JP7114499B2 - 表面処理銅箔、銅張積層板及びプリント配線板 - Google Patents

表面処理銅箔、銅張積層板及びプリント配線板 Download PDF

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Publication number
JP7114499B2
JP7114499B2 JP2019014795A JP2019014795A JP7114499B2 JP 7114499 B2 JP7114499 B2 JP 7114499B2 JP 2019014795 A JP2019014795 A JP 2019014795A JP 2019014795 A JP2019014795 A JP 2019014795A JP 7114499 B2 JP7114499 B2 JP 7114499B2
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Japan
Prior art keywords
copper foil
treatment layer
layer
treated
treated copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2019014795A
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English (en)
Japanese (ja)
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JP2020122189A (ja
Inventor
郁浩 五刀
敦史 三木
宣明 宮本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Priority to JP2019014795A priority Critical patent/JP7114499B2/ja
Priority to PCT/JP2019/046454 priority patent/WO2020158140A1/fr
Priority to TW108144080A priority patent/TWI716210B/zh
Publication of JP2020122189A publication Critical patent/JP2020122189A/ja
Application granted granted Critical
Publication of JP7114499B2 publication Critical patent/JP7114499B2/ja
Active legal-status Critical Current
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16—Electroplating with layers of varying thickness
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2019014795A 2019-01-30 2019-01-30 表面処理銅箔、銅張積層板及びプリント配線板 Active JP7114499B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2019014795A JP7114499B2 (ja) 2019-01-30 2019-01-30 表面処理銅箔、銅張積層板及びプリント配線板
PCT/JP2019/046454 WO2020158140A1 (fr) 2019-01-30 2019-11-27 Feuille de cuivre traitée en surface, carte stratifiée cuivrée, et carte de circuit imprimé
TW108144080A TWI716210B (zh) 2019-01-30 2019-12-03 表面處理銅箔、覆銅積層板及印刷配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019014795A JP7114499B2 (ja) 2019-01-30 2019-01-30 表面処理銅箔、銅張積層板及びプリント配線板

Publications (2)

Publication Number Publication Date
JP2020122189A JP2020122189A (ja) 2020-08-13
JP7114499B2 true JP7114499B2 (ja) 2022-08-08

Family

ID=71842054

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019014795A Active JP7114499B2 (ja) 2019-01-30 2019-01-30 表面処理銅箔、銅張積層板及びプリント配線板

Country Status (3)

Country Link
JP (1) JP7114499B2 (fr)
TW (1) TWI716210B (fr)
WO (1) WO2020158140A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7114500B2 (ja) * 2019-01-30 2022-08-08 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
WO2022138837A1 (fr) * 2020-12-24 2022-06-30 日本製鉄株式会社 Matériau à base de titane
CN116997684A (zh) * 2021-03-26 2023-11-03 三井金属矿业株式会社 粗糙化处理铜箔、带载体铜箔、覆铜层叠板及印刷电路板
CN116997683A (zh) * 2021-03-26 2023-11-03 三井金属矿业株式会社 粗糙化处理铜箔、带载体铜箔、覆铜层叠板及印刷电路板
JPWO2022255420A1 (fr) * 2021-06-03 2022-12-08
CN117062943A (zh) * 2021-07-09 2023-11-14 Ｊｘ金属株式会社 表面处理铜箔、覆铜积层板及印刷配线板
CN117769491A (zh) 2021-08-06 2024-03-26 索尼集团公司 铜箔层压板及印刷线路板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013155415A (ja) 2012-01-31 2013-08-15 Furukawa Electric Co Ltd:The 高周波伝送用表面処理銅箔、高周波伝送用積層板及び高周波伝送用プリント配線板
WO2017051898A1 (fr) 2015-09-24 2017-03-30 Ｊｘ金属株式会社 Feuille métallique, feuille métallique pourvue d'une couche de séparation, corps stratifié, carte de circuit imprimé, boîtier de semi-conducteur, appareil électronique, et procédé de production d'une carte de circuit imprimé
WO2017051906A1 (fr) 2015-09-24 2017-03-30 Ｊｘ金属株式会社 Feuille métallique, feuille métallique comportant une couche antiadhésive, corps stratifié, carte de circuit imprimé, boîtier de semi-conducteur, appareil électronique et procédé de production de carte de circuit imprimé

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007268596A (ja) * 2006-03-31 2007-10-18 Nikko Kinzoku Kk 粗化処理用銅合金箔
JP5416037B2 (ja) * 2009-05-29 2014-02-12 Ｊｘ日鉱日石金属株式会社 リチウム電池集電体用圧延銅箔
JP2016036829A (ja) * 2014-08-07 2016-03-22 Jx日鉱日石金属株式会社 圧延銅箔及びそれを用いた二次電池用集電体
JP2018122590A (ja) * 2017-02-02 2018-08-09 Ｊｘ金属株式会社 離型層付き金属箔、金属箔、積層体、プリント配線板、半導体パッケージ、電子機器及びプリント配線板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013155415A (ja) 2012-01-31 2013-08-15 Furukawa Electric Co Ltd:The 高周波伝送用表面処理銅箔、高周波伝送用積層板及び高周波伝送用プリント配線板
WO2017051898A1 (fr) 2015-09-24 2017-03-30 Ｊｘ金属株式会社 Feuille métallique, feuille métallique pourvue d'une couche de séparation, corps stratifié, carte de circuit imprimé, boîtier de semi-conducteur, appareil électronique, et procédé de production d'une carte de circuit imprimé
WO2017051906A1 (fr) 2015-09-24 2017-03-30 Ｊｘ金属株式会社 Feuille métallique, feuille métallique comportant une couche antiadhésive, corps stratifié, carte de circuit imprimé, boîtier de semi-conducteur, appareil électronique et procédé de production de carte de circuit imprimé

Also Published As

Publication number Publication date
JP2020122189A (ja) 2020-08-13
WO2020158140A1 (fr) 2020-08-06
TWI716210B (zh) 2021-01-11
TW202028484A (zh) 2020-08-01

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