JP7036604B2 - 積層圧電セラミック部品及び圧電デバイス - Google Patents
積層圧電セラミック部品及び圧電デバイス Download PDFInfo
- Publication number
- JP7036604B2 JP7036604B2 JP2018013962A JP2018013962A JP7036604B2 JP 7036604 B2 JP7036604 B2 JP 7036604B2 JP 2018013962 A JP2018013962 A JP 2018013962A JP 2018013962 A JP2018013962 A JP 2018013962A JP 7036604 B2 JP7036604 B2 JP 7036604B2
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- JP
- Japan
- Prior art keywords
- internal electrode
- piezoelectric ceramic
- electrode
- face
- ceramic body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
- H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/871—Single-layered electrodes of multilayer piezoelectric or electrostrictive devices, e.g. internal electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
- H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018013962A JP7036604B2 (ja) | 2018-01-30 | 2018-01-30 | 積層圧電セラミック部品及び圧電デバイス |
| US16/258,376 US11362261B2 (en) | 2018-01-30 | 2019-01-25 | Multi-layer piezoelectric ceramic component and piezoelectric device |
| CN201910090497.3A CN110098316B (zh) | 2018-01-30 | 2019-01-30 | 层叠压电陶瓷部件和压电器件 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018013962A JP7036604B2 (ja) | 2018-01-30 | 2018-01-30 | 積層圧電セラミック部品及び圧電デバイス |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019134035A JP2019134035A (ja) | 2019-08-08 |
| JP2019134035A5 JP2019134035A5 (enExample) | 2021-02-04 |
| JP7036604B2 true JP7036604B2 (ja) | 2022-03-15 |
Family
ID=67392402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018013962A Active JP7036604B2 (ja) | 2018-01-30 | 2018-01-30 | 積層圧電セラミック部品及び圧電デバイス |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US11362261B2 (enExample) |
| JP (1) | JP7036604B2 (enExample) |
| CN (1) | CN110098316B (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7128628B2 (ja) * | 2018-01-30 | 2022-08-31 | 太陽誘電株式会社 | 積層圧電セラミック部品及び圧電デバイス |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001085753A (ja) | 1999-09-16 | 2001-03-30 | Murata Mfg Co Ltd | 圧電アクチュエータ |
| JP2002094134A (ja) | 2000-09-14 | 2002-03-29 | Ngk Insulators Ltd | 薄型積層圧電/電歪素子および同積層圧電/電歪素子の製造方法 |
| JP2002280630A (ja) | 2001-03-06 | 2002-09-27 | Ceramtec Ag Innov Ceramic Eng | 圧電セラミック多層アクチュエーターおよびその製造方法 |
| WO2006087871A1 (ja) | 2005-02-15 | 2006-08-24 | Murata Manufacturing Co., Ltd. | 積層型圧電素子 |
| JP2007150200A (ja) | 2005-11-30 | 2007-06-14 | Murata Mfg Co Ltd | 電子部品の製造方法 |
| JP2011066308A (ja) | 2009-09-18 | 2011-03-31 | Tdk Corp | セラミック電子部品およびその製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61239682A (ja) * | 1985-04-16 | 1986-10-24 | Tohoku Metal Ind Ltd | 積層型圧電バイモルフ素子の製造方法 |
| JP3185226B2 (ja) * | 1991-01-30 | 2001-07-09 | 株式会社村田製作所 | 圧電バイモルフ素子の駆動方法及び圧電バイモルフ素子 |
| DE602004029076D1 (de) * | 2003-10-27 | 2010-10-21 | Kyocera Corp | Mehrschichtiges piezoelektrisches bauelement |
| JP2007335485A (ja) * | 2006-06-13 | 2007-12-27 | Funai Electric Co Ltd | 積層型圧電アクチュエータおよびその製造方法 |
| JP5558577B2 (ja) | 2011-10-03 | 2014-07-23 | 京セラ株式会社 | 圧電振動装置およびそれを用いた携帯端末 |
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2018
- 2018-01-30 JP JP2018013962A patent/JP7036604B2/ja active Active
-
2019
- 2019-01-25 US US16/258,376 patent/US11362261B2/en active Active
- 2019-01-30 CN CN201910090497.3A patent/CN110098316B/zh active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001085753A (ja) | 1999-09-16 | 2001-03-30 | Murata Mfg Co Ltd | 圧電アクチュエータ |
| JP2002094134A (ja) | 2000-09-14 | 2002-03-29 | Ngk Insulators Ltd | 薄型積層圧電/電歪素子および同積層圧電/電歪素子の製造方法 |
| JP2002280630A (ja) | 2001-03-06 | 2002-09-27 | Ceramtec Ag Innov Ceramic Eng | 圧電セラミック多層アクチュエーターおよびその製造方法 |
| WO2006087871A1 (ja) | 2005-02-15 | 2006-08-24 | Murata Manufacturing Co., Ltd. | 積層型圧電素子 |
| JP2007150200A (ja) | 2005-11-30 | 2007-06-14 | Murata Mfg Co Ltd | 電子部品の製造方法 |
| JP2011066308A (ja) | 2009-09-18 | 2011-03-31 | Tdk Corp | セラミック電子部品およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110098316A (zh) | 2019-08-06 |
| JP2019134035A (ja) | 2019-08-08 |
| US20190237656A1 (en) | 2019-08-01 |
| CN110098316B (zh) | 2023-12-29 |
| US11362261B2 (en) | 2022-06-14 |
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