JP7102609B2 - ウェハレベルシステムパッケージング方法及びパッケージング構造 - Google Patents
ウェハレベルシステムパッケージング方法及びパッケージング構造 Download PDFInfo
- Publication number
- JP7102609B2 JP7102609B2 JP2021510384A JP2021510384A JP7102609B2 JP 7102609 B2 JP7102609 B2 JP 7102609B2 JP 2021510384 A JP2021510384 A JP 2021510384A JP 2021510384 A JP2021510384 A JP 2021510384A JP 7102609 B2 JP7102609 B2 JP 7102609B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- packaging
- conductive
- side wall
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004806 packaging method and process Methods 0.000 title claims description 200
- 238000000034 method Methods 0.000 title claims description 68
- 239000004020 conductor Substances 0.000 claims description 76
- 239000000463 material Substances 0.000 claims description 31
- 230000008569 process Effects 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 238000005530 etching Methods 0.000 claims description 9
- 238000001746 injection moulding Methods 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000010329 laser etching Methods 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 2
- 239000007924 injection Substances 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 claims 14
- 239000000758 substrate Substances 0.000 description 18
- 230000000694 effects Effects 0.000 description 13
- 238000010586 diagram Methods 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 230000005684 electric field Effects 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229910052732 germanium Inorganic materials 0.000 description 4
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/07—Structure, shape, material or disposition of the bonding areas after the connecting process
- H01L24/09—Structure, shape, material or disposition of the bonding areas after the connecting process of a plurality of bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/07—Structure, shape, material or disposition of the bonding areas after the connecting process
- H01L2224/08—Structure, shape, material or disposition of the bonding areas after the connecting process of an individual bonding area
- H01L2224/081—Disposition
- H01L2224/0812—Disposition the bonding area connecting directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/08135—Disposition the bonding area connecting directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding the bonding area connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/08145—Disposition the bonding area connecting directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding the bonding area connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/07—Structure, shape, material or disposition of the bonding areas after the connecting process
- H01L24/08—Structure, shape, material or disposition of the bonding areas after the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/94—Batch processes at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Semiconductor Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
Claims (20)
- ウェハレベルシステムパッケージング方法であって、
デバイスウェハと、前記デバイスウェハ上に接合された複数のチップとを含む接合構造を形成するステップであって、複数の前記チップのうち遮蔽すべきであるチップを、1つ又は複数の第1チップとするステップと、
複数の前記チップを被覆するパッケージング層を形成するステップと、
各前記第1チップを囲むトレンチを前記パッケージング層内に形成するステップと、
導電性材料を前記トレンチ内と前記第1チップの上方における前記パッケージング層の表面に形成するステップであって、前記トレンチ内に位置する前記導電性材料は、導電性側壁であり、前記第1チップの上方における前記パッケージング層の表面に位置する前記導電性材料は、前記導電性側壁に接続されて前記導電性側壁と共に遮蔽ケースを構成するための導電層であるステップと、を含み、
前記デバイスウェハには、片面が前記デバイスウェハから露出するとともに前記パッケージング層と当接する複数の第2チップが埋設され、
前記第1チップは、隣接する二つの前記第2チップの間に位置し、
前記導電性側壁は、積層方向において前記パッケージング層を貫通し、前記第1チップ及び前記第2チップと接触しないように前記第1チップと前記第2チップとの間に位置する、
ことを特徴とするウェハレベルシステムパッケージング方法。 - 前記導電性材料を前記トレンチ内と前記パッケージング層の表面に形成するステップは、
前記導電性材料を前記パッケージング層に被覆するステップと、
前記導電性材料の一部を除去し、且つ各前記第1チップの上方における前記パッケージング層の表面の前記導電性材料を保留するステップであって、保留された前記導電性材料は前記導電層であるステップと、を含む、
ことを特徴とする請求項1に記載のパッケージング方法。 - 前記導電性側壁の前記第1チップと背向する面を外側面とし、
前記導電性材料の一部を除去し、且つ前記第1チップの上方におけるパッケージング層の表面の前記導電性材料を保留するステップは、
マスク層を前記第1チップの上方における前記導電性材料に形成するステップであって、前記マスク層は、前記第1チップの上方における前記導電層を遮蔽し、且つ前記マスク層の側壁は、前記外側面に位置合わせされるステップと、
前記マスク層から露出する前記導電性材料を除去するステップと、を含む、
ことを特徴とする請求項2に記載のパッケージング方法。 - エッチングプロセスによって前記トレンチを形成する、
ことを特徴とする請求項1に記載のパッケージング方法。 - 前記エッチングプロセスはレーザエッチングプロセスである、
ことを特徴とする請求項4に記載のパッケージング方法。 - 前記導電性材料は金属であり、電気メッキプロセスによって前記金属を形成する、
ことを特徴とする請求項1に記載のパッケージング方法。 - 前記パッケージング層の材料はポリマー又は誘電体である、
ことを特徴とする請求項1に記載のパッケージング方法。 - 射出成形プロセスによって前記パッケージング層を形成する、
ことを特徴とする請求項1に記載のパッケージング方法。 - 前記トレンチにおいて前記デバイスウェハを露出させ、又は、前記トレンチの底部が前記パッケージング層内に位置する、
ことを特徴とする請求項1に記載のパッケージング方法。 - 前記第1チップを囲む前記トレンチを前記パッケージング層内に形成するステップにおいて、前記トレンチの幅は10~50μmの範囲にある、
ことを特徴とする請求項1に記載のパッケージング方法。 - 前記トレンチの前記第1チップ寄りの側壁を内側壁とし、
前記内側壁と前記第1チップとのピッチは、5~100μmの範囲にある、
ことを特徴とする請求項1に記載のパッケージング方法。 - ウェハレベルシステムパッケージング構造であって、
デバイスウェハと、
前記デバイスウェハ上に接合された複数のチップであって、複数の前記チップのうち遮蔽すべきであるチップを、1つ又は複数の第1チップとする複数のチップと、
複数の前記チップを被覆するパッケージング層と、
前記パッケージング層内に位置し、且つ各前記第1チップを囲む導電性側壁と、
前記第1チップの上方における前記パッケージング層の表面に位置する導電層であって、前記導電性側壁に接続されて前記導電性側壁と共に遮蔽ケースを構成するために用いられる導電層と、を含み、
前記デバイスウェハには、片面が前記デバイスウェハから露出するとともに前記パッケージング層と当接する複数の第2チップが埋設され、
前記第1チップは、隣接する二つの前記第2チップの間に位置し、
前記導電性側壁は、積層方向において前記パッケージング層を貫通し、前記第1チップ及び前記第2チップと接触しないように前記第1チップと前記第2チップとの間に位置する、
ことを特徴とするウェハレベルシステムパッケージング構造。 - 前記導電層は、各前記第1チップの上方における前記パッケージング層を部分的に被覆する、
ことを特徴とする請求項12に記載のパッケージング構造。 - 前記パッケージング層には前記導電層が被覆され、前記導電層は、前記第1チップの上方に位置し、且つ前記導電性側壁に接続される、
ことを特徴とする請求項12に記載のパッケージング構造。 - 前記遮蔽ケースの材料は金属である、
ことを特徴とする請求項12に記載のパッケージング構造。 - 前記パッケージング層の材料はポリマー又は誘電体である、
ことを特徴とする請求項12に記載のパッケージング構造。 - 前記パッケージング層は射出成形層である、
ことを特徴とする請求項12に記載のパッケージング構造。 - 前記導電性側壁の底部は、前記デバイスウェハに接触し、又は、前記導電性側壁の底部は、前記パッケージング層内に位置する、
ことを特徴とする請求項12に記載のパッケージング構造。 - 前記導電性側壁の厚さは、10~50μmの範囲にある、
ことを特徴とする請求項12に記載のパッケージング構造。 - 前記導電性側壁の前記第1チップ寄りの側壁を内側壁とし、
前記内側壁と前記第1チップとのピッチは、5~100μmの範囲にある、
ことを特徴とする請求項12に記載のパッケージング構造。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811028265.7A CN110875281B (zh) | 2018-09-04 | 2018-09-04 | 晶圆级系统封装方法以及封装结构 |
CN201811028265.7 | 2018-09-04 | ||
PCT/CN2018/113108 WO2020047976A1 (zh) | 2018-09-04 | 2018-10-31 | 晶圆级系统封装方法以及封装结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021535606A JP2021535606A (ja) | 2021-12-16 |
JP7102609B2 true JP7102609B2 (ja) | 2022-07-19 |
Family
ID=69641645
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021510384A Active JP7102609B2 (ja) | 2018-09-04 | 2018-10-31 | ウェハレベルシステムパッケージング方法及びパッケージング構造 |
Country Status (2)
Country | Link |
---|---|
US (1) | US10910286B2 (ja) |
JP (1) | JP7102609B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11276649B2 (en) * | 2019-06-28 | 2022-03-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Devices and methods having magnetic shielding layer |
CN112259528A (zh) * | 2020-09-28 | 2021-01-22 | 立讯电子科技(昆山)有限公司 | 具有双面选择性电磁屏蔽封装的sip结构及其制备方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100207257A1 (en) | 2009-02-17 | 2010-08-19 | Advanced Semiconductor Engineering, Inc. | Semiconductor package and manufacturing method thereof |
CN103035591A (zh) | 2012-12-28 | 2013-04-10 | 日月光半导体制造股份有限公司 | 半导体封装件及其制造方法 |
CN106898580A (zh) | 2015-12-18 | 2017-06-27 | 中芯国际集成电路制造(上海)有限公司 | 芯片保护环、半导体芯片、半导体晶圆及封装方法 |
CN107104094A (zh) | 2016-02-22 | 2017-08-29 | 矽品精密工业股份有限公司 | 封装结构及其制法 |
CN107248509A (zh) | 2017-07-14 | 2017-10-13 | 中芯长电半导体(江阴)有限公司 | Emi防护的芯片封装结构及封装方法 |
JP2017191835A (ja) | 2016-04-12 | 2017-10-19 | Tdk株式会社 | 電子回路モジュール及びその製造方法 |
CN107481977A (zh) | 2017-08-21 | 2017-12-15 | 华进半导体封装先导技术研发中心有限公司 | 一种晶圆级扇出型封装结构及封装方法 |
CN108346639A (zh) | 2017-09-30 | 2018-07-31 | 中芯集成电路(宁波)有限公司 | 一种晶圆级系统封装方法以及封装结构 |
US20190103365A1 (en) | 2017-09-29 | 2019-04-04 | Nxp Usa, Inc. | Selectively shielded semiconductor package |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7989928B2 (en) * | 2008-02-05 | 2011-08-02 | Advanced Semiconductor Engineering Inc. | Semiconductor device packages with electromagnetic interference shielding |
US9820373B2 (en) * | 2014-06-26 | 2017-11-14 | Apple Inc. | Thermal solutions for system-in-package assemblies in portable electronic devices |
KR101858952B1 (ko) | 2016-05-13 | 2018-05-18 | 주식회사 네패스 | 반도체 패키지 및 이의 제조 방법 |
-
2018
- 2018-10-31 JP JP2021510384A patent/JP7102609B2/ja active Active
- 2018-12-20 US US16/227,978 patent/US10910286B2/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100207257A1 (en) | 2009-02-17 | 2010-08-19 | Advanced Semiconductor Engineering, Inc. | Semiconductor package and manufacturing method thereof |
CN103035591A (zh) | 2012-12-28 | 2013-04-10 | 日月光半导体制造股份有限公司 | 半导体封装件及其制造方法 |
CN106898580A (zh) | 2015-12-18 | 2017-06-27 | 中芯国际集成电路制造(上海)有限公司 | 芯片保护环、半导体芯片、半导体晶圆及封装方法 |
CN107104094A (zh) | 2016-02-22 | 2017-08-29 | 矽品精密工业股份有限公司 | 封装结构及其制法 |
JP2017191835A (ja) | 2016-04-12 | 2017-10-19 | Tdk株式会社 | 電子回路モジュール及びその製造方法 |
CN107248509A (zh) | 2017-07-14 | 2017-10-13 | 中芯长电半导体(江阴)有限公司 | Emi防护的芯片封装结构及封装方法 |
CN107481977A (zh) | 2017-08-21 | 2017-12-15 | 华进半导体封装先导技术研发中心有限公司 | 一种晶圆级扇出型封装结构及封装方法 |
US20190103365A1 (en) | 2017-09-29 | 2019-04-04 | Nxp Usa, Inc. | Selectively shielded semiconductor package |
CN108346639A (zh) | 2017-09-30 | 2018-07-31 | 中芯集成电路(宁波)有限公司 | 一种晶圆级系统封装方法以及封装结构 |
Also Published As
Publication number | Publication date |
---|---|
US10910286B2 (en) | 2021-02-02 |
JP2021535606A (ja) | 2021-12-16 |
US20200075442A1 (en) | 2020-03-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11961867B2 (en) | Electronic device package and fabricating method thereof | |
KR101870157B1 (ko) | 절연 프레임을 이용하여 제조된 반도체 패키지 및 이의 제조방법 | |
KR101644692B1 (ko) | 반도체 장치 및 그 제조 방법 | |
US9613877B2 (en) | Semiconductor packages and methods for forming semiconductor package | |
KR100659625B1 (ko) | 반도체 장치 및 그 제조 방법 | |
US20080014678A1 (en) | System and method of attenuating electromagnetic interference with a grounded top film | |
EP2291858B1 (en) | Packaged semiconductor product and method for manufacture thereof | |
KR101046250B1 (ko) | 반도체 패키지의 전자파 차폐장치 | |
KR20090080527A (ko) | 반도체 디바이스 및 사전에 제조된 콘넥터를 패키징하는 방법 | |
CN103943641B (zh) | 半导体晶片封装体及其制造方法 | |
CN104617036A (zh) | 晶圆级芯片尺寸封装中通孔互连的制作方法 | |
JP7102609B2 (ja) | ウェハレベルシステムパッケージング方法及びパッケージング構造 | |
CN106876364A (zh) | 半导体封装件及其制造方法 | |
TWI720839B (zh) | 晶片封裝結構及其製造方法 | |
US10978421B2 (en) | Wafer-level packaging method and package structure | |
CN105097720A (zh) | 封装结构的形成方法 | |
TW201642362A (zh) | 晶片封裝體及其製造方法 | |
CN110875281B (zh) | 晶圆级系统封装方法以及封装结构 | |
US20070284702A1 (en) | Semiconductor device having a bonding pad and fuse and method for forming the same | |
TW201432865A (zh) | 晶片封裝結構及其製作方法 | |
TWI281738B (en) | Structure and assembly method of IC packaging | |
CN111640734B (zh) | 一种芯片封装体 | |
CN109196668B (zh) | 发光器件的封装方法、封装结构及电子设备 | |
US20240203847A1 (en) | Semiconductor devices and methods of manufacturing semiconductor devices | |
US20230178507A1 (en) | Step interconnect metallization to enable panel level packaging |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20210225 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220412 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220624 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20220705 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20220706 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7102609 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |