JP7035748B2 - ワークの両面研磨装置 - Google Patents

ワークの両面研磨装置 Download PDF

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Publication number
JP7035748B2
JP7035748B2 JP2018076296A JP2018076296A JP7035748B2 JP 7035748 B2 JP7035748 B2 JP 7035748B2 JP 2018076296 A JP2018076296 A JP 2018076296A JP 2018076296 A JP2018076296 A JP 2018076296A JP 7035748 B2 JP7035748 B2 JP 7035748B2
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JP
Japan
Prior art keywords
surface plate
hole
double
work
plate
Prior art date
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Application number
JP2018076296A
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English (en)
Japanese (ja)
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JP2019181632A (ja
Inventor
真美 久保田
啓一 高梨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumco Corp
Original Assignee
Sumco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumco Corp filed Critical Sumco Corp
Priority to JP2018076296A priority Critical patent/JP7035748B2/ja
Priority to PCT/JP2019/005924 priority patent/WO2019198343A1/ja
Priority to TW108105256A priority patent/TWI731305B/zh
Publication of JP2019181632A publication Critical patent/JP2019181632A/ja
Application granted granted Critical
Publication of JP7035748B2 publication Critical patent/JP7035748B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/10—Internal combustion engine [ICE] based vehicles
    • Y02T10/40—Engine management systems

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP2018076296A 2018-04-11 2018-04-11 ワークの両面研磨装置 Active JP7035748B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2018076296A JP7035748B2 (ja) 2018-04-11 2018-04-11 ワークの両面研磨装置
PCT/JP2019/005924 WO2019198343A1 (ja) 2018-04-11 2019-02-18 ワークの両面研磨装置
TW108105256A TWI731305B (zh) 2018-04-11 2019-02-18 工件的兩面研磨裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018076296A JP7035748B2 (ja) 2018-04-11 2018-04-11 ワークの両面研磨装置

Publications (2)

Publication Number Publication Date
JP2019181632A JP2019181632A (ja) 2019-10-24
JP7035748B2 true JP7035748B2 (ja) 2022-03-15

Family

ID=68163169

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018076296A Active JP7035748B2 (ja) 2018-04-11 2018-04-11 ワークの両面研磨装置

Country Status (3)

Country Link
JP (1) JP7035748B2 (zh)
TW (1) TWI731305B (zh)
WO (1) WO2019198343A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7435113B2 (ja) * 2020-03-23 2024-02-21 株式会社Sumco ワークの両面研磨装置
JP7168109B1 (ja) 2022-01-24 2022-11-09 信越半導体株式会社 両面研磨装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030180973A1 (en) 2002-02-04 2003-09-25 Kurt Lehman Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool
US20030205325A1 (en) 2001-12-12 2003-11-06 Lam Research Corporation Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection
JP2011249833A (ja) 1995-03-28 2011-12-08 Applied Materials Inc Ｃｍｐプロセス中のインシチュウ終点検出に用いるポリッシングパッド
JP2017052027A (ja) 2015-09-08 2017-03-16 株式会社東京精密 ウェーハ研磨装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
JP5917994B2 (ja) * 2012-04-23 2016-05-18 スピードファム株式会社 研磨装置の計測用窓構造
JP6197598B2 (ja) * 2013-11-18 2017-09-20 株式会社Sumco ワークの両面研磨装置及び両面研磨方法
JP2016064495A (ja) * 2014-09-24 2016-04-28 東洋ゴム工業株式会社 積層研磨パッド及びその製造方法
JP6622105B2 (ja) * 2016-02-10 2019-12-18 スピードファム株式会社 平面研磨装置
JP6622117B2 (ja) * 2016-03-08 2019-12-18 スピードファム株式会社 平面研磨装置及びキャリア

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011249833A (ja) 1995-03-28 2011-12-08 Applied Materials Inc Ｃｍｐプロセス中のインシチュウ終点検出に用いるポリッシングパッド
US20030205325A1 (en) 2001-12-12 2003-11-06 Lam Research Corporation Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection
US20030180973A1 (en) 2002-02-04 2003-09-25 Kurt Lehman Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool
JP2017052027A (ja) 2015-09-08 2017-03-16 株式会社東京精密 ウェーハ研磨装置

Also Published As

Publication number Publication date
TW201944479A (zh) 2019-11-16
WO2019198343A1 (ja) 2019-10-17
TWI731305B (zh) 2021-06-21
JP2019181632A (ja) 2019-10-24

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