CN111725129B - 晶圆承载装置及半导体工艺设备 - Google Patents

晶圆承载装置及半导体工艺设备 Download PDF

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CN111725129B
CN111725129B CN202010604530.2A CN202010604530A CN111725129B CN 111725129 B CN111725129 B CN 111725129B CN 202010604530 A CN202010604530 A CN 202010604530A CN 111725129 B CN111725129 B CN 111725129B
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武树波
郭冰亮
武学伟
许文学
刘玉杰
李新颖
马迎功
赵晨光
宋玲彦
张璐
陈玉静
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Beijing Naura Microelectronics Equipment Co Ltd
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    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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Abstract

本发明公开一种晶圆承载装置及半导体工艺设备，晶圆承载装置包括托盘支撑部、多个夹持组件、支撑架和用于放置晶圆的托盘；托盘支撑部与支撑架相连接，多个夹持组件沿托盘的周向间隔设置，多个夹持组件围成托盘夹持空间，托盘夹持空间用于放置托盘；夹持组件包括弹性件和导向部，导向部远离托盘的一端与托盘支撑部转动连接，弹性件设置在导向部靠近托盘的一端与托盘支撑部之间；在托盘放入托盘夹持空间的情况下，导向部在托盘的压力作用下发生转动，弹性件被压缩，在将托盘导入托盘夹持空间底部的同时对托盘进行对中。上述方案能够解决托盘在转运的过程中，容易使得托盘在晶圆承载装置内的安装位置发生变化，而导致的晶圆的成膜质量较差的问题。

Description

晶圆承载装置及半导体工艺设备
技术领域
本发明涉及半导体制造技术领域，尤其涉及一种晶圆承载装置及半导体工艺设备。
背景技术
随着科技的快速发展，LED照明灯具和LED显示屏广泛应用于人们的生活中。LED为LED灯具或LED显示屏中主体部件，LED生产过程中需要在晶圆上沉积薄膜，以提高LED的亮度。通常采用半导体工艺设备对晶圆进行镀膜加工。
相关技术中，半导体工艺设备可以包括晶圆承载装置(一般称为花篮，cassete)，晶圆承载装置用于装载晶圆。晶圆承载装置上装载有多个托盘，每个托盘上可以承载多个晶圆，半导体工艺设备可以通过运转托盘，从而实现多个晶圆同时加工，进而提高半导体工艺设备的加工效率。
然而，托盘在转运的过程中，容易使得托盘在晶圆承载装置内的安装位置发生变化，进而影响晶圆的成膜质量。
发明内容
本发明公开一种晶圆承载装置及半导体工艺设备，以解决托盘在转运的过程中，容易使得托盘在晶圆承载装置内的安装位置发生变化，而导致的晶圆的成膜质量较差的问题。
为了解决上述问题，本发明采用下述技术方案：
一种晶圆承载装置，包括托盘支撑部、多个夹持组件、支撑架和用于放置晶圆的托盘；
所述托盘支撑部与所述支撑架相连接，所述托盘支撑部上设置有多个所述夹持组件，多个所述夹持组件沿所述托盘的周向间隔设置，多个所述夹持组件围成托盘夹持空间，所述托盘夹持空间用于放置所述托盘；
所述夹持组件包括弹性件和导向部，所述导向部远离所述托盘的一端与所述托盘支撑部转动连接，所述弹性件设置在所述导向部靠近所述托盘的一端与所述托盘支撑部之间；
在所述托盘放入所述托盘夹持空间的情况下，所述托盘的边缘与所述导向部靠近所述托盘的一端相接触，所述导向部在所述托盘的压力作用下发生转动，所述弹性件被压缩，在将所述托盘导入所述托盘夹持空间底部的同时对所述托盘进行对中。
一种半导体工艺设备，包括装载腔室和上述晶圆承载装置，所述装载腔室用于容置所述晶圆承载装置。
本发明采用的技术方案能够达到以下有益效果：
本发明公开的晶圆承载装置中，当托盘装载时，托盘的边缘与导向部相接触，在托盘重力作用下，导向部以其与托盘支撑部连接的一端为转动中心，向下转动，在转动的过程中压缩弹性件，托盘沿导向部的边缘滑动，将托盘导入托盘夹持空间的底部，同时可以沿托盘的径向推动托盘，托盘的周向间隔设置有多个夹持组件，每个夹持组件均包括有导向部，多个导向部相互配合，从而可以将托盘进行对中。托盘在晶圆承载装置内多次转运装载的过程中，托盘在晶圆承载装置内的位置不容易发生变化，进而使得托盘转运到加工腔室内时，托盘的位置基本一致，进而能够提高晶圆的片间均匀性，从而使得晶圆的成膜质量较高。
附图说明
此处所说明的附图用来提供对本发明的进一步理解，构成本发明的一部分，本发明的示意性实施例及其说明用于解释本发明，并不构成对本发明的不当限定。在附图中：
图1为本发明实施例公开的晶圆承载装置的部分结构剖视图；
图2为本发明实施例公开的晶圆承载装置的俯视图；
图3和图4为本发明实施例公开的晶圆承载装置中，托盘的安装示意图；
图5为本发明实施例公开的晶圆承载装置中，托盘支撑部的剖视图；
图6为本发明实施例公开的晶圆承载装置中，转轴的剖视图；
图7为本发明实施例公开的晶圆承载装置中，导向部的剖视图。
附图标记说明：
100-托盘支撑部、110-避让凹槽、120-第一容纳凹槽、130-承载凸起、140-第一连接孔、
200-夹持组件、210-导向部、211-导向斜面、212-第二容纳凹槽、213-第二连接孔、220-弹性件、230-转轴、
300-托盘、
400-支撑架、
500-螺纹连接件。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚，下面将结合本发明具体实施例及相应的附图对本发明技术方案进行清楚、完整地描述。显然，所描述的实施例仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
以下结合附图，详细说明本发明各个实施例公开的技术方案。
如图1～图7所示，本发明实施例公开一种晶圆承载装置，所公开的晶圆承载装置包括托盘支撑部100、多个夹持组件200、支撑架400和用于放置晶圆的托盘300。
支撑架400为晶圆承载装置的其他部件提供安装基础，托盘支撑部100与支撑架400相连接，托盘支撑部100上设置有多个夹持组件200，多个夹持组件200沿托盘300的周向间隔设置，多个夹持组件200围成托盘夹持空间，托盘夹持空间用于放置托盘300。托盘300上设置有多个晶圆安装位置，从而可以同时加工多个晶圆，进而能够提高晶圆的加工效率。
夹持组件200包括弹性件220和导向部210，导向部210远离托盘300的一端与托盘支撑部100转动连接，弹性件220设置在导向部210靠近托盘300的一端与托盘支撑部100之间。
在托盘300放入托盘夹持空间的情况下，托盘300的边缘与导向部210靠近托盘300的一端相接触，导向部210在托盘300的压力作用下发生转动，弹性件220被压缩，在将托盘300导入托盘夹持空间底部的同时对托盘300进行对中。
导向部210具有第一位置和第二位置，在第一位置时，托盘300未放入托盘夹持空间，弹性件220仅受到导向部210自身的重力，此时，弹性件220的弹力应该大于导向部210的自身重力。在第二位置时，托盘300放入托盘夹持空间，弹性件220受到导向部210自身的重力以及托盘300的重力，此时，导向部210的重力与托盘300的重力大于弹性件220的重力，进而使得弹性件220被压缩。弹性件220为导向部210提供弹力，从而使得托盘300移出托盘夹持空间的情况下，弹性件220驱动导向部210由第二位置恢复到第一位置。
托盘300的移出和装载可以通过机械手爪进行抓取，也可以通过人工进行抓取，对此本文不作限制。
可选的，弹性件220可以为弹簧，当然也可以为其他弹性部件，本文对此不作限制。
本发明实施例中，当托盘300装载时，托盘300的边缘与导向部210相接触，在托盘300重力作用下，导向部210以其与托盘支撑部100连接的一端为转动中心，向下转动，在转动的过程中压缩弹性件220，托盘300沿导向部210的边缘滑动，将托盘300导入托盘夹持空间的底部，同时可以沿托盘的径向推动托盘，托盘300的周向间隔设置有多个夹持组件200，每个夹持组件200均包括有导向部210，多个导向部210相互配合，从而可以将托盘300进行对中。托盘300在晶圆承载装置内多次移出或者装载的过程中，托盘300在晶圆承载装置内的位置不容易发生变化，进而使得托盘300转运到加工腔室内时，托盘300的位置基本一致，进而能够提高晶圆的片间均匀性，从而使得晶圆的成膜质量较高。
另外，当托盘300导入托盘夹持空间的底部时，导向部210的边缘与托盘300的边缘相接触，从而使得导向部210能够限制托盘300移动，进而能够有效防止托盘300滑盘。
上述实施例中，托盘300的边缘容易搭靠在导向部210的边缘上，从而使得托盘300难以装入托盘夹持空间内。为此，在另一种可选的实施例中，导向部210靠近托盘300的一端可以设置有导向斜面211，在托盘300放入托盘夹持空间的情况下，导向斜面211与托盘300的边缘导向配合。此方案中，导向斜面211相对光滑，从而使得导向部210与导向斜面211之间的摩擦力较小，进而使得导向部210与托盘300之间的滑动性更好，促使托盘300更加顺畅地装入托盘夹持空间内。
进一步地，导向斜面211与托盘300的轴线之间的夹角可以为30°。此方案既可以保证托盘300更加顺畅地装入托盘夹持空间内，又使得托盘300滑动的距离较小，从而使得托盘300与导向斜面211滑动时产生的颗粒物较少，从而能够减少晶圆上附着的颗粒物，进而提高了晶圆承载装置的可靠性。
当然，导向斜面211与托盘300的轴线之间的夹角还可以为45°、60°等角度，对于导向斜面211与托盘300的轴线之间的夹角可以根据实际工况进行选择，本文不作限制。
上述实施例中，导向部210可以设置于托盘支撑部100的表面，此种方案中，托盘300在移出或装载的过程中，托盘300容易碰触到导向部210，从而使得导向部210和托盘300容易损坏，进而使得晶圆承载装置的安全性较差。为此，在另一种可选的实施例中，托盘支撑部100可以开设有避让凹槽110，导向部210的部分可以位于避让凹槽110内。此方案中，导向部210的部分位于避让凹槽110内，从而使得导向部210凸出于托盘支撑部100的体积较小，进而使得托盘支撑部100在移出或装载的过程中，不容易碰触到导向部210，从而不容易损坏导向部210或者托盘300，进而提高了晶圆承载装饰的安全性。
进一步地，多个夹持组件200的安装位置应避开托盘300的传输路径，从而防止托盘300在传输的过程中与夹持组件200发生干涉。
在另一种可选的实施例中，避让凹槽110的侧壁上可以开设有第一连接孔140，导向部210远离托盘300的一端可以开设有第二连接孔213，导向部210与托盘支撑部100可以通过转轴230、第一连接孔140和第二连接孔213转动连接。转轴230可以在第一连接孔140和第二连接孔213内转动。此方案中，第一连接孔140设置于避让凹槽110的侧壁，因此转轴230可以位于避让凹槽110内，进而使得转轴230不容易与托盘300发生碰撞，进一步提高了晶圆承载装置的安全性。另外，转轴230均相对于第一连接孔140和第二连接孔213转动，导向部210通过转轴230实现转动，从而使得导向部210可以距离避让凹槽110的侧壁较远，进而使得避让凹槽110的侧壁不容易与导向部210发生干涉，促使导向部210与托盘支撑部100之间的转动更加容易。
上述实施例中，避让凹槽110内需要预留弹性件220的安装空间，进而使得导向部210与弹性件220的堆叠高度较高，使得导向部210外露于避让凹槽110的部分的体积较大，进而容易与托盘300发生碰撞。为此，在另一种可选的实施例中，避让凹槽110的槽底可以开设有第一容纳凹槽120，弹性件220的一端可以位于第一容纳凹槽120内，导向部210靠近托盘300的一端朝向避让凹槽110的槽底的面上可以开设有第二容纳凹槽212，弹性件220的另一端可以位于第二容纳凹槽212内。此方案中，弹性件220的部分可以位于第一容纳凹槽120和第二容纳凹槽212内，从而使得弹性件220与导向部210的堆叠高度较小，进而使得导向部210外露于避让凹槽110的部分的体积较小，从而不容易与托盘300发生碰撞，进一步提高晶圆承载装置的安全性。
上述实施例中，在托盘300导入托盘夹持空间底部后，托盘300可以处于悬空状态，然而，弹性件220发生晃动时，容易致使托盘300发生晃动，进而使得托盘300的稳定性较差。基于此，在另一种可选的实施例中，托盘支撑部100可以设置有承载凸起130，在托盘300导入托盘夹持空间底部后，承载凸起130与托盘300相接触，用以承载托盘300。此方案中，托盘300在导入托盘夹持空间后，承载凸起130能够对托盘300起到支撑作用，进而能够有效防止托盘300晃动，从而提高托盘300的稳定性。
在一种可选的实施例中，本发明实施例公开的晶圆承载装置还包括螺纹连接件500，支撑架400可以与托盘支撑部100通过螺纹连接件500螺纹连接。此方案中，支撑架400与托盘支撑部100拆卸方便，当支撑架400或者托盘支撑部100损坏时，可以对托盘300或者托盘支撑部100进行更换，从而提高了晶圆承载装置的可维修性能。另外，螺纹连接件500还可以对支撑架400和托盘支撑部100起到定位的作用，进而保证托盘支撑部100在支撑架400的安装位置准确。
当然，支撑架400与托盘支撑部100还可以采用焊接、卡接、铆接等方式连接，本文对此不作限制。
为了提高晶圆承载装置的承载能力，在另一种可选的实施例中，托盘支撑部100的数量为多个，多个托盘支撑部100均与支撑架400相连接，多个托盘支撑部100可以沿托盘300的轴线方向依次间隔设置。此方案中，托盘支撑部100的数量较多，从而可以承载较多的托盘300，进而使得可以承载较多的晶圆，进一步提高了晶圆承载装置的承载能力。需要注意的是，相邻的两个托盘支撑部100之间需要预留出足够的位置，从而使得托盘300方便移出或装载。
基于本发明上述任一实施例的晶圆承载装置，本发明实施例还公开一种半导体工艺设备，所公开的半导体工艺设备具有上述任一实施例的晶圆承载装置。本发明公开的半导体工艺设备还可以包括装载腔室，装载腔室用于容置晶圆承载装置。
由于晶圆承载装置的质量较大，操作人员将晶圆承载装置移入或者移出装载腔室的难度较大，为此，在另一种可选的实施例中，晶圆承载装置可以固定安装于装载腔室内。当操作人员在装载晶圆时，仅需要移动托盘300即可，无需移动晶圆承载装置，进而使得操作人员的工作量较小，方便操作人员操作。
本发明上文实施例中重点描述的是各个实施例之间的不同，各个实施例之间不同的优化特征只要不矛盾，均可以组合形成更优的实施例，考虑到行文简洁，在此则不再赘述。
以上所述仅为本发明的实施例而已，并不用于限制本发明。对于本领域技术人员来说，本发明可以有各种更改和变化。凡在本发明的精神和原理之内所作的任何修改、等同替换、改进等，均应包含在本发明的权利要求范围之内。

Claims (10)

1.一种晶圆承载装置，其特征在于，包括托盘支撑部(100)、多个夹持组件(200)、支撑架(400)和用于放置晶圆的托盘(300)；
所述托盘支撑部(100)与所述支撑架(400)相连接，所述托盘支撑部(100)上设置有多个所述夹持组件(200)，多个所述夹持组件(200)沿所述托盘(300)的周向间隔设置，多个所述夹持组件(200)围成托盘夹持空间，所述托盘夹持空间用于放置所述托盘(300)；
所述夹持组件(200)包括弹性件(220)和导向部(210)，所述导向部(210)远离所述托盘(300)的一端与所述托盘支撑部(100)转动连接，所述弹性件(220)设置在所述导向部(210)靠近所述托盘(300)的一端与所述托盘支撑部(100)之间；
在所述托盘(300)放入所述托盘夹持空间的情况下，所述托盘(300)的边缘与所述导向部(210)靠近所述托盘(300)的一端相接触，所述导向部(210)在所述托盘(300)的压力作用下发生转动，所述弹性件(220)被压缩，在将所述托盘(300)导入所述托盘夹持空间底部的同时对所述托盘(300)进行对中。
2.根据权利要求1所述的晶圆承载装置，其特征在于，所述导向部(210)靠近所述托盘的一端设置有导向斜面(211)，在所述托盘(300)放入所述托盘夹持空间的情况下，所述导向斜面(211)与所述托盘(300)的边缘导向配合。
3.根据权利要求2所述的晶圆承载装置，其特征在于，所述导向斜面(211)与所述托盘(300)的轴线之间的夹角为30°。
4.根据权利要求1所述的晶圆承载装置，其特征在于，所述托盘支撑部(100)开设有避让凹槽(110)，所述导向部(210)的部分位于所述避让凹槽(110)内。
5.根据权利要求4所述的晶圆承载装置，其特征在于，所述避让凹槽(110)的侧壁上开设有第一连接孔(140)，所述导向部(210)远离所述托盘(300)的一端开设有第二连接孔(213)，所述导向部(210)与所述托盘支撑部(100)通过转轴(230)、所述第一连接孔(140)和所述第二连接孔(213)转动连接。
6.根据权利要求4所述的晶圆承载装置，其特征在于，所述避让凹槽(110)的槽底开设有第一容纳凹槽(120)，所述弹性件(220)的一端位于所述第一容纳凹槽(120)内，所述导向部(210)靠近所述托盘(300)的一端朝向所述避让凹槽(110)的槽底的面上开设有第二容纳凹槽(212)，所述弹性件(220)的另一端位于所述第二容纳凹槽(212)内。
7.根据权利要求1所述的晶圆承载装置，其特征在于，所述托盘支撑部(100)设置有承载凸起(130)，在所述托盘(300)导入所述托盘夹持空间底部后，所述承载凸起(130)与所述托盘(300)相接触，以承载所述托盘(300)。
8.根据权利要求1所述的晶圆承载装置，其特征在于，所述晶圆承载装置包括螺纹连接件(500)，所述支撑架(400)与所述托盘支撑部(100)通过所述螺纹连接件(500)螺纹连接。
9.根据权利要求1至8中任一项所述的晶圆承载装置，其特征在于，所述托盘支撑部(100)的数量为多个，多个所述托盘支撑部(100)均与所述支撑架(400)相连接，多个所述托盘支撑部(100)沿所述托盘(300)的轴线方向依次间隔设置。
10.一种半导体工艺设备，其特征在于，包括装载腔室和权利要求1至8中任一项所述的晶圆承载装置，所述装载腔室用于容置所述晶圆承载装置。
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