JP7014817B2 - 浮遊式ウェハチャック - Google Patents

浮遊式ウェハチャック Download PDF

Info

Publication number
JP7014817B2
JP7014817B2 JP2019561307A JP2019561307A JP7014817B2 JP 7014817 B2 JP7014817 B2 JP 7014817B2 JP 2019561307 A JP2019561307 A JP 2019561307A JP 2019561307 A JP2019561307 A JP 2019561307A JP 7014817 B2 JP7014817 B2 JP 7014817B2
Authority
JP
Japan
Prior art keywords
wafer
chuck
edge
grips
contact pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019561307A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020520105A (ja
JP2020520105A5 (https=
Inventor
アビブ ブラン
バイバウ ヴィシャール
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KLA Corp
Original Assignee
KLA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KLA Corp filed Critical KLA Corp
Publication of JP2020520105A publication Critical patent/JP2020520105A/ja
Publication of JP2020520105A5 publication Critical patent/JP2020520105A5/ja
Application granted granted Critical
Publication of JP7014817B2 publication Critical patent/JP7014817B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2019561307A 2017-05-12 2018-05-11 浮遊式ウェハチャック Active JP7014817B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201762505248P 2017-05-12 2017-05-12
US62/505,248 2017-05-12
US15/652,659 US10083852B1 (en) 2017-05-12 2017-07-18 Floating wafer chuck
US15/652,659 2017-07-18
PCT/US2018/032175 WO2018209160A1 (en) 2017-05-12 2018-05-11 Floating wafer chuck

Publications (3)

Publication Number Publication Date
JP2020520105A JP2020520105A (ja) 2020-07-02
JP2020520105A5 JP2020520105A5 (https=) 2021-07-26
JP7014817B2 true JP7014817B2 (ja) 2022-02-01

Family

ID=63557076

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019561307A Active JP7014817B2 (ja) 2017-05-12 2018-05-11 浮遊式ウェハチャック

Country Status (5)

Country Link
US (1) US10083852B1 (https=)
JP (1) JP7014817B2 (https=)
KR (1) KR102351354B1 (https=)
CN (1) CN110612602B (https=)
WO (1) WO2018209160A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111725129B (zh) * 2020-06-29 2023-02-14 北京北方华创微电子装备有限公司 晶圆承载装置及半导体工艺设备
CN114188266B (zh) * 2020-09-15 2026-03-27 无锡华瑛微电子技术有限公司 半导体处理装置
EP4053634A1 (en) * 2021-03-02 2022-09-07 ASML Netherlands B.V. Substrate restraining system
US20240030006A1 (en) * 2022-07-25 2024-01-25 Micron Technology, Inc. Erosion rate monitoring for wafer fabrication equipment

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005057297A (ja) 2003-08-07 2005-03-03 Nanophotonics Ag ディスク状の物体用の保持装置
JP2005086049A (ja) 2003-09-10 2005-03-31 Yaskawa Electric Corp ウエハ把持装置
JP2006049880A (ja) 2004-07-12 2006-02-16 August Technology Corp ウエハ保持装置
JP2010130021A (ja) 2008-11-26 2010-06-10 Semes Co Ltd スピンヘッドとこれを有する基板処理装置及び基板支持方法
JP2011071477A (ja) 2009-08-27 2011-04-07 Tokyo Electron Ltd 液処理装置および液処理方法
JP2012004320A (ja) 2010-06-16 2012-01-05 Tokyo Electron Ltd 処理装置及び処理方法
JP2014045028A (ja) 2012-08-24 2014-03-13 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2017504199A (ja) 2013-12-23 2017-02-02 ケーエルエー−テンカー コーポレイション 非接触式ウェハチャッキングのためのシステム及び方法
JP2017069263A (ja) 2015-09-28 2017-04-06 株式会社Ｓｃｒｅｅｎホールディングス 基板保持装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3217323B2 (ja) * 1999-03-03 2001-10-09 保 目崎 半導体材料の遠心処理装置
US20020066475A1 (en) * 2000-06-26 2002-06-06 Steven Verhaverbeke Chuck for holding wafer
JP4405048B2 (ja) * 2000-07-11 2010-01-27 Ｏｋｉセミコンダクタ株式会社 位置合せ用治具
JP4488646B2 (ja) * 2001-04-23 2010-06-23 株式会社トプコン ウェーハ保持装置
JP2004115872A (ja) * 2002-09-26 2004-04-15 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP3890025B2 (ja) * 2003-03-10 2007-03-07 東京エレクトロン株式会社 塗布処理装置及び塗布処理方法
KR20060074559A (ko) * 2004-12-27 2006-07-03 동부일렉트로닉스 주식회사 스핀 척의 웨이퍼 고정장치
JP4814731B2 (ja) * 2006-08-30 2011-11-16 株式会社日立ハイテクノロジーズ 基板保持装置、検査または処理の装置、基板保持方法、検査または処理の方法および検査装置
US7607647B2 (en) 2007-03-20 2009-10-27 Kla-Tencor Technologies Corporation Stabilizing a substrate using a vacuum preload air bearing chuck
KR20090029407A (ko) * 2007-09-18 2009-03-23 세메스 주식회사 지지부재 및 이를 구비하는 기판 처리 장치
US8646767B2 (en) * 2010-07-23 2014-02-11 Lam Research Ag Device for holding wafer shaped articles
KR20120105669A (ko) * 2011-03-16 2012-09-26 주식회사 로보스타 에지 그립식 프리-얼라이너
US9421617B2 (en) * 2011-06-22 2016-08-23 Tel Nexx, Inc. Substrate holder
US10283396B2 (en) * 2016-06-27 2019-05-07 Asm Nexx, Inc. Workpiece holder for a wet processing system

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005057297A (ja) 2003-08-07 2005-03-03 Nanophotonics Ag ディスク状の物体用の保持装置
JP2005086049A (ja) 2003-09-10 2005-03-31 Yaskawa Electric Corp ウエハ把持装置
JP2006049880A (ja) 2004-07-12 2006-02-16 August Technology Corp ウエハ保持装置
JP2010130021A (ja) 2008-11-26 2010-06-10 Semes Co Ltd スピンヘッドとこれを有する基板処理装置及び基板支持方法
JP2011071477A (ja) 2009-08-27 2011-04-07 Tokyo Electron Ltd 液処理装置および液処理方法
JP2012004320A (ja) 2010-06-16 2012-01-05 Tokyo Electron Ltd 処理装置及び処理方法
JP2014045028A (ja) 2012-08-24 2014-03-13 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2017504199A (ja) 2013-12-23 2017-02-02 ケーエルエー−テンカー コーポレイション 非接触式ウェハチャッキングのためのシステム及び方法
JP2017069263A (ja) 2015-09-28 2017-04-06 株式会社Ｓｃｒｅｅｎホールディングス 基板保持装置

Also Published As

Publication number Publication date
WO2018209160A1 (en) 2018-11-15
KR102351354B1 (ko) 2022-01-13
JP2020520105A (ja) 2020-07-02
CN110612602B (zh) 2021-06-29
US10083852B1 (en) 2018-09-25
KR20190141259A (ko) 2019-12-23
CN110612602A (zh) 2019-12-24

Similar Documents

Publication Publication Date Title
JP7014817B2 (ja) 浮遊式ウェハチャック
JP6740065B2 (ja) 基板洗浄装置、基板処理装置、基板洗浄方法および基板処理方法
US20120193009A1 (en) Substrate bonding method and substrate bonding apparatus
KR102490708B1 (ko) 기판 이면 텍스처링
TWI788295B (zh) 基板之背側摩擦減少
JP2018111200A (ja) エンドエフェクターを供給するための器具、システム、及び方法
JPH10242255A (ja) 真空吸着装置
TWI505398B (zh) 從一承載基板分隔一基板之裝置與方法
CN111699439A (zh) 用于修复衬底支撑件的系统、装置和方法
TWI845700B (zh) 微影設備的基板處置系統及其方法
US12451374B2 (en) Bonding system and inspection method of inspecting combined substrate
CN107116460A (zh) 半导体制造装置、系统及方法
CN110582844A (zh) 对齐设备及方法
US9815091B2 (en) Roll to roll wafer backside particle and contamination removal
TWI803597B (zh) 用於形狀度量之基板固持設備和方法
JP2015159157A (ja) 研磨方法及び装置、並びにデバイス製造方法及びシステム
TW201906690A (zh) 吸氣層形成裝置、吸氣層形成方法及電腦記錄媒體
US12214529B2 (en) Conveyance apparatus, planarization apparatus, and article manufacturing method
TW202418462A (zh) 接合裝置、接合方法以及部件製造方法
KR102802323B1 (ko) 기판 반송 핸드, 기판 반송 시스템, 저장 매체, 및 물품 제조 방법
US6135867A (en) Apparatus and method for glass ball lens polishing
US20260115978A1 (en) Conveyance apparatus, planarization apparatus, and article manufacturing method
US20260052951A1 (en) Film frame carrier with whole wafer hybrid chuck
TW202343608A (zh) 基板處理裝置及基板處理方法
TW202544969A (zh) 平坦化方法、平坦化設備和物品製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210507

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210507

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20210507

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20210831

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20211112

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20220118

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20220120

R150 Certificate of patent or registration of utility model

Ref document number: 7014817

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250