JP7102252B2 - プラズマ処理装置 - Google Patents

プラズマ処理装置 Download PDF

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Publication number
JP7102252B2
JP7102252B2 JP2018120444A JP2018120444A JP7102252B2 JP 7102252 B2 JP7102252 B2 JP 7102252B2 JP 2018120444 A JP2018120444 A JP 2018120444A JP 2018120444 A JP2018120444 A JP 2018120444A JP 7102252 B2 JP7102252 B2 JP 7102252B2
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processing chamber
plasma
gas
processing apparatus
plasma processing
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JP2020004782A (ja
JP2020004782A5 (enExample
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功 森
基裕 田中
哲雄 川那辺
尚輝 安井
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Hitachi High Tech Corp
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Hitachi High Tech Corp
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  • Drying Of Semiconductors (AREA)
JP2018120444A 2018-06-26 2018-06-26 プラズマ処理装置 Active JP7102252B2 (ja)

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JP2018120444A JP7102252B2 (ja) 2018-06-26 2018-06-26 プラズマ処理装置

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JP2018120444A JP7102252B2 (ja) 2018-06-26 2018-06-26 プラズマ処理装置

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JP2020004782A JP2020004782A (ja) 2020-01-09
JP2020004782A5 JP2020004782A5 (enExample) 2021-07-26
JP7102252B2 true JP7102252B2 (ja) 2022-07-19

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12444582B2 (en) * 2020-04-21 2025-10-14 Hitachi High-Tech Corporation Plasma processing apparatus

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008124190A (ja) 2006-11-10 2008-05-29 Hitachi High-Technologies Corp 真空処理装置
JP2008187062A (ja) 2007-01-31 2008-08-14 Hitachi High-Technologies Corp プラズマ処理装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06101072A (ja) * 1992-09-22 1994-04-12 Sumitomo Metal Ind Ltd プラズマ装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008124190A (ja) 2006-11-10 2008-05-29 Hitachi High-Technologies Corp 真空処理装置
JP2008187062A (ja) 2007-01-31 2008-08-14 Hitachi High-Technologies Corp プラズマ処理装置

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