JP7054107B2 - 搬送容器オートクランプ機構 - Google Patents
搬送容器オートクランプ機構 Download PDFInfo
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- JP7054107B2 JP7054107B2 JP2017230318A JP2017230318A JP7054107B2 JP 7054107 B2 JP7054107 B2 JP 7054107B2 JP 2017230318 A JP2017230318 A JP 2017230318A JP 2017230318 A JP2017230318 A JP 2017230318A JP 7054107 B2 JP7054107 B2 JP 7054107B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
以下、この発明の実施の形態1について、この発明を小型半導体製造装置のオートクランプ機構に適用する場合を例に採って説明する。
110 処理室
120,120A-120C 装置前室
121 前室本体
122,122A-122C 天板
130,130A-130C 容器載置台
131 ウェハ搬入口
132 位置決め凹部
133 Oリング
140 オートクランプ機構
141 クランプ爪
142 クランプ制御機構
200 ウェハ搬送容器
201 容器底部
202 容器蓋部
202a 傾斜当接面
203 脚部
204 ピン部材
300 半導体ウェハ
410 クランプ爪収容部
411 ガイド板
412 ガイドピン
420 リンク機構
421 第1のアーム
421a 長尺部
421b 短尺部
422 第2のアーム
423 ソレノイドバルブ
424 エアシリンダ
424a ピストンロッド
425 ガイド部材
426 押さえ板
427 回転軸
428 連結ピン
701 胴体部
702 爪部
703 脚部
704 長孔
705 丸穴
706 スライド面
800 半導体製造システム
801A-801C 仮置きトレイ
802A-802C 容器搬送機構
Claims (5)
- 処理基板を搬送するための搬送容器が載置される容器載置部と、
該容器載置部に載置された該搬送容器の底面側から前記処理基板を降下させることで製造装置本体の内部に搬入するために、該容器載置部の中央部分に設けられた搬入口と、
を備えた製造装置に搭載されて、該搬送容器を該容器載置部に固定する搬送容器オートクランプ機構であって、
複数の側から前記搬送容器の周縁部に当接して略水平方向へ押圧することで、対向する水平成分を互いに打ち消し該搬送容器に垂直方向の被押圧力成分を発生させて前記容器載置部に固定するように構成された、複数のクランプ爪と、
前記搬送容器が前記容器載置部上に載置されているときに、前記複数のクランプ爪を該搬送容器へ近づく方向へ略水平に移動させて前記周縁部に当接・押圧させるクランプ制御機構と、
を備えることを特徴とする搬送容器オートクランプ機構。 - 前記クランプ制御機構は、前記処理基板が前記製造装置本体から前記搬送容器内に戻されたあとで、前記複数のクランプ爪を該搬送容器から遠ざかる方向へ略水平に移動させて前記周縁部から離間させることを特徴とする請求項1に記載の搬送容器オートクランプ機構。
- 前記搬送容器の前記周縁部には、傾斜面が形成され、
前記複数のクランプ爪は、該傾斜面を略水平方向へ押圧することで、前記垂直方向の被押圧力成分を該搬送容器に発生させる、
ことを特徴とする請求項1又は2に記載の搬送容器オートクランプ機構。 - 前記容器載置部に、前記搬入口の周囲を囲むOリングを設けることにより、前記複数のクランプ爪が前記搬送容器を押圧したときに、該搬送容器と該容器載置部との対向面が密閉されるようにしたことを特徴とする請求項1乃至3の何れかに記載の搬送容器オートクランプ機構。
- 前記クランプ制御機構は、
複数の前記クランプ爪が一端部分に設けられ、該クランプ爪が前記搬送容器へ近づく方向及び遠ざかる方向への水平移動が可能な、略L字型の第1のアームと、
該第1のアームの他端近傍に一端が回転自在に連結されると共に、他の前記クランプ爪が他端に設けられ、略中央部分に設けられた回転軸を中心に回転する、第2のアームと、
を備えるリンク機構を有し、
前記第1のアームに設けられた前記クランプ爪が前記搬送容器の前記周縁部に当接したときに、前記第2のアームに設けられた前記クランプ爪も該搬送容器の前記周縁部に当接するように構成された、
ことを特徴とする請求項1乃至4の何れかに記載の搬送容器オートクランプ機構。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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JP2017230318A JP7054107B2 (ja) | 2017-11-30 | 2017-11-30 | 搬送容器オートクランプ機構 |
US16/182,891 US11011403B2 (en) | 2017-11-30 | 2018-11-07 | Transport container automatic clamping mechanism |
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JP2017230318A JP7054107B2 (ja) | 2017-11-30 | 2017-11-30 | 搬送容器オートクランプ機構 |
Publications (2)
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JP2019102587A JP2019102587A (ja) | 2019-06-24 |
JP7054107B2 true JP7054107B2 (ja) | 2022-04-13 |
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JP2017230318A Active JP7054107B2 (ja) | 2017-11-30 | 2017-11-30 | 搬送容器オートクランプ機構 |
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US (1) | US11011403B2 (ja) |
JP (1) | JP7054107B2 (ja) |
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JP7054107B2 (ja) * | 2017-11-30 | 2022-04-13 | 国立研究開発法人産業技術総合研究所 | 搬送容器オートクランプ機構 |
KR102137772B1 (ko) * | 2019-09-17 | 2020-07-24 | 곽동현 | 접착제 제조장치 |
CN114429930B (zh) * | 2022-01-28 | 2023-04-14 | 上海世禹精密设备股份有限公司 | 一种芯片载具自动收集装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2005209891A (ja) | 2004-01-23 | 2005-08-04 | Tdk Corp | ポッドオープナのポッドクランプユニット、当該ポッドクランプユニットを用いたポッドクランプ機構及びクランプ方法 |
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JP3240698B2 (ja) * | 1992-08-20 | 2001-12-17 | 神鋼電機株式会社 | 可搬式密閉コンテナのパージステーション |
JP3543996B2 (ja) * | 1994-04-22 | 2004-07-21 | 東京エレクトロン株式会社 | 処理装置 |
US6138726A (en) * | 1998-12-09 | 2000-10-31 | Newman; Roger R. | Router guide milling apparatus and method |
JP5516968B2 (ja) | 2010-06-08 | 2014-06-11 | 独立行政法人産業技術総合研究所 | 連結搬送システム |
CN102092018B (zh) * | 2011-01-14 | 2012-09-26 | 富泰华工业(深圳)有限公司 | 定位治具 |
JP6422317B2 (ja) | 2014-12-02 | 2018-11-14 | 国立研究開発法人産業技術総合研究所 | 小型製造装置 |
JP7054107B2 (ja) * | 2017-11-30 | 2022-04-13 | 国立研究開発法人産業技術総合研究所 | 搬送容器オートクランプ機構 |
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Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2005209891A (ja) | 2004-01-23 | 2005-08-04 | Tdk Corp | ポッドオープナのポッドクランプユニット、当該ポッドクランプユニットを用いたポッドクランプ機構及びクランプ方法 |
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US11011403B2 (en) | 2021-05-18 |
US20190164797A1 (en) | 2019-05-30 |
JP2019102587A (ja) | 2019-06-24 |
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