JP7009552B2 - 研磨装置 - Google Patents
研磨装置 Download PDFInfo
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- JP7009552B2 JP7009552B2 JP2020084244A JP2020084244A JP7009552B2 JP 7009552 B2 JP7009552 B2 JP 7009552B2 JP 2020084244 A JP2020084244 A JP 2020084244A JP 2020084244 A JP2020084244 A JP 2020084244A JP 7009552 B2 JP7009552 B2 JP 7009552B2
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- 238000012806 monitoring device Methods 0.000 claims description 73
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
- B24B21/06—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving members with limited contact area pressing the belt against the work, e.g. shoes sweeping across the whole area to be ground
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/18—Accessories
- B24B21/20—Accessories for controlling or adjusting the tracking or the tension of the grinding belt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
本発明の好ましい態様は、前記監視装置は、前記移動距離がしきい値よりも大きい場合は、前記モータ駆動型移動装置に指令を出して前記押圧部材を前記基板の面に沿って移動させることを特徴とする。
本発明の好ましい態様は、前記押圧部材と前記アクチュエータとの間に配置された荷重測定器をさらに備え、前記監視装置は、前記荷重測定器によって測定された荷重が設定値未満である場合に、警報を発することを特徴とする。
本発明の好ましい態様は、前記距離測定器は、デジタルゲージ、磁気センサ、および渦電流センサのうちのいずれか1つであることを特徴とする。
上記参考例の好ましい態様は、前記所定時間は、前記モータ駆動型移動装置が前記押圧部材を前記基板の面に沿って移動させているときの時間の少なくとも一部を含んだ時間であることを特徴とする。
上記参考例の好ましい態様は、前記押圧部材と前記アクチュエータとの間に配置された荷重測定器をさらに備え、前記監視装置は、前記荷重測定器によって測定された荷重が設定値未満である場合に、警報を発することを特徴とする。
上記参考例の好ましい態様は、前記所定時間は、前記モータ駆動型移動装置が前記押圧部材を前記基板の面に沿って移動させているときの時間の少なくとも一部を含んだ時間であることを特徴とする。
上記参考例の好ましい態様は、前記押圧部材に加わる荷重を測定し、前記荷重が設定値未満である場合に、警報を発する工程をさらに含むことを特徴とする。
上記参考例の好ましい態様は、前記基板の面は、前記基板の裏面であることを特徴とする。
上記参考例の好ましい態様は、前記移動距離がしきい値よりも大きい場合は、モータ駆動型移動装置により前記押圧部材を前記基板の面に沿って移動させることを特徴とする。
上記参考例の好ましい態様は、前記アクチュエータから前記押圧部材に伝達される荷重を測定し、前記荷重が設定値未満である場合に、警報を発する工程をさらに含むことを特徴とする。
上記参考例の好ましい態様は、前記基板の面は、前記基板の裏面であることを特徴とする。
図1(a)および図1(b)は、基板の一例であるウェハの断面図である。より詳しくは、図1(a)はいわゆるストレート型のウェハの断面図であり、図1(b)はいわゆるラウンド型のウェハの断面図である。本明細書では、ウェハ(基板)の裏面とは、デバイスが形成されている面とは反対側の平坦な面をいう。ウェハの最外周面はベベル部と呼ばれる。ウェハの裏面はベベル部の半径方向内側にある平坦な面である。ウェハ裏面はベベル部に隣接する。
補正押圧力=(目標移動距離/測定された移動距離)×押圧力の設定値
ここで、目標移動距離は、押圧部材44が研磨テープ42をウェハWの裏面に正しく押し付けることができる押圧部材44の理論的な移動距離であり、測定された移動距離は、近接センサ76によって測定された押圧部材44の実際の移動距離であり、押圧力の設定値は、エアシリンダ45から押圧部材44に加えられる押圧力の現在の設定値である。
11 荷重圧ライン
12 背圧ライン
14 第1圧力レギュレータ
15 第2圧力レギュレータ
18 第1圧力センサ
19 第2圧力センサ
32 基板保持部
34 研磨ヘッド
37 基板ステージ
39 ステージモータ
40 真空ライン
42 研磨テープ(研磨具)
43 ローラー
44 押圧部材
45 エアシリンダ(アクチュエータ)
46 ピストン
47 ピストンロッド
48 第1チャンバ
49 第2チャンバ
51 巻き出しリール
52 巻き取りリール
55 研磨ヘッド移動装置(モータ駆動型移動装置)
57,58 液体供給ノズル
60 ボールねじ
61 サーボモータ
63 電力線
64 電流計
65 監視装置
70 ロードセル(荷重測定器)
73 距離測定器
75 センサターゲット
76 近接センサ
79 連結ベース
81 直動ガイド
82 直動レール
83 直動ブロック
85 デジタルゲージ
90 表面状態検出器
Claims (6)
- 基板を保持する基板保持部と、
研磨具を前記基板の面に押し付けるための押圧部材と、
前記押圧部材に押圧力を付与するアクチュエータと、
前記押圧部材を前記基板の面に沿って移動させるモータ駆動型移動装置と、
前記アクチュエータによって前記基板の面に向かって移動された前記押圧部材の移動距離を測定する距離測定器と、
前記距離測定器によって測定された前記押圧部材の移動距離に基づいて、前記研磨具が前記基板の面に接触したか否かを判断する監視装置とを備え、
前記監視装置は、前記移動距離がしきい値未満である場合に、予め設定された目標移動距離と、前記距離測定器によって測定された前記押圧部材の移動距離と、前記押圧力の設定値とから補正押圧力を算出し、前記アクチュエータに前記補正押圧力を発生させることで、前記押圧部材を移動させて前記研磨具を前記基板の面に接触させるように構成されていることを特徴とする研磨装置。 - 前記監視装置は、補正押圧力=(目標移動距離/測定された移動距離)×押圧力の設定値で表される計算式をその内部に予め格納していることを特徴とする請求項1に記載の研磨装置。
- 前記監視装置は、前記移動距離がしきい値よりも大きい場合は、前記モータ駆動型移動装置に指令を出して前記押圧部材を前記基板の面に沿って移動させることを特徴とする請求項1または2に記載の研磨装置。
- 前記押圧部材と前記アクチュエータとの間に配置された荷重測定器をさらに備え、
前記監視装置は、前記荷重測定器によって測定された荷重が設定値未満である場合に、警報を発することを特徴とする請求項1乃至3のいずれか一項に記載の研磨装置。 - 前記距離測定器は、非接触型距離センサであることを特徴とする請求項1乃至4のいずれか一項に記載の研磨装置。
- 前記距離測定器は、デジタルゲージ、磁気センサ、および渦電流センサのうちのいずれか1つであることを特徴とする請求項1乃至4のいずれか一項に記載の研磨装置。
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JP2016029817 | 2016-02-19 |
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US (1) | US11331769B2 (ja) |
JP (2) | JP2017148931A (ja) |
KR (1) | KR102384571B1 (ja) |
CN (1) | CN107097146B (ja) |
TW (1) | TWI784943B (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6908496B2 (ja) | 2017-10-25 | 2021-07-28 | 株式会社荏原製作所 | 研磨装置 |
JP6941046B2 (ja) * | 2017-12-20 | 2021-09-29 | 株式会社荏原製作所 | 研磨ヘッドおよび研磨装置 |
CN110788710B (zh) * | 2019-10-16 | 2021-02-19 | 中国电子科技集团公司第十一研究所 | 一种碲锌镉晶体表面磨抛装置 |
JP2021091033A (ja) * | 2019-12-10 | 2021-06-17 | キオクシア株式会社 | 研磨装置、研磨ヘッド、研磨方法、及び半導体装置の製造方法 |
CN110977720B (zh) * | 2019-12-27 | 2021-06-22 | 台州市圣西亚金刚石设备有限公司 | 砂轮磨削装置 |
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