JP7122461B2 - 回路基体およびこれを備える放熱基体または電子装置 - Google Patents

回路基体およびこれを備える放熱基体または電子装置 Download PDF

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Publication number
JP7122461B2
JP7122461B2 JP2021509454A JP2021509454A JP7122461B2 JP 7122461 B2 JP7122461 B2 JP 7122461B2 JP 2021509454 A JP2021509454 A JP 2021509454A JP 2021509454 A JP2021509454 A JP 2021509454A JP 7122461 B2 JP7122461 B2 JP 7122461B2
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Japan
Prior art keywords
aluminum
substrate
circuit board
bonding layer
layer
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JP2021509454A
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English (en)
Japanese (ja)
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JPWO2020196528A1 (https=
Inventor
裕一 阿部
猛 宗石
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Kyocera Corp
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Kyocera Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950°C
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/259—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structural Engineering (AREA)
  • Metallurgy (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
JP2021509454A 2019-03-25 2020-03-24 回路基体およびこれを備える放熱基体または電子装置 Active JP7122461B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019056841 2019-03-25
JP2019056841 2019-03-25
PCT/JP2020/013039 WO2020196528A1 (ja) 2019-03-25 2020-03-24 回路基体およびこれを備える放熱基体または電子装置

Publications (2)

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JPWO2020196528A1 JPWO2020196528A1 (https=) 2020-10-01
JP7122461B2 true JP7122461B2 (ja) 2022-08-19

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JP2021509454A Active JP7122461B2 (ja) 2019-03-25 2020-03-24 回路基体およびこれを備える放熱基体または電子装置

Country Status (4)

Country Link
US (1) US12381120B2 (https=)
JP (1) JP7122461B2 (https=)
CN (1) CN113614261A (https=)
WO (1) WO2020196528A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7635360B2 (ja) * 2021-02-26 2025-02-25 京セラ株式会社 熱デバイス

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010016349A (ja) 2008-06-06 2010-01-21 Mitsubishi Materials Corp パワーモジュール用基板、パワーモジュール及びパワーモジュール用基板の製造方法
JP2017135197A (ja) 2016-01-26 2017-08-03 京セラ株式会社 回路基板

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US6107638A (en) * 1997-03-14 2000-08-22 Kabushiki Kaisha Toshiba Silicon nitride circuit substrate and semiconductor device containing same
JP3907818B2 (ja) 1997-03-14 2007-04-18 株式会社東芝 窒化珪素回路基板、半導体装置及び窒化珪素回路基板の製造方法
US6528123B1 (en) * 2000-06-28 2003-03-04 Sandia Corporation Coating system to permit direct brazing of ceramics
KR101400699B1 (ko) * 2007-05-18 2014-05-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 기판 및 반도체 장치 및 그 제조 방법
KR20110033117A (ko) 2008-06-06 2011-03-30 미쓰비시 마테리알 가부시키가이샤 파워 모듈용 기판, 파워 모듈, 및 파워 모듈용 기판의 제조 방법
KR101675727B1 (ko) * 2010-03-09 2016-11-14 주식회사 케이씨씨 금속접합 세라믹기판
JP5191527B2 (ja) 2010-11-19 2013-05-08 日本発條株式会社 積層体および積層体の製造方法
JP5743503B2 (ja) 2010-11-29 2015-07-01 京セラ株式会社 ろう材およびこれを用いた回路基板ならびに電子装置
CN102593009B (zh) * 2011-01-11 2016-02-17 三菱综合材料株式会社 电源模块用基板的制造方法、电源模块用基板和电源模块
JP5548167B2 (ja) * 2011-07-11 2014-07-16 日本発條株式会社 積層体及び積層体の製造方法
EP2811513B1 (en) * 2012-02-01 2019-12-18 Mitsubishi Materials Corporation Method for producing substrate for power modules
JP6044097B2 (ja) * 2012-03-30 2016-12-14 三菱マテリアル株式会社 ヒートシンク付パワーモジュール用基板、冷却器付パワーモジュール用基板及びパワーモジュール
JP6085968B2 (ja) * 2012-12-27 2017-03-01 三菱マテリアル株式会社 金属部材付パワーモジュール用基板、金属部材付パワーモジュール、及び金属部材付パワーモジュール用基板の製造方法
CN105189109B (zh) * 2013-03-14 2017-04-05 三菱综合材料株式会社 接合体、功率模块用基板及自带散热器的功率模块用基板
JP6432466B2 (ja) * 2014-08-26 2018-12-05 三菱マテリアル株式会社 接合体、ヒートシンク付パワーモジュール用基板、ヒートシンク、接合体の製造方法、ヒートシンク付パワーモジュール用基板の製造方法、及び、ヒートシンクの製造方法
EP3208839B1 (en) * 2014-10-16 2021-07-28 Mitsubishi Materials Corporation Substrate with cooler for power modules and method for producing same
JP6729224B2 (ja) * 2015-11-26 2020-07-22 三菱マテリアル株式会社 セラミックス／アルミニウム接合体、絶縁回路基板、パワーモジュール、ｌｅｄモジュール、熱電モジュール
JP6904088B2 (ja) * 2016-06-30 2021-07-14 三菱マテリアル株式会社 銅／セラミックス接合体、及び、絶縁回路基板
CN108682659B (zh) * 2018-05-16 2019-09-13 江苏芯澄半导体有限公司 一种用于新能源汽车的宽禁带半导体碳化硅功率器件封装结构

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JP2010016349A (ja) 2008-06-06 2010-01-21 Mitsubishi Materials Corp パワーモジュール用基板、パワーモジュール及びパワーモジュール用基板の製造方法
JP2017135197A (ja) 2016-01-26 2017-08-03 京セラ株式会社 回路基板

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US20220189837A1 (en) 2022-06-16
US12381120B2 (en) 2025-08-05
JPWO2020196528A1 (https=) 2020-10-01
CN113614261A (zh) 2021-11-05
WO2020196528A1 (ja) 2020-10-01

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