンタクト層の縁部が前記第1のグラフェン層の側面に接触する、前記第2の金属コンタクト層と、
前記SiO2層上に配置されたAl2O3層であって、該Al2O3層において第2の検出器素子が、前記第1のグラフェン層の上の孔に埋め込まれている、前記Al2O3層と、
前記第2の検出器素子上に配置された第2のグラフェン層と、
前記第2のグラフェン層に隣接して前記Al2O3層上に配置された第3の金属コンタクト層であって、前記第3の金属コンタクト層の縁部が前記第2のグラフェン層の側面に接触している、前記第3の金属コンタクト層と、
を含み、
前記第1の検出器素子の材料が、前記第2の検出器素子の材料とは異なる電磁スペクトルの波長帯域に感度がある、
垂直集積マルチスペクトル撮像センサ。 - 前記基板が、ガラス、シリコン・ウエハ、または可撓性材料から形成されている、請求
項1に記載の垂直集積マルチスペクトル撮像センサ。 - 前記第1のグラフェン層が、前記第1の検出器素子の縁部を越えて、前記SiO2層に部分的に重なるように延在する、請求項1に記載の垂直集積マルチスペクトル撮像センサ。
- 前記第1の金属コンタクト層が、前記基板上で長手方向に延在するストライプを形成する、請求項1に記載の垂直集積マルチスペクトル撮像センサ。
- 前記埋め込まれた第2の検出器素子の側面が、前記第1のグラフェン層の側面に連続して繋がる、請求項1に記載の垂直集積マルチスペクトル撮像センサ。
- 前記第2のグラフェン層が、前記第2の検出器素子の縁部を越えて、前記Al2O3層に部分的に重なるように延在する、請求項1に記載の垂直集積マルチスペクトル撮像センサ。
- 前記第2の金属コンタクト層が、前記第1の金属コンタクト層に対して垂直な幅方向に延在する、前記SiO2層上のストライプを形成する、請求項4に記載の垂直集積マルチスペクトル撮像センサ。
- 前記第3の金属コンタクト層が、前記第2の金属コンタクト層に対して垂直な長手方向に延在する、前記Al2O3層上のストライプを形成する、請求項7に記載の垂直集積マルチスペクトル撮像センサ。
- 前記第1の検出器素子および前記第2の検出器素子が、PbSe、PbS、またはCdSを含むグループからそれぞれ選択され、前記第1の検出器素子が前記第2の検出器素子とは異なる、請求項1に記載の垂直集積マルチスペクトル撮像センサ。
- 前記第1の金属コンタクト層、前記第2の金属コンタクト層、および前記第3の金属コンタクト層が、それぞれ導電性金属から形成されている、請求項1に記載の垂直集積マルチスペクトル撮像センサ。
- 垂直集積マルチスペクトル撮像センサを製造する方法であって、
基板上に第1の金属コンタクト層を堆積させ、前記第1の金属コンタクト層をパターニングするステップと、
前記基板および第1の金属コンタクト層の上にSiO2層を堆積させ、前記SiO2層をパターニングして、前記基板のほぼ中央に前記第1の金属コンタクト層を露出させる孔を形成するステップと、
前記孔に第1の検出器材料を堆積させるステップと、
グラフェン層を前記SiO2層上に転写し、前記グラフェン層をパターニングして、前記第1の検出器材料を覆う第1のグラフェン層を形成するステップと、
第2の金属コンタクト層を前記SiO2層上に堆積させ、パターニングするステップであって、前記第2の金属コンタクト層が前記第1のグラフェン層に隣接し、前記第1のグラフェン層と接触している、前記堆積させ、パターニングするステップと、
Al2O3層を前記SiO2層の上に堆積させるステップであって、Al2O3が前記第1のグラフェン層上に蓄積することなく、前記第1のグラフェン層を取り囲む孔を形成する、前記堆積させるステップと、
第2の検出器材料を前記第1のグラフェン層上の前記孔に堆積させるステップと、
別のグラフェン層を前記Al2O3層および前記第2の検出器材料上に転写し、前記グラフェン層をパターニングして、前記第2の検出器材料を覆う第2のグラフェン層を形成
するステップと、
第3の金属コンタクト層を前記Al2O3層上に堆積させ、パターニングするステップであって、前記第3の金属コンタクト層が前記第2のグラフェン層に隣接して接触している、前記堆積させ、パターニングするステップと、
を含み、
前記第1の検出器材料が、前記第2の検出器材料とは異なる電磁スペクトルの波長帯域に感度がある、
垂直集積マルチスペクトル撮像センサを製造する方法。 - 前記第1の金属コンタクト層が、前記基板上で長手方向に延在するストライプを形成するようにパターニングされる、請求項11に記載の方法。
- 前記第1の検出器材料および前記SiO2層の上面が、化学機械研磨(CMP)プロセスによって平滑化される、請求項11に記載の方法。
- 前記第2の金属コンタクト層が、前記第1の金属コンタクト層に対して垂直な、前記SiO2層上の幅方向に延在するストライプを形成するようにパターニングされる、請求項12に記載の方法。
- 前記第3の金属コンタクト層が、前記Al2O3層上で長手方向、かつ前記第2の金属コンタクト層に対して垂直に延在するストライプを形成するようにパターニングされる、請求項14に記載の方法。
- 前記Al2O3層を原子層堆積(ALD)によって堆積させる、請求項11に記載の方法。
- 前記第1の検出器材料および前記第2の検出器材料が、それぞれPbSe、PbS、またはCdSを含むグループから選択され、前記第1の検出器材料が、前記第2の検出器材料とは異なる、請求項11に記載の方法。
- 前記第1の金属コンタクト層、前記第2の金属コンタクト層、および前記第3の金属コンタクト層が、それぞれ導電性金属から形成されている、請求項11に記載の方法。
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PCT/IB2018/059296 WO2019106516A1 (en) | 2017-11-30 | 2018-11-26 | Vertically integrated multispectral imaging sensor with graphene as electrode and diffusion barrier |
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CN111328429A (zh) | 2020-06-23 |
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JP2021504950A (ja) | 2021-02-15 |
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