JP7010950B2 - セラミックス回路基板及びその製造方法 - Google Patents

セラミックス回路基板及びその製造方法 Download PDF

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JP7010950B2
JP7010950B2 JP2019532831A JP2019532831A JP7010950B2 JP 7010950 B2 JP7010950 B2 JP 7010950B2 JP 2019532831 A JP2019532831 A JP 2019532831A JP 2019532831 A JP2019532831 A JP 2019532831A JP 7010950 B2 JP7010950 B2 JP 7010950B2
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Prior art keywords
powder
circuit board
ceramic
mass
filler metal
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Japanese (ja)
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JPWO2019022133A1 (ja
Inventor
晃正 湯浅
祐作 原田
貴裕 中村
周平 森田
浩二 西村
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Denka Co Ltd
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Denka Co Ltd
Denki Kagaku Kogyo KK
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
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    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
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    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
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    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
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    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Structural Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Ceramic Products (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
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CN115136297A (zh) * 2020-02-13 2022-09-30 阿莫绿色技术有限公司 功率模块及其制造方法
CN119501220A (zh) * 2020-02-17 2025-02-25 株式会社东芝 接合体的制造方法
CN114929650A (zh) 2020-03-30 2022-08-19 电化株式会社 电路基板、接合体以及它们的制造方法
JP7717699B6 (ja) * 2020-07-27 2025-08-27 株式会社東芝 接合体、回路基板、半導体装置、及び接合体の製造方法
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CN111958145A (zh) * 2020-08-24 2020-11-20 合肥工业大学 一种用于max相复合陶瓷的钎焊材料及钎焊工艺
EP4234517B1 (de) * 2020-10-20 2025-10-01 Kabushiki Kaisha Toshiba Verbundener körper, keramische leiterplatte damit und halbleiterbauelement
CN112469201B (zh) * 2020-11-24 2021-12-07 绍兴德汇半导体材料有限公司 一种覆铜衬板制作方法
EP4270499A4 (de) * 2020-12-25 2025-01-29 CoorsTek GK Silicaelement und led-vorrichtung
CN116964022A (zh) * 2021-03-24 2023-10-27 电化株式会社 复合基板
CN119547568A (zh) * 2022-05-19 2025-02-28 阿尔法能源技术公司 将锂耦合到衬底
EP4311818A1 (de) * 2022-07-29 2024-01-31 Heraeus Electronics GmbH & Co. KG Metall-keramik-substrat mit kontaktbereich
EP4311819A1 (de) * 2022-07-29 2024-01-31 Heraeus Electronics GmbH & Co. KG Metall-keramik-substrat mit kontaktbereich
JP7576209B2 (ja) * 2022-11-25 2024-10-30 デンカ株式会社 窒化ケイ素焼結体及びその製造方法、接合体、並びに、パワーモジュール
EP4593075A1 (de) * 2024-01-24 2025-07-30 Heraeus Electronics GmbH & Co. KG Metall-keramik-substrat mit kontaktbereich
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EP3661337B1 (de) 2021-09-01
EP3661337A1 (de) 2020-06-03
WO2019022133A1 (ja) 2019-01-31
EP3661337A4 (de) 2020-07-22
CN110945974B (zh) 2023-05-16
CN110945974A (zh) 2020-03-31
JPWO2019022133A1 (ja) 2020-06-11
US20200163210A1 (en) 2020-05-21
KR20200029480A (ko) 2020-03-18

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