JP7060667B2 - フレキシブル表示装置 - Google Patents
フレキシブル表示装置 Download PDFInfo
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- JP7060667B2 JP7060667B2 JP2020213153A JP2020213153A JP7060667B2 JP 7060667 B2 JP7060667 B2 JP 7060667B2 JP 2020213153 A JP2020213153 A JP 2020213153A JP 2020213153 A JP2020213153 A JP 2020213153A JP 7060667 B2 JP7060667 B2 JP 7060667B2
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
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- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Optics & Photonics (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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- Electroluminescent Light Sources (AREA)
Description
しかしながら、非表示領域に該当するベゼル領域には、画面を駆動させるための配線及び駆動回路が配置されるため、ベゼル領域を縮小するには限界があった。近年、プラスチックのような延性材料のフレキシブル基板を適用して、反っても表示性能を維持できるフレキシブル電界発光表示装置と関連し、配線及び駆動回路のための面積を確保しながらもベゼル領域を縮小させるためにフレキシブル基板の非表示領域をベンディング(bending)してベゼル領域を縮小させる試みがなされている。
Claims (16)
- 表示領域及び前記表示領域の一側から延びてベンディングされたベンディング領域を含む表示パネルと、
前記表示パネルの背面に配置されるバックプレートと、
前記バックプレートの背面に配置されるクッションテープと、
前記ベンディング領域から延びたパッド部に配置される駆動集積回路と、
前記クッションテープと前記バックプレートとの間を接着し、前記駆動集積回路に対向して配置される機能性テープを含み、
前記表示パネルは、
前記表示領域に対応し、平坦な状態を維持する第1平面部と、
前記第1平面部に対向し、前記パッド部を含み、平坦な状態を維持する第2平面部とを含み、
前記バックプレートは、前記第2平面部の背面に位置する第2バックプレートを含み、
前記機能性テープは、
前記クッションテープの背面に位置した第1両面テープと、
前記第2バックプレートの上面に位置した第2両面テープと、
前記第1、第2両面テープの間に介在された電磁干渉遮蔽シートを含み、
前記機能性テープは、前記第1、第2両面テープと前記電磁干渉遮蔽シートとの間にオフセットギャップを有する、フレキシブル表示装置。 - 前記表示パネルは、
前記第1平面部と前記第2平面部との間に位置し、前記ベンディング領域に対応する曲面部をさらに含む、請求項1に記載のフレキシブル表示装置。 - 前記バックプレートは、
前記第1平面部の背面に位置する第1バックプレートをさらに含む、請求項2に記載のフレキシブル表示装置。 - 前記クッションテープは、前記第1バックプレートの背面に配置される、請求項3に記載のフレキシブル表示装置。
- 前記ベンディング領域の表示パネルの上部に配置されるマイクロコーティング層をさらに含む、請求項2に記載のフレキシブル表示装置。
- 前記機能性テープは、前記クッションテープおよび前記第2バックプレートの間を接着し、前記駆動集積回路を遮蔽する、請求項3に記載のフレキシブル表示装置。
- 前記オフセットギャップは、0.5mm~1.5mmの範囲を有する、請求項1に記載のフレキシブル表示装置。
- 前記オフセットギャップは、前記第1、第2両面テープと前記電磁干渉遮蔽シートとの間の4面の縁に形成される、請求項1に記載のフレキシブル表示装置。
- 前記第2平面部の末端に連結される回路素子をさらに含む、請求項5に記載のフレキシブル表示装置。
- 前記駆動集積回路は、前記マイクロコーティング層と前記回路素子との間に配置され、
前記機能性テープは、一端が前記マイクロコーティング層の一部と重畳し、他の一端は、前記回路素子から一定距離離隔されて位置する、請求項9に記載のフレキシブル表示装置。 - 前記回路素子の上面に貼り付けられ、前記駆動集積回路および前記マイクロコーティング層の一端をカバーするガスケットテープをさらに含む、請求項9に記載のフレキシブル表示装置。
- 前記ガスケットテープは、
粘着層と、
前記粘着層上に備えられる電磁干渉遮蔽シートを含む、請求項11に記載のフレキシブル表示装置。 - 第1平面部、前記第1平面部に対向し、パッド部を含む第2平面部、及び前記第1平面部と前記第2平面部との間でベンディングされた曲面部を含む表示パネルと、
前記第1平面部の背面に配置される第1バックプレートと、
前記第2平面部の背面に配置される第2バックプレートと、
前記第1バックプレートの背面に配置されるクッションテープと、
前記パッド部に配置される駆動集積回路と、
前記クッションテープと前記第2バックプレートとの間を接着し、前記駆動集積回路に対向して配置されて前記駆動集積回路の電磁干渉を遮蔽する機能性テープとを含み、
前記機能性テープは、
前記クッションテープの背面に位置した第1両面テープと、
前記第2バックプレートの上面に位置した第2両面テープと、
前記第1、第2両面テープの間に介在された電磁干渉遮蔽シートとを含み、
前記機能性テープは、前記第1、第2両面テープと前記電磁干渉遮蔽シートとの間にオフセットギャップを有する、フレキシブル表示装置。 - 前記曲面部の表示パネルの上部に配置されるマイクロコーティング層と、
前記第2平面部の末端に連結される回路素子とをさらに含む、請求項13に記載のフレキシブル表示装置。 - 前記駆動集積回路は、前記マイクロコーティング層と前記回路素子との間に配置され、
前記機能性テープは、一端が前記マイクロコーティング層の一部と重畳し、他の一端は、前記回路素子から一定距離離隔されて位置する、請求項14に記載のフレキシブル表示装置。 - 前記回路素子の上面に貼り付けられ、前記駆動集積回路および前記マイクロコーティング層の一端をカバーするガスケットテープをさらに含む、請求項14に記載のフレキシブル表示装置。
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Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012219208A (ja) | 2011-04-11 | 2012-11-12 | Oji Paper Co Ltd | 両面粘着シート |
JP2014056967A (ja) | 2012-09-13 | 2014-03-27 | Dic Corp | 導電性薄型粘着シート |
US20170263891A1 (en) | 2016-03-11 | 2017-09-14 | Samsung Display Co., Ltd. | Flexible display device |
US20180083210A1 (en) | 2016-09-22 | 2018-03-22 | Samsung Display Co., Ltd. | Display device |
JP2018124327A (ja) | 2017-01-30 | 2018-08-09 | 株式会社ジャパンディスプレイ | 表示装置の製造方法、及び表示装置 |
JP2018194632A (ja) | 2017-05-16 | 2018-12-06 | 株式会社ジャパンディスプレイ | 表示装置、及び表示装置の製造方法 |
JP2019012099A (ja) | 2017-06-29 | 2019-01-24 | 株式会社ジャパンディスプレイ | 表示装置及びその製造方法 |
US20190116405A1 (en) | 2017-10-12 | 2019-04-18 | Samsung Display Co., Ltd. | Panel bottom member structure and display device |
JP2019101262A (ja) | 2017-12-04 | 2019-06-24 | 株式会社ジャパンディスプレイ | 表示装置 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20080032842A (ko) | 2006-10-11 | 2008-04-16 | 삼성전자주식회사 | 평판표시패널을 구비한 전자기기 |
JP5446790B2 (ja) | 2009-12-02 | 2014-03-19 | セイコーエプソン株式会社 | 電気光学装置および電子機器 |
KR101190630B1 (ko) | 2012-01-30 | 2012-10-15 | 주식회사 지앤씨에스 | 유기 발광 표시 장치 |
JP5848189B2 (ja) | 2012-05-09 | 2016-01-27 | 京セラ株式会社 | 入力機能付き表示装置、および電子機器 |
US9627463B2 (en) | 2014-11-28 | 2017-04-18 | Lg Display Co., Ltd. | Flexible display device with space reducing wire configuration |
KR102550857B1 (ko) * | 2015-08-13 | 2023-07-05 | 엘지디스플레이 주식회사 | 플렉서블 표시장치 |
KR102577239B1 (ko) * | 2015-12-16 | 2023-09-08 | 엘지디스플레이 주식회사 | 플렉서블 디스플레이 장치 |
JP2018054675A (ja) | 2016-09-26 | 2018-04-05 | 株式会社ジャパンディスプレイ | 表示装置 |
KR102598734B1 (ko) | 2016-11-24 | 2023-11-08 | 엘지디스플레이 주식회사 | 전자파 차단 필름 및 이를 포함하는 표시장치 |
US10741621B2 (en) | 2016-11-25 | 2020-08-11 | Lg Display Co., Ltd. | Display device with a fingerprint sensor |
JP2018109683A (ja) | 2016-12-28 | 2018-07-12 | 株式会社ジャパンディスプレイ | 表示装置 |
US10608069B2 (en) | 2017-06-23 | 2020-03-31 | Apple Inc. | Displays with redundant bent signal lines and neutral plane adjustment layers |
JP6564909B2 (ja) | 2017-08-10 | 2019-08-21 | 株式会社ジャパンディスプレイ | 表示装置 |
KR102427667B1 (ko) | 2017-09-26 | 2022-08-02 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
KR20190035103A (ko) * | 2017-09-26 | 2019-04-03 | 엘지디스플레이 주식회사 | 플렉시블 전계발광 표시장치 |
KR102452831B1 (ko) * | 2017-11-24 | 2022-10-07 | 엘지디스플레이 주식회사 | 플렉시블 전계발광 표시장치 |
KR102654593B1 (ko) | 2018-06-01 | 2024-04-05 | 삼성디스플레이 주식회사 | 표시 장치 및 이를 포함한 전자 장치 |
KR102599459B1 (ko) | 2018-06-07 | 2023-11-07 | 삼성디스플레이 주식회사 | 표시 장치 및 이를 이용한 전자장치 제조방법 |
-
2019
- 2019-12-27 KR KR1020190176808A patent/KR20210083970A/ko not_active Application Discontinuation
-
2020
- 2020-12-04 CN CN202410548904.1A patent/CN118475161A/zh active Pending
- 2020-12-04 CN CN202011410456.7A patent/CN113053947B/zh active Active
- 2020-12-10 US US17/117,801 patent/US11798928B2/en active Active
- 2020-12-23 JP JP2020213153A patent/JP7060667B2/ja active Active
-
2022
- 2022-04-14 JP JP2022066772A patent/JP2022100351A/ja active Pending
-
2023
- 2023-09-22 US US18/372,015 patent/US20240014198A1/en active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012219208A (ja) | 2011-04-11 | 2012-11-12 | Oji Paper Co Ltd | 両面粘着シート |
JP2014056967A (ja) | 2012-09-13 | 2014-03-27 | Dic Corp | 導電性薄型粘着シート |
US20170263891A1 (en) | 2016-03-11 | 2017-09-14 | Samsung Display Co., Ltd. | Flexible display device |
US20180083210A1 (en) | 2016-09-22 | 2018-03-22 | Samsung Display Co., Ltd. | Display device |
JP2018124327A (ja) | 2017-01-30 | 2018-08-09 | 株式会社ジャパンディスプレイ | 表示装置の製造方法、及び表示装置 |
JP2018194632A (ja) | 2017-05-16 | 2018-12-06 | 株式会社ジャパンディスプレイ | 表示装置、及び表示装置の製造方法 |
JP2019012099A (ja) | 2017-06-29 | 2019-01-24 | 株式会社ジャパンディスプレイ | 表示装置及びその製造方法 |
US20190116405A1 (en) | 2017-10-12 | 2019-04-18 | Samsung Display Co., Ltd. | Panel bottom member structure and display device |
JP2019101262A (ja) | 2017-12-04 | 2019-06-24 | 株式会社ジャパンディスプレイ | 表示装置 |
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