JP7025612B2 - 熱伝導性組成物 - Google Patents

熱伝導性組成物 Download PDF

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Publication number
JP7025612B2
JP7025612B2 JP2016571954A JP2016571954A JP7025612B2 JP 7025612 B2 JP7025612 B2 JP 7025612B2 JP 2016571954 A JP2016571954 A JP 2016571954A JP 2016571954 A JP2016571954 A JP 2016571954A JP 7025612 B2 JP7025612 B2 JP 7025612B2
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Prior art keywords
heat conductive
heat
heating element
volume
conductive composition
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JP2016571954A
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Japanese (ja)
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JPWO2016121563A1 (ja
Inventor
学 北田
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Sekisui Polymatech Co Ltd
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Sekisui Polymatech Co Ltd
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=56543181&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP7025612(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Sekisui Polymatech Co Ltd filed Critical Sekisui Polymatech Co Ltd
Publication of JPWO2016121563A1 publication Critical patent/JPWO2016121563A1/ja
Priority to JP2021206973A priority Critical patent/JP7315133B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2016571954A 2015-01-29 2016-01-19 熱伝導性組成物 Active JP7025612B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2021206973A JP7315133B2 (ja) 2015-01-29 2021-12-21 熱伝導性組成物

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015016131 2015-01-29
JP2015016131 2015-01-29
PCT/JP2016/051349 WO2016121563A1 (ja) 2015-01-29 2016-01-19 熱伝導性組成物

Related Child Applications (1)

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JP2021206973A Division JP7315133B2 (ja) 2015-01-29 2021-12-21 熱伝導性組成物

Publications (2)

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JPWO2016121563A1 JPWO2016121563A1 (ja) 2017-11-09
JP7025612B2 true JP7025612B2 (ja) 2022-02-25

Family

ID=56543181

Family Applications (2)

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JP2016571954A Active JP7025612B2 (ja) 2015-01-29 2016-01-19 熱伝導性組成物
JP2021206973A Active JP7315133B2 (ja) 2015-01-29 2021-12-21 熱伝導性組成物

Family Applications After (1)

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JP2021206973A Active JP7315133B2 (ja) 2015-01-29 2021-12-21 熱伝導性組成物

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JP (2) JP7025612B2 (https=)
WO (1) WO2016121563A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102917127B1 (ko) * 2018-11-09 2026-01-26 세키수이 폴리머텍 가부시키가이샤 열전도성 조성물, 열전도성 부재, 열전도성 부재의 제조 방법, 방열 구조, 발열 복합 부재, 방열 복합 부재
JP7136065B2 (ja) * 2019-11-14 2022-09-13 信越化学工業株式会社 熱伝導性シリコーン組成物及び熱伝導性シリコーンシート
JP7621993B2 (ja) * 2022-01-18 2025-01-27 信越化学工業株式会社 熱伝導性シリコーン組成物および半導体装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003321658A (ja) 2002-04-30 2003-11-14 Dainippon Ink & Chem Inc 難燃性熱伝導電気絶縁粘着シート
JP2006193626A (ja) 2005-01-14 2006-07-27 Efuko Kk 非架橋樹脂組成物およびそれを用いた熱伝導性成形体
JP2010120979A (ja) 2008-11-17 2010-06-03 Taika:Kk 熱伝導性シリコーンゲル硬化物
JP2011089079A (ja) 2009-10-26 2011-05-06 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーン組成物及びその硬化物
JP2011178821A (ja) 2010-02-26 2011-09-15 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーン組成物及びその硬化物

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3543663B2 (ja) * 1999-03-11 2004-07-14 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及びその製造方法
KR100858836B1 (ko) * 2001-05-14 2008-09-17 다우 코닝 도레이 캄파니 리미티드 열전도성 실리콘 조성물
JP4587636B2 (ja) * 2002-11-08 2010-11-24 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物
JP4993555B2 (ja) * 2005-12-07 2012-08-08 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 付加反応硬化型シリコーン組成物
JP5345340B2 (ja) * 2008-05-16 2013-11-20 新日鉄住金マテリアルズ株式会社 アルミナ配合粒子および樹脂成形体

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003321658A (ja) 2002-04-30 2003-11-14 Dainippon Ink & Chem Inc 難燃性熱伝導電気絶縁粘着シート
JP2006193626A (ja) 2005-01-14 2006-07-27 Efuko Kk 非架橋樹脂組成物およびそれを用いた熱伝導性成形体
JP2010120979A (ja) 2008-11-17 2010-06-03 Taika:Kk 熱伝導性シリコーンゲル硬化物
JP2011089079A (ja) 2009-10-26 2011-05-06 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーン組成物及びその硬化物
JP2011178821A (ja) 2010-02-26 2011-09-15 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーン組成物及びその硬化物

Also Published As

Publication number Publication date
JP7315133B2 (ja) 2023-07-26
WO2016121563A1 (ja) 2016-08-04
JP2022033201A (ja) 2022-02-28
JPWO2016121563A1 (ja) 2017-11-09

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