JP7085157B2 - 蒸着マスク梱包体および蒸着マスク用梱包装置 - Google Patents

蒸着マスク梱包体および蒸着マスク用梱包装置 Download PDF

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Publication number
JP7085157B2
JP7085157B2 JP2020510809A JP2020510809A JP7085157B2 JP 7085157 B2 JP7085157 B2 JP 7085157B2 JP 2020510809 A JP2020510809 A JP 2020510809A JP 2020510809 A JP2020510809 A JP 2020510809A JP 7085157 B2 JP7085157 B2 JP 7085157B2
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Japan
Prior art keywords
vapor deposition
deposition mask
sheet
base
mask
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JP2020510809A
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English (en)
Japanese (ja)
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JPWO2019188715A1 (ja
Inventor
武 渡部
将文 射場
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
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Dai Nippon Printing Co Ltd
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Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Publication of JPWO2019188715A1 publication Critical patent/JPWO2019188715A1/ja
Priority to JP2022008982A priority Critical patent/JP7628514B2/ja
Application granted granted Critical
Publication of JP7085157B2 publication Critical patent/JP7085157B2/ja
Priority to JP2023181303A priority patent/JP2024012355A/ja
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/16Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/38Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/10Apparatus or processes specially adapted to the manufacture of electroluminescent light sources

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)
JP2020510809A 2018-03-30 2019-03-20 蒸着マスク梱包体および蒸着マスク用梱包装置 Active JP7085157B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022008982A JP7628514B2 (ja) 2018-03-30 2022-01-24 蒸着マスク梱包体および蒸着マスク用梱包装置
JP2023181303A JP2024012355A (ja) 2018-03-30 2023-10-20 蒸着マスク梱包体および蒸着マスク用梱包装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018069612 2018-03-30
JP2018069612 2018-03-30
PCT/JP2019/011874 WO2019188715A1 (ja) 2018-03-30 2019-03-20 蒸着マスク梱包体および蒸着マスク用梱包装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022008982A Division JP7628514B2 (ja) 2018-03-30 2022-01-24 蒸着マスク梱包体および蒸着マスク用梱包装置

Publications (2)

Publication Number Publication Date
JPWO2019188715A1 JPWO2019188715A1 (ja) 2021-04-30
JP7085157B2 true JP7085157B2 (ja) 2022-06-16

Family

ID=68060009

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2020510809A Active JP7085157B2 (ja) 2018-03-30 2019-03-20 蒸着マスク梱包体および蒸着マスク用梱包装置
JP2022008982A Active JP7628514B2 (ja) 2018-03-30 2022-01-24 蒸着マスク梱包体および蒸着マスク用梱包装置
JP2023181303A Pending JP2024012355A (ja) 2018-03-30 2023-10-20 蒸着マスク梱包体および蒸着マスク用梱包装置

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2022008982A Active JP7628514B2 (ja) 2018-03-30 2022-01-24 蒸着マスク梱包体および蒸着マスク用梱包装置
JP2023181303A Pending JP2024012355A (ja) 2018-03-30 2023-10-20 蒸着マスク梱包体および蒸着マスク用梱包装置

Country Status (4)

Country Link
JP (3) JP7085157B2 (https=)
CN (2) CN210151210U (https=)
TW (1) TWI804595B (https=)
WO (1) WO2019188715A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7085157B2 (ja) * 2018-03-30 2022-06-16 大日本印刷株式会社 蒸着マスク梱包体および蒸着マスク用梱包装置
CN111334750B (zh) * 2020-03-11 2022-02-01 京东方科技集团股份有限公司 一种soi精细掩模版及其制作方法
CN113445006B (zh) * 2020-04-09 2023-01-31 重庆康佳光电技术研究院有限公司 一种蒸镀衬锅
KR102863199B1 (ko) * 2020-12-23 2025-09-24 삼성디스플레이 주식회사 마스크 어셈블리의 제작 방법
TWI810563B (zh) * 2021-05-14 2023-08-01 達運精密工業股份有限公司 遮罩的製造方法及遮罩製造裝置
CN114716154B (zh) * 2022-04-15 2023-05-12 业成科技(成都)有限公司 屏蔽组件
TWI839134B (zh) 2023-03-01 2024-04-11 達運精密工業股份有限公司 遮罩包裝盒及遮罩載運系統

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009078836A (ja) 2007-09-26 2009-04-16 Dainippon Printing Co Ltd 梱包用部材および梱包体
JP2009078837A (ja) 2007-09-26 2009-04-16 Dainippon Printing Co Ltd 梱包用部材および梱包体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06101309B2 (ja) * 1984-02-23 1994-12-12 株式会社東芝 カラ−受像管
JPH02144830A (ja) * 1988-11-24 1990-06-04 Nec Corp カラーブラウン管のマスクフレーム
JP2002293379A (ja) * 2001-03-30 2002-10-09 Dainippon Printing Co Ltd アパーチャーグリル梱包用の当て材およびアパーチャーグリル梱包体
CN2711086Y (zh) * 2004-07-08 2005-07-20 常宏保丽龙有限公司 一种玻璃基板的封装结构
JP2008156686A (ja) * 2006-12-22 2008-07-10 Seiko Epson Corp マスクおよびマスク蒸着装置
KR102205403B1 (ko) * 2014-10-08 2021-01-21 삼성디스플레이 주식회사 증착용 마스크 포장 용기
JP7085157B2 (ja) * 2018-03-30 2022-06-16 大日本印刷株式会社 蒸着マスク梱包体および蒸着マスク用梱包装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009078836A (ja) 2007-09-26 2009-04-16 Dainippon Printing Co Ltd 梱包用部材および梱包体
JP2009078837A (ja) 2007-09-26 2009-04-16 Dainippon Printing Co Ltd 梱包用部材および梱包体

Also Published As

Publication number Publication date
JP2024012355A (ja) 2024-01-30
TWI804595B (zh) 2023-06-11
CN110318022B (zh) 2022-06-10
CN210151210U (zh) 2020-03-17
CN110318022A (zh) 2019-10-11
JP7628514B2 (ja) 2025-02-10
TW201942397A (zh) 2019-11-01
JPWO2019188715A1 (ja) 2021-04-30
JP2022062105A (ja) 2022-04-19
WO2019188715A1 (ja) 2019-10-03

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