JP7065779B2 - 金属ナノ粒子を用いた付加製造プロセス - Google Patents
金属ナノ粒子を用いた付加製造プロセス Download PDFInfo
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- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/10—Formation of a green body
- B22F10/12—Formation of a green body by photopolymerisation, e.g. stereolithography [SLA] or digital light processing [DLP]
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- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B22F1/054—Nanosized particles
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/10—Formation of a green body
- B22F10/14—Formation of a green body by jetting of binder onto a bed of metal powder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
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- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/1017—Multiple heating or additional steps
- B22F3/1021—Removal of binder or filler
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
- B33Y70/10—Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2301/00—Metallic composition of the powder or its coating
- B22F2301/10—Copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2302/00—Metal Compound, non-Metallic compound or non-metal composition of the powder or its coating
- B22F2302/45—Others, including non-metals
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0224—Conductive particles having an insulating coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0257—Nanoparticles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
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- Ceramic Engineering (AREA)
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Description
本出願は、2016年3月4日に出願した米国仮特許出願第62/304,093号の米国特許法第119条に基づく優先権の利益を主張し、その内容が参照により本明細書に組み込まれる。
該当なし。
Claims (14)
- 複数の金属ナノ粒子を少なくとも30重量%含む第1の印刷組成物と、誘電体材料を含む第2の印刷組成物とを提供するステップであって、前記複数の金属ナノ粒子のサイズが20nm以下である、ステップと、
堆積後に前記複数の金属ナノ粒子同士が固結しないように、前記第1の印刷組成物及び前記第2の印刷組成物を互いに堆積させ合って所望の形状を有する物体を形成するステップであって、前記第1の印刷組成物を堆積させる前に前記第2の印刷組成物の少なくとも一部を堆積させるとともに、(i)前記第1の印刷組成物及び前記第2の印刷組成物の少なくとも一部を前記物体内の異なる位置に同時に堆積させるか、又は(ii)前記第1の印刷組成物及び前記第2の印刷組成物を前記物体内で交互に重なるように堆積させる、ステップと、
前記複数の金属ナノ粒子の融合温度よりも高く且つ前記誘電体材料の軟化温度よりも低い温度に前記物体を加熱して、所定の形状で少なくとも部分的に融合し合っている複数の金属ナノ粒子を含む1つ以上の連続的な金属トレースを前記物体に画定するステップと
を含む、付加製造プロセス。 - 前記複数の金属ナノ粒子が銅ナノ粒子を含む、請求項1に記載の付加製造プロセス。
- 1つ以上の界面活性剤を含む界面活性剤コーティングが、前記複数の金属ナノ粒子の表面上に存在している、請求項1に記載の付加製造プロセス。
- 前記第2の印刷組成物を、前記誘電体材料の前記軟化温度よりも高い温度で堆積させた後、前記第1の印刷組成物の堆積前に前記軟化温度よりも低い温度に冷却する、請求項1に記載の付加製造プロセス。
- 前記第1の印刷組成物の少なくとも一部を前記第2の印刷組成物上に堆積させる、請求項4に記載の付加製造プロセス。
- 前記1つ以上の連続的な金属トレースを前記物体に画定した後、前記第2の印刷組成物の少なくとも一部を堆積させることをさらに含む、請求項4に記載の付加製造プロセス。
- 前記第2の印刷組成物の少なくとも一部を前記物体における前記1つ以上の連続的な金属トレース上に堆積させる、請求項6に記載の付加製造プロセス。
- 前記1つ以上の連続的な金属トレースが3次元形状を有する、請求項1に記載の付加製造プロセス。
- 前記1つ以上の連続的な金属トレースが曲線状となっている、請求項8に記載の付加製造プロセス。
- 前記第1の印刷組成物が複数のミクロンサイズの金属粒子をさらに含み、前記ミクロンサイズの金属粒子は、少なくとも1方向における粒径が500nmから100μmである、請求項1に記載の付加製造プロセス。
- 前記1つ以上の連続的な金属トレースがアンテナを画定する、請求項1に記載の付加製造プロセス。
- 前記物体から前記誘電体材料を除去して誘電体材料のない1つ以上の連続的な金属トレースを残すステップをさらに含む、請求項1に記載の付加製造プロセス。
- 複数の金属ナノ粒子を少なくとも30重量%含む第1の印刷組成物と、誘電体材料を含む第2の印刷組成物とを提供するステップであって、前記複数の金属ナノ粒子のサイズが20nm以下である前記第1の印刷組成物が複数のミクロンサイズの金属粒子をさらに含み、前記ミクロンサイズの金属粒子は、少なくとも1方向における粒径が500nmから100μmである、ステップと、
堆積後に前記複数の金属ナノ粒子同士が固結しないように、前記第1の印刷組成物及び前記第2の印刷組成物を互いに堆積させ合って所望の形状を有する物体を形成するステップであって、(i)前記第1の印刷組成物及び前記第2の印刷組成物の少なくとも一部を前記物体内の異なる位置に同時に堆積させるか、又は(ii)前記第1の印刷組成物及び前記第2の印刷組成物を前記物体内で交互に重なるように堆積させる、ステップと、
前記複数の金属ナノ粒子の融合温度よりも高く且つ前記誘電体材料の軟化温度よりも低い温度に前記物体を加熱して、所定の形状で少なくとも部分的に融合し合っている複数の金属ナノ粒子を含む1つ以上の連続的な金属トレースを前記物体に画定するステップと
を含む、付加製造プロセス。 - 複数の金属ナノ粒子を少なくとも30重量%含む第1の印刷組成物、誘電体材料を含む第2の印刷組成物とを提供するステップであって、前記複数の金属ナノ粒子のサイズが20nm以下である、ステップと、
堆積後に前記複数の金属ナノ粒子同士が固結しないように、前記第1の印刷組成物及び前記第2の印刷組成物を互いに堆積させ合って所望の形状を有する物体を形成するステップであって、(i)前記第1の印刷組成物及び前記第2の印刷組成物の少なくとも一部を前記物体内の異なる位置に同時に堆積させるか、又は(ii)前記第1の印刷組成物及び前記第2の印刷組成物を前記物体内で交互に重なるように堆積させる、ステップと、
前記複数の金属ナノ粒子の融合温度よりも高く且つ前記誘電体材料の軟化温度よりも低い温度に前記物体を加熱して、所定の形状で少なくとも部分的に融合し合っている複数の金属ナノ粒子を含む1つ以上の連続的な金属トレースを前記物体に画定するステップと、
前記物体から前記誘電体材料を除去して誘電体材料のない1つ以上の連続的な金属トレースを残すステップと
を含む、付加製造プロセス。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662304093P | 2016-03-04 | 2016-03-04 | |
US62/304,093 | 2016-03-04 | ||
US15/447,062 US20170252804A1 (en) | 2016-03-04 | 2017-03-01 | Additive manufacturing processes utilizing metal nanoparticles |
US15/447,062 | 2017-03-01 | ||
PCT/US2017/020698 WO2017152075A1 (en) | 2016-03-04 | 2017-03-03 | Additive manufacturing processes utilizing metal nanoparticles |
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JP2019512598A JP2019512598A (ja) | 2019-05-16 |
JP7065779B2 true JP7065779B2 (ja) | 2022-05-12 |
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JP2018546459A Active JP7065779B2 (ja) | 2016-03-04 | 2017-03-03 | 金属ナノ粒子を用いた付加製造プロセス |
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US (1) | US20170252804A1 (ja) |
EP (1) | EP3423278B1 (ja) |
JP (1) | JP7065779B2 (ja) |
KR (1) | KR102308362B1 (ja) |
WO (1) | WO2017152075A1 (ja) |
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US11103925B2 (en) | 2018-03-22 | 2021-08-31 | The Boeing Company | Additively manufactured antenna |
US10821658B2 (en) * | 2018-07-24 | 2020-11-03 | Xerox Corporation | Conductive three-dimensional articles |
CN112105493B (zh) * | 2018-08-27 | 2023-04-04 | 惠普发展公司,有限责任合伙企业 | 接合剂 |
US11283143B2 (en) | 2019-05-24 | 2022-03-22 | The Boeing Company | Additively manufactured radio frequency filter |
US11545743B2 (en) * | 2019-05-24 | 2023-01-03 | The Boeing Company | Additively manufactured mesh cavity antenna |
US11909110B2 (en) * | 2020-09-30 | 2024-02-20 | The Boeing Company | Additively manufactured mesh horn antenna |
WO2023250061A1 (en) * | 2022-06-24 | 2023-12-28 | Kuprion, Inc. | Platelet nanoparticles, compositions thereof, and formation thereof |
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US9011570B2 (en) * | 2009-07-30 | 2015-04-21 | Lockheed Martin Corporation | Articles containing copper nanoparticles and methods for production and use thereof |
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2017
- 2017-03-01 US US15/447,062 patent/US20170252804A1/en not_active Abandoned
- 2017-03-03 JP JP2018546459A patent/JP7065779B2/ja active Active
- 2017-03-03 KR KR1020187025447A patent/KR102308362B1/ko active IP Right Grant
- 2017-03-03 EP EP17760913.8A patent/EP3423278B1/en active Active
- 2017-03-03 WO PCT/US2017/020698 patent/WO2017152075A1/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2000234104A (ja) | 1998-10-16 | 2000-08-29 | Lucent Technol Inc | 三次元構造を作るための方法 |
JP2014525944A (ja) | 2011-06-01 | 2014-10-02 | ロッキード マーティン コーポレイション | 低温で印刷可能、フレキシブル、もしくは共形な、電子装置及びアンテナに対する銅ナノ粒子塗付プロセス |
JP2014527474A (ja) | 2011-07-13 | 2014-10-16 | ヌボトロニクス,エルエルシー | 電子的および機械的な構造を製作する方法 |
US20150197063A1 (en) | 2014-01-12 | 2015-07-16 | Zohar SHINAR | Device, method, and system of three-dimensional printing |
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EP3423278A1 (en) | 2019-01-09 |
EP3423278B1 (en) | 2021-12-29 |
EP3423278A4 (en) | 2019-08-14 |
JP2019512598A (ja) | 2019-05-16 |
WO2017152075A1 (en) | 2017-09-08 |
KR20180120176A (ko) | 2018-11-05 |
KR102308362B1 (ko) | 2021-10-01 |
US20170252804A1 (en) | 2017-09-07 |
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