JP7044007B2 - 回路構成体 - Google Patents

回路構成体 Download PDF

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Publication number
JP7044007B2
JP7044007B2 JP2018144347A JP2018144347A JP7044007B2 JP 7044007 B2 JP7044007 B2 JP 7044007B2 JP 2018144347 A JP2018144347 A JP 2018144347A JP 2018144347 A JP2018144347 A JP 2018144347A JP 7044007 B2 JP7044007 B2 JP 7044007B2
Authority
JP
Japan
Prior art keywords
circuit board
opening
bus bar
fet
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018144347A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020021815A5 (enExample
JP2020021815A (ja
Inventor
章 原口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd, AutoNetworks Technologies Ltd, Sumitomo Electric Industries Ltd filed Critical Sumitomo Wiring Systems Ltd
Priority to JP2018144347A priority Critical patent/JP7044007B2/ja
Priority to CN201980046854.4A priority patent/CN112514064B/zh
Priority to US17/262,511 priority patent/US11898915B2/en
Priority to PCT/JP2019/027277 priority patent/WO2020026732A1/ja
Publication of JP2020021815A publication Critical patent/JP2020021815A/ja
Publication of JP2020021815A5 publication Critical patent/JP2020021815A5/ja
Application granted granted Critical
Publication of JP7044007B2 publication Critical patent/JP7044007B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/01—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using semiconducting elements having PN junctions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10219—Thermoelectric component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Connection Or Junction Boxes (AREA)
  • Structure Of Printed Boards (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
JP2018144347A 2018-07-31 2018-07-31 回路構成体 Active JP7044007B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018144347A JP7044007B2 (ja) 2018-07-31 2018-07-31 回路構成体
CN201980046854.4A CN112514064B (zh) 2018-07-31 2019-07-10 电路结构体
US17/262,511 US11898915B2 (en) 2018-07-31 2019-07-10 Circuit assembly
PCT/JP2019/027277 WO2020026732A1 (ja) 2018-07-31 2019-07-10 回路構成体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018144347A JP7044007B2 (ja) 2018-07-31 2018-07-31 回路構成体

Publications (3)

Publication Number Publication Date
JP2020021815A JP2020021815A (ja) 2020-02-06
JP2020021815A5 JP2020021815A5 (enExample) 2021-01-28
JP7044007B2 true JP7044007B2 (ja) 2022-03-30

Family

ID=69230964

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018144347A Active JP7044007B2 (ja) 2018-07-31 2018-07-31 回路構成体

Country Status (4)

Country Link
US (1) US11898915B2 (enExample)
JP (1) JP7044007B2 (enExample)
CN (1) CN112514064B (enExample)
WO (1) WO2020026732A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3127339A1 (fr) * 2021-09-20 2023-03-24 Valeo Systemes De Controle Moteur Module électronique avec élément de connexion amélioré

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001015228A1 (en) 1999-08-19 2001-03-01 Seiko Epson Corporation Wiring board, method of manufacturing wiring board, electronic device, method of manufacturing electronic device, circuit board and electronic apparatus
JP2004253759A (ja) 2002-12-24 2004-09-09 Auto Network Gijutsu Kenkyusho:Kk 制御回路基板及び回路構成体

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09289281A (ja) * 1996-04-23 1997-11-04 Kokusai Electric Co Ltd トランジスタの温度検出回路
JPH10188713A (ja) * 1996-12-20 1998-07-21 Nakamura Denki Seisakusho:Kk 耐圧防爆構造温度スイッチ
JP4256256B2 (ja) * 2001-06-18 2009-04-22 ギブン イメージング リミテッド 硬質の区域および軟質の区域を有する回路基板を備えた生体内センシング装置
JP3956886B2 (ja) * 2002-11-22 2007-08-08 株式会社豊田自動織機 半導体モジュールおよび半導体モジュール用リード
JP2004327839A (ja) * 2003-04-25 2004-11-18 Sony Corp 電子機器
JP2005150154A (ja) * 2003-11-11 2005-06-09 Sharp Corp 半導体モジュールとその実装方法
JP2005203674A (ja) * 2004-01-19 2005-07-28 Nitto Denko Corp 電子部品内蔵基板の製造方法
JP4285339B2 (ja) * 2004-06-15 2009-06-24 パナソニック株式会社 回路モジュールおよび回路モジュールの製造方法
JP4254725B2 (ja) 2005-02-23 2009-04-15 ヤマハ株式会社 プリント基板、及び温度検出素子の実装構造
JP2007266240A (ja) * 2006-03-28 2007-10-11 Fujitsu Ltd 電子装置及びそれを有する電子機器
JP2010200982A (ja) * 2009-03-04 2010-09-16 Panasonic Corp 可撓性センサモジュール
JP2011035345A (ja) * 2009-08-06 2011-02-17 Fujitsu Ltd 半導体素子モジュール、電子回路ユニット、電子デバイス、及び、半導体素子モジュールの製造方法
EP2333831B1 (en) * 2009-12-10 2016-03-02 ST-Ericsson SA Method for packaging an electronic device
KR20120079742A (ko) * 2011-01-05 2012-07-13 삼성전자주식회사 폴디드 적층 패키지 및 그 제조방법
DE102011119841B4 (de) * 2011-12-01 2013-12-12 I F M Electronic Gmbh Elektronikeinheit, Verfahren zur Herstellung einer Elektronikeinheit und elektronisches Messgerät mit einer Elektronikeinheit
US9483726B2 (en) * 2014-12-10 2016-11-01 VivaLnk Inc. Three dimensional electronic patch
KR20160109428A (ko) * 2015-03-11 2016-09-21 삼성에스디아이 주식회사 배터리 팩
US11145577B2 (en) * 2016-12-29 2021-10-12 Intel Corporation Lead frame with angular deflections and wrapped printed wiring boards for system-in-package apparatus
TWI664881B (zh) * 2017-01-13 2019-07-01 Murata Manufacturing Co., Ltd. 零件模組

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001015228A1 (en) 1999-08-19 2001-03-01 Seiko Epson Corporation Wiring board, method of manufacturing wiring board, electronic device, method of manufacturing electronic device, circuit board and electronic apparatus
JP2004253759A (ja) 2002-12-24 2004-09-09 Auto Network Gijutsu Kenkyusho:Kk 制御回路基板及び回路構成体

Also Published As

Publication number Publication date
CN112514064B (zh) 2024-09-24
CN112514064A (zh) 2021-03-16
WO2020026732A1 (ja) 2020-02-06
US20210293629A1 (en) 2021-09-23
US11898915B2 (en) 2024-02-13
JP2020021815A (ja) 2020-02-06

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