JPWO2020196528A1 - - Google Patents

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Publication number
JPWO2020196528A1
JPWO2020196528A1 JP2021509454A JP2021509454A JPWO2020196528A1 JP WO2020196528 A1 JPWO2020196528 A1 JP WO2020196528A1 JP 2021509454 A JP2021509454 A JP 2021509454A JP 2021509454 A JP2021509454 A JP 2021509454A JP WO2020196528 A1 JPWO2020196528 A1 JP WO2020196528A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021509454A
Other languages
Japanese (ja)
Other versions
JP7122461B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020196528A1 publication Critical patent/JPWO2020196528A1/ja
Application granted granted Critical
Publication of JP7122461B2 publication Critical patent/JP7122461B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950°C
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/259—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structural Engineering (AREA)
  • Metallurgy (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
JP2021509454A 2019-03-25 2020-03-24 回路基体およびこれを備える放熱基体または電子装置 Active JP7122461B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019056841 2019-03-25
JP2019056841 2019-03-25
PCT/JP2020/013039 WO2020196528A1 (ja) 2019-03-25 2020-03-24 回路基体およびこれを備える放熱基体または電子装置

Publications (2)

Publication Number Publication Date
JPWO2020196528A1 true JPWO2020196528A1 (https=) 2020-10-01
JP7122461B2 JP7122461B2 (ja) 2022-08-19

Family

ID=72608480

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021509454A Active JP7122461B2 (ja) 2019-03-25 2020-03-24 回路基体およびこれを備える放熱基体または電子装置

Country Status (4)

Country Link
US (1) US12381120B2 (https=)
JP (1) JP7122461B2 (https=)
CN (1) CN113614261A (https=)
WO (1) WO2020196528A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116888424A (zh) * 2021-02-26 2023-10-13 京瓷株式会社 热器件

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11154719A (ja) * 1997-03-14 1999-06-08 Toshiba Corp 窒化珪素回路基板、半導体装置及び窒化珪素回路基板の製造方法
US6528123B1 (en) * 2000-06-28 2003-03-04 Sandia Corporation Coating system to permit direct brazing of ceramics
JP2010016349A (ja) * 2008-06-06 2010-01-21 Mitsubishi Materials Corp パワーモジュール用基板、パワーモジュール及びパワーモジュール用基板の製造方法
JP2017135197A (ja) * 2016-01-26 2017-08-03 京セラ株式会社 回路基板

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6107638A (en) * 1997-03-14 2000-08-22 Kabushiki Kaisha Toshiba Silicon nitride circuit substrate and semiconductor device containing same
KR101400699B1 (ko) * 2007-05-18 2014-05-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 기판 및 반도체 장치 및 그 제조 방법
KR20110033117A (ko) 2008-06-06 2011-03-30 미쓰비시 마테리알 가부시키가이샤 파워 모듈용 기판, 파워 모듈, 및 파워 모듈용 기판의 제조 방법
KR101675727B1 (ko) * 2010-03-09 2016-11-14 주식회사 케이씨씨 금속접합 세라믹기판
JP5191527B2 (ja) 2010-11-19 2013-05-08 日本発條株式会社 積層体および積層体の製造方法
JP5743503B2 (ja) 2010-11-29 2015-07-01 京セラ株式会社 ろう材およびこれを用いた回路基板ならびに電子装置
CN102593009B (zh) * 2011-01-11 2016-02-17 三菱综合材料株式会社 电源模块用基板的制造方法、电源模块用基板和电源模块
JP5548167B2 (ja) * 2011-07-11 2014-07-16 日本発條株式会社 積層体及び積層体の製造方法
EP2811513B1 (en) * 2012-02-01 2019-12-18 Mitsubishi Materials Corporation Method for producing substrate for power modules
JP6044097B2 (ja) * 2012-03-30 2016-12-14 三菱マテリアル株式会社 ヒートシンク付パワーモジュール用基板、冷却器付パワーモジュール用基板及びパワーモジュール
JP6085968B2 (ja) * 2012-12-27 2017-03-01 三菱マテリアル株式会社 金属部材付パワーモジュール用基板、金属部材付パワーモジュール、及び金属部材付パワーモジュール用基板の製造方法
CN105189109B (zh) * 2013-03-14 2017-04-05 三菱综合材料株式会社 接合体、功率模块用基板及自带散热器的功率模块用基板
JP6432466B2 (ja) * 2014-08-26 2018-12-05 三菱マテリアル株式会社 接合体、ヒートシンク付パワーモジュール用基板、ヒートシンク、接合体の製造方法、ヒートシンク付パワーモジュール用基板の製造方法、及び、ヒートシンクの製造方法
EP3208839B1 (en) * 2014-10-16 2021-07-28 Mitsubishi Materials Corporation Substrate with cooler for power modules and method for producing same
JP6729224B2 (ja) * 2015-11-26 2020-07-22 三菱マテリアル株式会社 セラミックス／アルミニウム接合体、絶縁回路基板、パワーモジュール、ｌｅｄモジュール、熱電モジュール
JP6904088B2 (ja) * 2016-06-30 2021-07-14 三菱マテリアル株式会社 銅／セラミックス接合体、及び、絶縁回路基板
CN108682659B (zh) * 2018-05-16 2019-09-13 江苏芯澄半导体有限公司 一种用于新能源汽车的宽禁带半导体碳化硅功率器件封装结构

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11154719A (ja) * 1997-03-14 1999-06-08 Toshiba Corp 窒化珪素回路基板、半導体装置及び窒化珪素回路基板の製造方法
US6528123B1 (en) * 2000-06-28 2003-03-04 Sandia Corporation Coating system to permit direct brazing of ceramics
JP2010016349A (ja) * 2008-06-06 2010-01-21 Mitsubishi Materials Corp パワーモジュール用基板、パワーモジュール及びパワーモジュール用基板の製造方法
JP2017135197A (ja) * 2016-01-26 2017-08-03 京セラ株式会社 回路基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116888424A (zh) * 2021-02-26 2023-10-13 京瓷株式会社 热器件

Also Published As

Publication number Publication date
US20220189837A1 (en) 2022-06-16
JP7122461B2 (ja) 2022-08-19
US12381120B2 (en) 2025-08-05
CN113614261A (zh) 2021-11-05
WO2020196528A1 (ja) 2020-10-01

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