JP7094983B2 - 向上したスループット及びプロセス柔軟性を備えたｃｍｐ機械 - Google Patents

向上したスループット及びプロセス柔軟性を備えたｃｍｐ機械 Download PDF

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JP7094983B2
JP7094983B2 JP2019558761A JP2019558761A JP7094983B2 JP 7094983 B2 JP7094983 B2 JP 7094983B2 JP 2019558761 A JP2019558761 A JP 2019558761A JP 2019558761 A JP2019558761 A JP 2019558761A JP 7094983 B2 JP7094983 B2 JP 7094983B2
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Prior art keywords
carrier head
substrate
platen
rotation
support
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Japanese (ja)
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JP2020518475A (ja
Inventor
ダニエル レイ トロヤン
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アクス テクノロジー エルエルシー
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Priority to JP2022099826A priority Critical patent/JP7408726B2/ja
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Priority to JP2023215247A priority patent/JP2024026436A/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2019558761A 2017-04-26 2018-04-06 向上したスループット及びプロセス柔軟性を備えたｃｍｐ機械 Active JP7094983B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022099826A JP7408726B2 (ja) 2017-04-26 2022-06-21 向上したスループット及びプロセス柔軟性を備えたｃｍｐ機械
JP2023215247A JP2024026436A (ja) 2017-04-26 2023-12-20 向上したスループット及びプロセス柔軟性を備えたｃｍｐ機械

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762602538P 2017-04-26 2017-04-26
US62/602,538 2017-04-26
PCT/US2018/026590 WO2018200165A1 (en) 2017-04-26 2018-04-06 Cmp machine with improved throughput and process flexibility

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022099826A Division JP7408726B2 (ja) 2017-04-26 2022-06-21 向上したスループット及びプロセス柔軟性を備えたｃｍｐ機械

Publications (2)

Publication Number Publication Date
JP2020518475A JP2020518475A (ja) 2020-06-25
JP7094983B2 true JP7094983B2 (ja) 2022-07-04

Family

ID=63915835

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2019558761A Active JP7094983B2 (ja) 2017-04-26 2018-04-06 向上したスループット及びプロセス柔軟性を備えたｃｍｐ機械
JP2022099826A Active JP7408726B2 (ja) 2017-04-26 2022-06-21 向上したスループット及びプロセス柔軟性を備えたｃｍｐ機械
JP2023215247A Pending JP2024026436A (ja) 2017-04-26 2023-12-20 向上したスループット及びプロセス柔軟性を備えたｃｍｐ機械

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2022099826A Active JP7408726B2 (ja) 2017-04-26 2022-06-21 向上したスループット及びプロセス柔軟性を備えたｃｍｐ機械
JP2023215247A Pending JP2024026436A (ja) 2017-04-26 2023-12-20 向上したスループット及びプロセス柔軟性を備えたｃｍｐ機械

Country Status (5)

Country Link
US (2) US20180311784A1 (ko)
EP (1) EP3616237A4 (ko)
JP (3) JP7094983B2 (ko)
CN (1) CN110709980A (ko)
WO (1) WO2018200165A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113382825A (zh) * 2019-02-14 2021-09-10 崇硕科技公司 基板载具头和加工系统
KR20220042189A (ko) * 2019-08-02 2022-04-04 액서스 테크놀로지, 엘엘씨 가공대상물 연마 중 웨이퍼 슬립 검출의 인시츄 조절을 위한 방법 및 장치
US11705354B2 (en) 2020-07-10 2023-07-18 Applied Materials, Inc. Substrate handling systems

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000061821A (ja) 1998-08-19 2000-02-29 Speedfam-Ipec Co Ltd ポリッシング装置における外気連通機構
JP2001144057A (ja) 1999-08-30 2001-05-25 Mitsubishi Materials Corp 研磨装置及び被研磨材の研磨方法
JP2001315058A (ja) 2000-05-02 2001-11-13 Fujikoshi Mach Corp ウェーハの研磨装置
US20010044266A1 (en) 2000-05-16 2001-11-22 Seiji Katsuoka Polishing apparatus
JP2005131772A (ja) 2003-10-31 2005-05-26 Ebara Corp ポリッシング装置
US20070141954A1 (en) 2005-12-16 2007-06-21 Applied Materials, Inc. Paired pivot arm
US20080038993A1 (en) 2006-08-08 2008-02-14 Jeong In-Kwon Apparatus and method for polishing semiconductor wafers

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5562524A (en) * 1994-05-04 1996-10-08 Gill, Jr.; Gerald L. Polishing apparatus
US6354926B1 (en) * 1997-03-12 2002-03-12 Lam Research Corporation Parallel alignment method and apparatus for chemical mechanical polishing
JP3797822B2 (ja) * 1999-06-30 2006-07-19 株式会社荏原製作所 ポリッシング装置
US6189680B1 (en) * 1999-07-27 2001-02-20 Fujikoshi Kikai Kogyo Kabushiki Kaisha Rotary conveyor
US6602121B1 (en) * 1999-10-28 2003-08-05 Strasbaugh Pad support apparatus for chemical mechanical planarization
US6923711B2 (en) * 2000-10-17 2005-08-02 Speedfam-Ipec Corporation Multizone carrier with process monitoring system for chemical-mechanical planarization tool
US6439981B1 (en) * 2000-12-28 2002-08-27 Lsi Logic Corporation Arrangement and method for polishing a surface of a semiconductor wafer
US6561881B2 (en) * 2001-03-15 2003-05-13 Oriol Inc. System and method for chemical mechanical polishing using multiple small polishing pads
KR100488376B1 (ko) * 2001-04-27 2005-05-11 가부시키가이샤 고베 세이코쇼 기판 처리 방법 및 기판 처리 설비
US6817923B2 (en) * 2001-05-24 2004-11-16 Applied Materials, Inc. Chemical mechanical processing system with mobile load cup
US6575818B2 (en) * 2001-06-27 2003-06-10 Oriol Inc. Apparatus and method for polishing multiple semiconductor wafers in parallel
US20060234508A1 (en) * 2002-05-17 2006-10-19 Mitsuhiko Shirakashi Substrate processing apparatus and substrate processing method
KR20070058445A (ko) * 2004-07-02 2007-06-08 스트라스바흐, 인코포레이티드 웨이퍼 처리 방법 및 시스템
JP5542818B2 (ja) * 2008-08-14 2014-07-09 アプライド マテリアルズ インコーポレイテッド 可動スラリーディスペンサーを有する化学的機械的研磨機および方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000061821A (ja) 1998-08-19 2000-02-29 Speedfam-Ipec Co Ltd ポリッシング装置における外気連通機構
JP2001144057A (ja) 1999-08-30 2001-05-25 Mitsubishi Materials Corp 研磨装置及び被研磨材の研磨方法
JP2001315058A (ja) 2000-05-02 2001-11-13 Fujikoshi Mach Corp ウェーハの研磨装置
US20010044266A1 (en) 2000-05-16 2001-11-22 Seiji Katsuoka Polishing apparatus
JP2001326201A (ja) 2000-05-16 2001-11-22 Ebara Corp ポリッシング装置
JP2005131772A (ja) 2003-10-31 2005-05-26 Ebara Corp ポリッシング装置
US20070141954A1 (en) 2005-12-16 2007-06-21 Applied Materials, Inc. Paired pivot arm
US20080038993A1 (en) 2006-08-08 2008-02-14 Jeong In-Kwon Apparatus and method for polishing semiconductor wafers

Also Published As

Publication number Publication date
JP7408726B2 (ja) 2024-01-05
JP2024026436A (ja) 2024-02-28
CN110709980A (zh) 2020-01-17
WO2018200165A1 (en) 2018-11-01
JP2020518475A (ja) 2020-06-25
KR20200002928A (ko) 2020-01-08
JP2022141653A (ja) 2022-09-29
US20220088744A1 (en) 2022-03-24
US20180311784A1 (en) 2018-11-01
EP3616237A1 (en) 2020-03-04
EP3616237A4 (en) 2020-12-16

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