JP7083596B2 - 表示装置 - Google Patents

表示装置 Download PDF

Info

Publication number
JP7083596B2
JP7083596B2 JP2017010796A JP2017010796A JP7083596B2 JP 7083596 B2 JP7083596 B2 JP 7083596B2 JP 2017010796 A JP2017010796 A JP 2017010796A JP 2017010796 A JP2017010796 A JP 2017010796A JP 7083596 B2 JP7083596 B2 JP 7083596B2
Authority
JP
Japan
Prior art keywords
layer
substrate
display device
light
display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017010796A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017134402A (ja
JP2017134402A5 (enExample
Inventor
安弘 神保
浩平 横山
裕司 岩城
港 伊藤
太介 鎌田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Publication of JP2017134402A publication Critical patent/JP2017134402A/ja
Publication of JP2017134402A5 publication Critical patent/JP2017134402A5/ja
Application granted granted Critical
Publication of JP7083596B2 publication Critical patent/JP7083596B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K59/8792—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Optical Filters (AREA)
JP2017010796A 2016-01-27 2017-01-25 表示装置 Active JP7083596B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016013331 2016-01-27
JP2016013331 2016-01-27

Publications (3)

Publication Number Publication Date
JP2017134402A JP2017134402A (ja) 2017-08-03
JP2017134402A5 JP2017134402A5 (enExample) 2020-03-05
JP7083596B2 true JP7083596B2 (ja) 2022-06-13

Family

ID=59359780

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017010796A Active JP7083596B2 (ja) 2016-01-27 2017-01-25 表示装置

Country Status (3)

Country Link
US (1) US20170213872A1 (enExample)
JP (1) JP7083596B2 (enExample)
CN (1) CN107026244B (enExample)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3426614B1 (en) 2016-03-09 2024-11-20 Corning Incorporated Cold forming of complexly curved glass articles
KR102544091B1 (ko) 2016-06-28 2023-06-16 코닝 인코포레이티드 장식 및 디스플레이 커버 적용(application)을 위한 커브드(curved) 몰딩된(molded) 플라스틱 표면에 대한 얇은 강화된 유리의 적층(laminating)
US20180004318A1 (en) * 2016-07-01 2018-01-04 Khaled Ahmed Flexible sensor
TWI730140B (zh) 2016-07-05 2021-06-11 美商康寧公司 冷成形玻璃製品及其組裝製程
US10528079B2 (en) 2016-08-26 2020-01-07 Semiconductor Energy Laboratory Co., Ltd. Data processing device, display method, input/output method, server system, and computer program
CN115403280B (zh) 2016-10-25 2024-03-19 康宁公司 用于显示器的冷成形玻璃积层
US11768549B2 (en) 2017-01-03 2023-09-26 Corning Incorporated Vehicle interior systems having a curved cover glass and display or touch panel and methods for forming the same
US10712850B2 (en) 2017-01-03 2020-07-14 Corning Incorporated Vehicle interior systems having a curved cover glass and a display or touch panel and methods for forming the same
US11016590B2 (en) 2017-01-03 2021-05-25 Corning Incorporated Vehicle interior systems having a curved cover glass and display or touch panel and methods for forming the same
EP3625179B1 (en) 2017-05-15 2025-09-17 Corning Incorporated Contoured glass articles and method of making the same
EP4190616A3 (en) 2017-07-18 2023-06-28 Corning Incorporated Cold forming of complexly curved glass articles
CN115602068A (zh) 2017-09-12 2023-01-13 康宁公司（Us） 用于装饰玻璃上的包括触摸面板的显示器的死前端及相关方法
US11065960B2 (en) 2017-09-13 2021-07-20 Corning Incorporated Curved vehicle displays
TWI806897B (zh) 2017-09-13 2023-07-01 美商康寧公司 用於顯示器的基於光導器的無電面板、相關的方法及載具內部系統
JP6932598B2 (ja) * 2017-09-25 2021-09-08 株式会社ジャパンディスプレイ 表示装置
KR102374754B1 (ko) * 2017-09-27 2022-03-15 엘지디스플레이 주식회사 터치 구조물을 포함하는 디스플레이 장치
TWI888167B (zh) 2017-10-10 2025-06-21 美商康寧公司 具有改善可靠性的彎曲的覆蓋玻璃的車輛內部系統及其形成方法
CN111758063B (zh) 2017-11-21 2022-08-09 康宁公司 用于抬头显示器系统的非球面镜及其形成方法
TWI789463B (zh) 2017-11-30 2023-01-11 美商康寧公司 用於形成曲面鏡的真空模具設備、系統及方法
KR102709430B1 (ko) 2017-11-30 2024-09-25 코닝 인코포레이티드 비구면 미러를 진공 성형하기 위한 시스템 및 방법
CN111466037B (zh) * 2017-12-19 2025-04-04 科迪华公司 具有改进光输出耦合的发光装置
CN108062914B (zh) * 2018-01-05 2019-09-10 京东方科技集团股份有限公司 显示基板及其制造方法、显示装置
CN108389866A (zh) * 2018-01-19 2018-08-10 云谷（固安）科技有限公司 可折叠显示屏及可折叠显示屏的制造方法
KR102524043B1 (ko) * 2018-02-12 2023-04-20 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
KR101952769B1 (ko) 2018-02-28 2019-02-27 동우 화인켐 주식회사 터치 센서
US12140732B2 (en) 2018-03-02 2024-11-12 Corning Incorporated Anti-reflective coatings and articles and methods of forming the same
US11718071B2 (en) 2018-03-13 2023-08-08 Corning Incorporated Vehicle interior systems having a crack resistant curved cover glass and methods for forming the same
JP7144170B2 (ja) * 2018-03-27 2022-09-29 株式会社ジャパンディスプレイ タッチセンサ及びタッチセンサ付き表示装置
CN119866147A (zh) * 2018-05-09 2025-04-22 京东方科技集团股份有限公司 显示面板及其制备方法、显示装置
CN116312233B (zh) 2018-07-12 2025-09-16 康宁公司 配置用于色彩比对的无电板
CN112566782A (zh) 2018-07-16 2021-03-26 康宁公司 具冷弯玻璃基板的车辆内部系统及其形成方法
CN110767673B (zh) * 2018-08-06 2023-07-21 昆山国显光电有限公司 显示面板、显示屏及显示终端
CN109273509B (zh) * 2018-10-15 2021-03-16 深圳市华星光电半导体显示技术有限公司 柔性显示装置
CN109920818B (zh) * 2018-11-14 2021-09-10 京东方科技集团股份有限公司 显示面板及其制造方法、显示装置
KR102527666B1 (ko) 2018-11-20 2023-05-04 삼성디스플레이 주식회사 보호 필름, 이를 포함하는 전자 장치, 및 보호 필름의 부착 방법
US20200176483A1 (en) * 2018-12-03 2020-06-04 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Flexible display panel and display device thereof
US12091357B2 (en) 2021-08-05 2024-09-17 Corning Incorporated Dynamically bendable automotive interior display systems
CN120307879A (zh) 2018-12-10 2025-07-15 康宁公司 可动态弯折的汽车内部显示系统
KR102657036B1 (ko) * 2018-12-21 2024-04-11 엘지디스플레이 주식회사 표시 장치
US10700440B1 (en) * 2019-01-25 2020-06-30 Corning Incorporated Antenna stack
US11036320B2 (en) * 2019-01-30 2021-06-15 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Organic light emitting diode folding display
KR102843383B1 (ko) * 2019-07-23 2025-08-06 삼성디스플레이 주식회사 컬러 패널 및 이를 포함하는 표시 장치
EP3771695A1 (en) 2019-07-31 2021-02-03 Corning Incorporated Method and system for cold-forming glass
WO2021025312A1 (en) * 2019-08-08 2021-02-11 Samsung Electronics Co., Ltd. Display module, display panel, and display apparatus
CN110634926B (zh) * 2019-09-25 2022-05-13 京东方科技集团股份有限公司 一种显示基板及其制备方法、显示装置
US12466756B2 (en) 2019-10-08 2025-11-11 Corning Incorporated Curved glass articles including a bumper piece configured to relocate bending moment from display region and method of manufacturing same
KR102743169B1 (ko) 2019-11-20 2024-12-17 보에 테크놀로지 그룹 컴퍼니 리미티드 Oled 디스플레이 패널 및 디스플레이 장치
CN111048563B (zh) * 2019-12-17 2022-05-10 武汉天马微电子有限公司 柔性显示面板及柔性显示装置
CN113285041B (zh) * 2020-02-20 2023-12-08 京东方科技集团股份有限公司 显示基板及其制作方法、显示装置
US11772361B2 (en) 2020-04-02 2023-10-03 Corning Incorporated Curved glass constructions and methods for forming same
CN111584504B (zh) * 2020-05-11 2023-10-27 合肥维信诺科技有限公司 显示面板及其制备方法
JP7506769B2 (ja) * 2020-06-03 2024-06-26 イー インク コーポレイション 非伝導性支持板を含む折り畳み可能電気泳動ディスプレイモジュール
CN111768700B (zh) * 2020-06-22 2021-10-08 武汉华星光电半导体显示技术有限公司 显示面板及显示装置
JP7486052B2 (ja) * 2020-07-17 2024-05-17 大日本印刷株式会社 有機ｅｌ表示装置、透過制御パネル及び透過制御パネルの製造方法
CN112130697B (zh) * 2020-09-29 2024-06-14 武汉天马微电子有限公司 一种触控显示面板和显示装置
KR102847545B1 (ko) * 2020-10-08 2025-08-21 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
KR20220075008A (ko) * 2020-11-26 2022-06-07 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법
KR102839164B1 (ko) * 2021-10-28 2025-07-25 엘지디스플레이 주식회사 표시 장치
US12417650B2 (en) * 2022-05-25 2025-09-16 Omnivision Technologies, Inc. Multi-microlens fingerprint sensor with photodiodes in groups; each photodiode of the photodiode groups having a field of view through a microlens, pinholes of an upper black mask layer, and pinholes of a metal layer having pinhole rings with pinholes of an outer ring larger than those of an inner ring
KR20240055181A (ko) * 2022-10-18 2024-04-29 삼성디스플레이 주식회사 유기 광다이오드 및 이를 포함하는 전자 장치

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002063991A (ja) 2000-08-22 2002-02-28 Sony Corp 有機電界発光素子及びその製造方法
JP2003223115A (ja) 2002-01-31 2003-08-08 Shin Sti Technology Kk 複合基板及びその製造方法並びにフラットパネル装置
JP2006049308A (ja) 2004-08-04 2006-02-16 Samsung Electronics Co Ltd 表示装置、その製造方法、及びその製造装置
JP2009048835A (ja) 2007-08-17 2009-03-05 Seiko Epson Corp 有機エレクトロルミネッセンス装置及びその製造方法、電子機器
JP2010212235A (ja) 2009-03-11 2010-09-24 Samsung Mobile Display Co Ltd 有機発光表示装置
JP2010224381A (ja) 2009-03-25 2010-10-07 Sony Corp 電気光学装置および電子機器
JP2010282966A (ja) 2009-06-04 2010-12-16 Samsung Mobile Display Co Ltd 有機発光表示装置及び有機発光表示装置の製造方法
JP2011049539A (ja) 2009-07-31 2011-03-10 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
US20140367644A1 (en) 2013-06-13 2014-12-18 Samsung Display Co., Ltd. Display apparatus having improved bending properties and method of manufacturing same
JP2015076262A (ja) 2013-10-09 2015-04-20 ソニー株式会社 表示装置および電子機器
US20150349029A1 (en) 2014-05-27 2015-12-03 Lg Display Co., Ltd. Display panel and method for manufacturing thereof

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013196919A (ja) * 2012-03-21 2013-09-30 Sony Corp 有機ｅｌ表示装置、有機ｅｌ表示装置の製造方法およびカラーフィルタ基板
KR102079188B1 (ko) * 2012-05-09 2020-02-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치 및 전자 기기
CN108511615B (zh) * 2013-03-08 2020-03-03 日本先锋公司 发光元件
TWI535003B (zh) * 2013-05-24 2016-05-21 群創光電股份有限公司 有機發光顯示裝置
JP2015122148A (ja) * 2013-12-20 2015-07-02 株式会社ジャパンディスプレイ 有機エレクトロルミネッセンス表示装置
JP2015128003A (ja) * 2013-12-27 2015-07-09 ソニー株式会社 表示装置および電子機器
JP6585384B2 (ja) * 2014-06-13 2019-10-02 株式会社半導体エネルギー研究所 表示装置
CN107535026B (zh) * 2015-04-15 2019-07-26 夏普株式会社 有机el显示装置
KR102381287B1 (ko) * 2015-04-24 2022-03-31 삼성디스플레이 주식회사 유기 발광 표시 장치 및 이의 제조 방법

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002063991A (ja) 2000-08-22 2002-02-28 Sony Corp 有機電界発光素子及びその製造方法
JP2003223115A (ja) 2002-01-31 2003-08-08 Shin Sti Technology Kk 複合基板及びその製造方法並びにフラットパネル装置
JP2006049308A (ja) 2004-08-04 2006-02-16 Samsung Electronics Co Ltd 表示装置、その製造方法、及びその製造装置
JP2009048835A (ja) 2007-08-17 2009-03-05 Seiko Epson Corp 有機エレクトロルミネッセンス装置及びその製造方法、電子機器
JP2010212235A (ja) 2009-03-11 2010-09-24 Samsung Mobile Display Co Ltd 有機発光表示装置
JP2010224381A (ja) 2009-03-25 2010-10-07 Sony Corp 電気光学装置および電子機器
JP2010282966A (ja) 2009-06-04 2010-12-16 Samsung Mobile Display Co Ltd 有機発光表示装置及び有機発光表示装置の製造方法
JP2011049539A (ja) 2009-07-31 2011-03-10 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
US20140367644A1 (en) 2013-06-13 2014-12-18 Samsung Display Co., Ltd. Display apparatus having improved bending properties and method of manufacturing same
JP2015076262A (ja) 2013-10-09 2015-04-20 ソニー株式会社 表示装置および電子機器
US20150349029A1 (en) 2014-05-27 2015-12-03 Lg Display Co., Ltd. Display panel and method for manufacturing thereof

Also Published As

Publication number Publication date
JP2017134402A (ja) 2017-08-03
CN107026244B (zh) 2021-08-24
US20170213872A1 (en) 2017-07-27
CN107026244A (zh) 2017-08-08

Similar Documents

Publication Publication Date Title
JP7083596B2 (ja) 表示装置
JP7492047B2 (ja) 表示装置
JP7082252B1 (ja) 半導体装置
JP6781799B2 (ja) 発光装置
JP6841613B2 (ja) 発光装置の作製方法、発光装置、モジュール、及び電子機器
US9960213B2 (en) Input and output device having touch sensor element as input device and display device
JP2020098791A (ja) 有機ｅｌ表示装置
JP2022070953A (ja) 表示装置
JP2017188652A (ja) フレキシブルデバイス及び表示装置、並びにそれらの作製方法
JP7046251B2 (ja) 表示装置
CN111357086A (zh) 半导体装置
CN116670743A (zh) 显示装置的制造方法
JP2016066607A (ja) 剥離方法、発光装置、モジュール、及び電子機器

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200121

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20200121

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20210226

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20210316

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20210517

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210715

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220105

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220302

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20220510

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20220601

R150 Certificate of patent or registration of utility model

Ref document number: 7083596

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250