JP7017098B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP7017098B2 JP7017098B2 JP2018039892A JP2018039892A JP7017098B2 JP 7017098 B2 JP7017098 B2 JP 7017098B2 JP 2018039892 A JP2018039892 A JP 2018039892A JP 2018039892 A JP2018039892 A JP 2018039892A JP 7017098 B2 JP7017098 B2 JP 7017098B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- region
- layer
- semiconductor element
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
12:半導体素子
14:半導体基板
16:上面電極
18:下面電極
20:下側放熱板
22:上側放熱板
24:導体スペーサ
26:モールド樹脂
28、30、32:はんだ(層)
50:積層体
K:金属間化合物
X:ボイド
Claims (1)
- 電極を有する半導体素子と、
前記電極にはんだ層を介して接合される導体部材と、を備え、
前記電極は、平面視したときに、第1領域と、前記第1領域から前記半導体素子の周縁まで延びる第2領域とを有し、
前記電極では、前記第1領域において前記はんだ層に接する金属層が、前記第2領域において前記はんだ層に接する金属層よりも、融点の低い材料で形成されている、
半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018039892A JP7017098B2 (ja) | 2018-03-06 | 2018-03-06 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018039892A JP7017098B2 (ja) | 2018-03-06 | 2018-03-06 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019153749A JP2019153749A (ja) | 2019-09-12 |
JP7017098B2 true JP7017098B2 (ja) | 2022-02-08 |
Family
ID=67946974
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018039892A Active JP7017098B2 (ja) | 2018-03-06 | 2018-03-06 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP7017098B2 (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010056181A (ja) | 2008-08-26 | 2010-03-11 | Toyota Motor Corp | 半導体装置 |
US20140367701A1 (en) | 2012-01-18 | 2014-12-18 | Mitsubishi Electrict Corporation | Semiconductor device and method of manufacturing semiconductor device |
JP2015115349A (ja) | 2013-12-09 | 2015-06-22 | 関西電力株式会社 | 半導体装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05206178A (ja) * | 1991-11-20 | 1993-08-13 | Nec Corp | 半導体チップ |
JPH10322010A (ja) * | 1997-05-16 | 1998-12-04 | Toyota Motor Corp | 部品の接着方法およびその方法に用いる部品 |
-
2018
- 2018-03-06 JP JP2018039892A patent/JP7017098B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010056181A (ja) | 2008-08-26 | 2010-03-11 | Toyota Motor Corp | 半導体装置 |
US20140367701A1 (en) | 2012-01-18 | 2014-12-18 | Mitsubishi Electrict Corporation | Semiconductor device and method of manufacturing semiconductor device |
JP2015115349A (ja) | 2013-12-09 | 2015-06-22 | 関西電力株式会社 | 半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2019153749A (ja) | 2019-09-12 |
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