KR102351354B1 - 플로팅 웨이퍼 척 - Google Patents

플로팅 웨이퍼 척 Download PDF

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Publication number
KR102351354B1
KR102351354B1 KR1020197036631A KR20197036631A KR102351354B1 KR 102351354 B1 KR102351354 B1 KR 102351354B1 KR 1020197036631 A KR1020197036631 A KR 1020197036631A KR 20197036631 A KR20197036631 A KR 20197036631A KR 102351354 B1 KR102351354 B1 KR 102351354B1
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KR
South Korea
Prior art keywords
wafer
chuck
edge
edge grippers
grippers
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KR1020197036631A
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English (en)
Korean (ko)
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KR20190141259A (ko
Inventor
아비브 발란
바입호 비샬
Original Assignee
케이엘에이 코포레이션
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Publication of KR20190141259A publication Critical patent/KR20190141259A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H01L21/68707—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H01L21/68735—
    • H01L21/68785—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020197036631A 2017-05-12 2018-05-11 플로팅 웨이퍼 척 Active KR102351354B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201762505248P 2017-05-12 2017-05-12
US62/505,248 2017-05-12
US15/652,659 US10083852B1 (en) 2017-05-12 2017-07-18 Floating wafer chuck
US15/652,659 2017-07-18
PCT/US2018/032175 WO2018209160A1 (en) 2017-05-12 2018-05-11 Floating wafer chuck

Publications (2)

Publication Number Publication Date
KR20190141259A KR20190141259A (ko) 2019-12-23
KR102351354B1 true KR102351354B1 (ko) 2022-01-13

Family

ID=63557076

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197036631A Active KR102351354B1 (ko) 2017-05-12 2018-05-11 플로팅 웨이퍼 척

Country Status (5)

Country Link
US (1) US10083852B1 (https=)
JP (1) JP7014817B2 (https=)
KR (1) KR102351354B1 (https=)
CN (1) CN110612602B (https=)
WO (1) WO2018209160A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111725129B (zh) * 2020-06-29 2023-02-14 北京北方华创微电子装备有限公司 晶圆承载装置及半导体工艺设备
CN114188266B (zh) * 2020-09-15 2026-03-27 无锡华瑛微电子技术有限公司 半导体处理装置
EP4053634A1 (en) * 2021-03-02 2022-09-07 ASML Netherlands B.V. Substrate restraining system
US20240030006A1 (en) * 2022-07-25 2024-01-25 Micron Technology, Inc. Erosion rate monitoring for wafer fabrication equipment

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000252253A (ja) 1999-03-03 2000-09-14 Tamotsu Mesaki 半導体材料の遠心処理装置
JP2002319613A (ja) 2001-04-23 2002-10-31 Topcon Corp ウェーハ保持装置
US20050031497A1 (en) 2003-08-07 2005-02-10 Sonke Siebert Holding device for disk-shaped objects
US20060046396A1 (en) 2004-07-12 2006-03-02 Mark Harless Wafer holding mechanism

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020066475A1 (en) * 2000-06-26 2002-06-06 Steven Verhaverbeke Chuck for holding wafer
JP4405048B2 (ja) * 2000-07-11 2010-01-27 Ｏｋｉセミコンダクタ株式会社 位置合せ用治具
JP2004115872A (ja) * 2002-09-26 2004-04-15 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP3890025B2 (ja) * 2003-03-10 2007-03-07 東京エレクトロン株式会社 塗布処理装置及び塗布処理方法
JP4189663B2 (ja) 2003-09-10 2008-12-03 株式会社安川電機 ウエハ把持装置
KR20060074559A (ko) * 2004-12-27 2006-07-03 동부일렉트로닉스 주식회사 스핀 척의 웨이퍼 고정장치
JP4814731B2 (ja) * 2006-08-30 2011-11-16 株式会社日立ハイテクノロジーズ 基板保持装置、検査または処理の装置、基板保持方法、検査または処理の方法および検査装置
US7607647B2 (en) 2007-03-20 2009-10-27 Kla-Tencor Technologies Corporation Stabilizing a substrate using a vacuum preload air bearing chuck
KR20090029407A (ko) * 2007-09-18 2009-03-23 세메스 주식회사 지지부재 및 이를 구비하는 기판 처리 장치
US8714169B2 (en) 2008-11-26 2014-05-06 Semes Co. Ltd. Spin head, apparatus for treating substrate, and method for treating substrate
JP5301505B2 (ja) 2009-08-27 2013-09-25 東京エレクトロン株式会社 液処理装置および液処理方法
JP5327144B2 (ja) 2010-06-16 2013-10-30 東京エレクトロン株式会社 処理装置及び処理方法
US8646767B2 (en) * 2010-07-23 2014-02-11 Lam Research Ag Device for holding wafer shaped articles
KR20120105669A (ko) * 2011-03-16 2012-09-26 주식회사 로보스타 에지 그립식 프리-얼라이너
US9421617B2 (en) * 2011-06-22 2016-08-23 Tel Nexx, Inc. Substrate holder
JP6019516B2 (ja) 2012-08-24 2016-11-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
US9653338B2 (en) * 2013-12-23 2017-05-16 Kla-Tencor Corporation System and method for non-contact wafer chucking
JP6562507B2 (ja) 2015-09-28 2019-08-21 株式会社Ｓｃｒｅｅｎホールディングス 基板保持装置およびこれを備える基板処理装置
US10283396B2 (en) * 2016-06-27 2019-05-07 Asm Nexx, Inc. Workpiece holder for a wet processing system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000252253A (ja) 1999-03-03 2000-09-14 Tamotsu Mesaki 半導体材料の遠心処理装置
JP2002319613A (ja) 2001-04-23 2002-10-31 Topcon Corp ウェーハ保持装置
US20050031497A1 (en) 2003-08-07 2005-02-10 Sonke Siebert Holding device for disk-shaped objects
US20060046396A1 (en) 2004-07-12 2006-03-02 Mark Harless Wafer holding mechanism

Also Published As

Publication number Publication date
WO2018209160A1 (en) 2018-11-15
JP2020520105A (ja) 2020-07-02
JP7014817B2 (ja) 2022-02-01
CN110612602B (zh) 2021-06-29
US10083852B1 (en) 2018-09-25
KR20190141259A (ko) 2019-12-23
CN110612602A (zh) 2019-12-24

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