JP7010413B2 - 樹脂組成物、半導体封止材料、プリプレグ、回路基板、ビルドアップフィルム、ソルダーレジスト、ドライフィルム及びプリント配線板 - Google Patents

樹脂組成物、半導体封止材料、プリプレグ、回路基板、ビルドアップフィルム、ソルダーレジスト、ドライフィルム及びプリント配線板 Download PDF

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JP7010413B2
JP7010413B2 JP2021521069A JP2021521069A JP7010413B2 JP 7010413 B2 JP7010413 B2 JP 7010413B2 JP 2021521069 A JP2021521069 A JP 2021521069A JP 2021521069 A JP2021521069 A JP 2021521069A JP 7010413 B2 JP7010413 B2 JP 7010413B2
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JPWO2021006164A1 (ja
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優佑 松村
昭文 中村
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DIC Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/58—Epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Reinforced Plastic Materials (AREA)
JP2021521069A 2019-07-08 2020-07-02 樹脂組成物、半導体封止材料、プリプレグ、回路基板、ビルドアップフィルム、ソルダーレジスト、ドライフィルム及びプリント配線板 Active JP7010413B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2019126884 2019-07-08
JP2019126884 2019-07-08
JP2019126885 2019-07-08
JP2019126885 2019-07-08
PCT/JP2020/025946 WO2021006164A1 (ja) 2019-07-08 2020-07-02 樹脂組成物、半導体封止材料、プリプレグ、回路基板、ビルドアップフィルム、ソルダーレジスト、ドライフィルム及びプリント配線板

Publications (2)

Publication Number Publication Date
JPWO2021006164A1 JPWO2021006164A1 (ja) 2021-09-13
JP7010413B2 true JP7010413B2 (ja) 2022-01-26

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JP2021521069A Active JP7010413B2 (ja) 2019-07-08 2020-07-02 樹脂組成物、半導体封止材料、プリプレグ、回路基板、ビルドアップフィルム、ソルダーレジスト、ドライフィルム及びプリント配線板

Country Status (4)

Country Link
JP (1) JP7010413B2 (zh)
CN (1) CN113993924A (zh)
TW (1) TW202104334A (zh)
WO (1) WO2021006164A1 (zh)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003246828A (ja) 2002-02-27 2003-09-05 Fujitsu Ltd 熱硬化性ポリウレタン組成物、実装基板、実装基板の製造方法および電子回路基板
JP2006104277A (ja) 2004-10-04 2006-04-20 Yokohama Rubber Co Ltd:The 硬化性樹脂組成物
JP2003504893A5 (zh) 2000-07-06 2007-09-06
JP2013108068A (ja) 2011-10-27 2013-06-06 Sumitomo Bakelite Co Ltd プリント配線板用エポキシ樹脂組成物、プリプレグ、金属張積層板、プリント配線板および半導体装置
JP2017082128A (ja) 2015-10-29 2017-05-18 Dic株式会社 繊維強化複合材料用エポキシ樹脂組成物
JP2019070121A (ja) 2014-08-01 2019-05-09 日本化薬株式会社 エポキシ樹脂含有ワニス、エポキシ樹脂組成物含有ワニス、プリプレグ、樹脂シート、プリント配線板、半導体装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2616638B2 (ja) * 1991-06-26 1997-06-04 日本ゼオン株式会社 磁気記録媒体
JPH0820706A (ja) * 1994-07-06 1996-01-23 Mitsubishi Chem Corp エポキシ樹脂組成物およびそれを用いたプリプレグ
JP3477854B2 (ja) * 1994-10-04 2003-12-10 株式会社スリーボンド プレコート型接着剤組成物の接着方法
JP3543409B2 (ja) * 1995-03-24 2004-07-14 大日本インキ化学工業株式会社 活性エネルギ−線硬化型エポキシアクリレ−ト樹脂組成物
JPH10273580A (ja) * 1997-03-28 1998-10-13 Sumitomo Bakelite Co Ltd 液晶セルの組立用シール材組成物及びそれを用いた液晶表示素子
MY140714A (en) * 1999-07-08 2010-01-15 Sunstar Engineering Inc Underfilling material for semiconductor package
JP4111653B2 (ja) * 2000-04-14 2008-07-02 日本化薬株式会社 樹脂組成物、レジストインキ組成物及びその硬化物
JP2002305212A (ja) * 2001-04-05 2002-10-18 Toshiba Chem Corp 半導体用マウントペースト
JP3778507B2 (ja) * 2002-11-28 2006-05-24 横浜ゴム株式会社 硬化剤組成物およびそれを含有した硬化性樹脂組成物
KR100652830B1 (ko) * 2005-12-29 2006-12-01 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물
JP6812342B2 (ja) * 2014-10-13 2021-01-13 ダウ グローバル テクノロジーズ エルエルシー アクリレートベースの強化剤を含有するエポキシ組成物
KR102465156B1 (ko) * 2017-09-08 2022-11-10 디아이씨 가부시끼가이샤 산기 함유 (메타)아크릴아미드 수지, 경화성 수지 조성물, 솔더레지스트용 수지 재료 및 레지스트 부재

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003504893A5 (zh) 2000-07-06 2007-09-06
JP2003246828A (ja) 2002-02-27 2003-09-05 Fujitsu Ltd 熱硬化性ポリウレタン組成物、実装基板、実装基板の製造方法および電子回路基板
JP2006104277A (ja) 2004-10-04 2006-04-20 Yokohama Rubber Co Ltd:The 硬化性樹脂組成物
JP2013108068A (ja) 2011-10-27 2013-06-06 Sumitomo Bakelite Co Ltd プリント配線板用エポキシ樹脂組成物、プリプレグ、金属張積層板、プリント配線板および半導体装置
JP2019070121A (ja) 2014-08-01 2019-05-09 日本化薬株式会社 エポキシ樹脂含有ワニス、エポキシ樹脂組成物含有ワニス、プリプレグ、樹脂シート、プリント配線板、半導体装置
JP2017082128A (ja) 2015-10-29 2017-05-18 Dic株式会社 繊維強化複合材料用エポキシ樹脂組成物

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CN113993924A (zh) 2022-01-28
JPWO2021006164A1 (ja) 2021-09-13
WO2021006164A1 (ja) 2021-01-14
TW202104334A (zh) 2021-02-01

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