JP6990590B2 - Electronic component insertion device, electronic component storage tape manufacturing device, electronic component insertion method, and electronic component storage tape manufacturing method - Google Patents

Description

The present invention comprises an electronic component insertion device and an electronic component insertion method for collectively inserting n electronic components (n is an integer of 2 or more) into n storage recesses of the carrier tape at the insertion position, and these devices and a method. The present invention relates to an electronic component storage tape manufacturing apparatus and an electronic component storage tape manufacturing method in which a cover tape sticking means and a cover tape sticking method are combined with the method.

The band-shaped carrier tape used in manufacturing the electronic component storage tape has storage recesses for electronic components at equal pitches in the length direction. This carrier tape becomes an electronic component storage tape by inserting a cover tape for closing the storage recess after inserting the electronic component into the storage recess at a predetermined insertion position. Incidentally, this electronic component storage tape is used by being attached to a tape feeder that allows the electronic component to be taken out from the storage recess while peeling off the cover tape, for example.

In the past, the method of inserting electronic components into the storage recess was adopted, but recently, the efficiency of inserting electronic components, in other words, the manufacture of electronic component storage tapes, has been adopted. In order to improve efficiency, a method of collectively inserting a plurality of electronic components into the same number of storage recesses has been studied (see Patent Documents 1 to 3 below).

By the way, electronic parts to be inserted, such as capacitors, inductors, varistor, etc., are being miniaturized based on the demands of consumers, and at present, electronic parts having a maximum standard dimension of 0.6 mm or less, for example, a substantially rectangular parallelepiped shape. Electronic components having a length (standard dimension) of 0.6 mm or less and a width (standard dimension) of 0.3 mm or less are also widely used. Further, with the miniaturization of electronic components, carrier tapes having storage recesses corresponding to small electronic components are also commercially available.

Since the size (including the dimensional tolerance) of the storage recess of the carrier tape is determined in consideration of the standard size and the dimensional tolerance of the electronic component to be inserted, the electronic component is small when it comes to each storage recess. Even so, there is no particular problem with individual insertion.

However, the size of the storage recess corresponding to small electronic parts is naturally small, and there is a tolerance in the two-dimensional positions (positions in the length direction and width direction of the carrier tape) of each storage recess, so that it is described above. When adopting the method of collectively inserting a plurality of electronic parts into the same number of storage recesses, it is necessary to fully consider the variation in the two-dimensional positions of each of the plurality of storage recesses.

That is, depending on the variation in the two-dimensional positions of each of the plurality of storage recesses, when a plurality of electronic components are collectively inserted into the same number of storage recesses, some electronic components are inserted in contact with the inner surface of the storage recesses. There is a concern that it will not be done smoothly. That is, when a plurality of electronic components are collectively inserted into the same number of storage recesses, especially when the electronic components are small, technical consideration is required so that the batch insertion can be performed more smoothly.

Japanese Unexamined Patent Publication No. 11-292252 Japanese Unexamined Patent Publication No. 2002-029505 Japanese Unexamined Patent Publication No. 2006-168754

The problem to be solved by the present invention is an electronic component insertion device that can perform batch insertion more smoothly when a plurality of electronic components are collectively inserted into the same number of storage recesses of a carrier tape, especially even when the electronic components are small. And to provide an electronic component insertion method, and to provide an electronic component storage tape manufacturing apparatus and an electronic component storage tape manufacturing method using the electronic component insertion device and the electronic component insertion method.

In order to solve the above problems, the electronic component insertion device according to the present invention intermittently moves strip-shaped carrier tapes having storage recesses for electronic components at equal pitches in the length direction, and n pieces (n is n) at the insertion position. It is an electronic component insertion device for collectively inserting electronic components (2 or more integers) into the n storage recesses of the carrier tape, and (A1) the n elements at an imaging position before the insertion position. Two-dimensional of each of the n storage recesses included in the image based on the image pickup means for imaging the carrier tape in the image pickup range including the storage recesses and (A2) the image obtained by the image pickup means. A deviation amount for calculating the deviation amount of the two-dimensional position of each of the n storage recesses based on the position detecting means for detecting the position and (A3) the two-dimensional position detected by the position detecting means. A quantity calculation means, (A4) a correction amount calculation means for calculating a common correction amount corresponding to the n storage recesses based on the deviation amount calculated by the deviation amount calculation means, and (A5). The carrier tape is based on a common correction amount calculated by the correction amount calculation means before the n electronic parts are collectively inserted into the n storage recesses included in the image at the insertion position. It is provided with a position correction means for changing the two-dimensional position of the n storage recesses by displacing at least the portion corresponding to the insertion position.

Further, the electronic component storage tape manufacturing apparatus according to the present invention has the above-mentioned electronic component insertion device and a cover tape for attaching a cover tape for closing the storage recess after the electronic component is inserted to the carrier tape. It is equipped with an attachment means.

Further, in the method for inserting an electronic component according to the present invention, a band-shaped carrier tape having storage recesses for electronic components at equal pitches is intermittently moved in the length direction, and n pieces (n is an integer of 2 or more) at the insertion position. This is an electronic component insertion method for collectively inserting the electronic components of the above into the n storage recesses of the carrier tape. 2 of each of the n storage recesses included in the image by the position detecting means based on the step of imaging the carrier tape in the imaging range including the storage recess and (B2) the image obtained by the imaging means. Based on the step of detecting the dimensional position and (B3) the two-dimensional position detected by the position detecting means, the deviation amount calculating means calculates the deviation amount of the two-dimensional position of each of the n storage recesses. A step, (B4) a step of calculating a common correction amount corresponding to the n storage recesses by the correction amount calculation means based on the deviation amount calculated by the deviation amount calculation means, and (B5) the above. At the insertion position, before the n electronic parts are collectively inserted into the n storage recesses included in the image, the position correction means is used based on the common correction amount calculated by the correction amount calculation means. The carrier tape is provided with a step of displaced at least a portion corresponding to the insertion position to change the two-dimensional position of the n storage recesses.

Further, in the method for manufacturing an electronic component storage tape according to the present invention, the electronic component insertion method described above and a cover tape for closing the storage recess after the electronic component is inserted are obtained by the cover tape adhering means. It has a step that adheres to the carrier tape.

According to the electronic component insertion device and the electronic component insertion method according to the present invention, batch insertion is performed when a plurality of electronic components are collectively inserted into the same number of storage recesses of the carrier tape, especially when the electronic components are small. It can be done smoothly.

Further, according to the electronic component storage tape manufacturing apparatus and the electronic component storage tape manufacturing method according to the present invention, the electronic component storage tape is manufactured with high efficiency by inserting the electronic component into the storage recess of the carrier tape with high efficiency. be able to.

FIG. 1A is a diagram showing an example of a carrier tape, and FIG. 1B is a diagram showing an example of an electronic component to be inserted. FIG. 2 is a partial view of the electronic component insertion device according to the present invention. FIG. 3 is a diagram showing an operation control system of the electronic component insertion device shown in FIG. 2. 4 (A) and 4 (B) are explanatory views of a carrier tape feeding operation when three electronic components are collectively inserted into three storage recesses. FIG. 4A is a diagram showing a first stopped state of the carrier tape at the insertion position shown in FIG. 2, and FIG. 4B is a diagram showing the second stopped state of the carrier tape. FIG. 6 is a diagram showing an operation flow related to the calculation of the common correction amount. FIG. 7A is a diagram showing a first stop state of the carrier tape at the imaging position shown in FIG. 2, and FIG. 7B is a diagram showing the second stop state of the carrier tape. 8 (A) is a diagram showing an example of an image obtained in the first stopped state shown in FIG. 7 (A), and FIG. 8 (B) is obtained in the second stopped state shown in FIG. 7 (B). It is a figure which shows an example of the image. FIG. 9 is a diagram showing an operation flow related to position correction of the storage recess. FIG. 10 is an explanatory diagram of a carrier tape insertion position and a stopped state at an imaging position when two electronic components are collectively inserted into two storage recesses. FIG. 11 is an explanatory diagram of a stopped state at the insertion position and the imaging position of the carrier tape when the four electronic components are collectively inserted into the four storage recesses. FIG. 12 is an explanatory diagram of a stopped state at the insertion position and the imaging position of the carrier tape when the five electronic components are collectively inserted into the five storage recesses. FIG. 13 is an explanatory diagram of a stopped state at the insertion position and the imaging position of the carrier tape when the six electronic components are collectively inserted into the six storage recesses. FIG. 14 is a diagram showing a carrier tape having a different pitch from that of the carrier tape shown in FIG. 1 (A).

First, an example of a carrier tape and an example of an electronic component to be inserted will be described with reference to FIG.

The carrier tape CT shown in FIG. 1 (A) has a band shape, and has a substantially rectangular parallelepiped storage recess CTa for electronic parts in the length direction (X direction in the figure, hereinafter referred to as the X direction). It has a pitch Pa, is spaced from the storage recess CTa in the width direction (Y direction in the figure, hereinafter the width direction is referred to as the Y direction), and has a feed hole CTb in the X direction with an equal pitch Pb different from the storage recess CTa. is doing. Incidentally, there are no particular restrictions on the processing type of the carrier tape CT, and for example, a compression processing type carrier tape, an embossing type carrier tape, or the like can be appropriately used.

The electronic component EC shown in FIG. 1B has a substantially rectangular parallelepiped shape, and has a dimensional relationship of length d1> width d2 = height d3 (not shown) in reference dimensions. Incidentally, there is no particular limitation on the type of electronic component EC, and electronic components such as capacitors, inductors and varistor can be used as appropriate.

For reference, the Y-direction dimension W of the carrier tape CT on which FIG. 1 (A) is based is 4 mm ± 0.05 mm. Further, the Y-direction dimension Dy of each storage recess CTa is 0.46 mm ± 0.02 mm, the X-direction dimension Dx is 0.25 mm ± 0.02 mm, and the Y-direction and the dimension Dz (depth, shown) in the direction orthogonal to the X-direction. (Omitted) is 0.25 mm ± 0.02 mm. Further, the diameter φ of each feed hole CTb is 0.9 mm ± 0.05 mm. Further, the pitch Pa of the storage recess CTa is 1 mm ± 0.02 mm, and the pitch Pb of the feed hole CTb is 2 mm ± 0.04 mm. Further, the Y-direction spacing (reference numeral omitted) between the center of each storage recess CTa and the center of each feed hole CTb is 1.8 mm ± 0.02 mm. The electronic component EC on which FIG. 1B is based is referred to as 0402, the length d1 is 0.4 mm ± 0.02 mm, and the width d2 and height d3 (not shown) are 0.2 mm. It is ± 0.02 mm.

Next, the configuration of the electronic component insertion device using the carrier tape CT shown in FIG. 1 (A) and the electronic component EC shown in FIG. 1 (B) will be described with reference to FIGS. 2 to 5.

This electronic component insertion device intermittently moves the carrier tape CT (see FIG. 1A) in the + X direction, and each time the three storage recesses CTa of the carrier tape CT stop at the insertion position IP, these three It has a function of collectively inserting three electronic components EC (see FIG. 1B) into the storage recess CTa of the above. Incidentally, the intermittent movement of the carrier tape CT is guided by a guide rail (not shown).

Reference numeral 12 in FIGS. 2 and 3 is a motor for intermittently moving the carrier tape CT so that three of the storage recesses CTa of the carrier tape CT are sequentially stopped at the insertion position IP. As shown in FIGS. 2 and 4, the shaft (reference numeral omitted) of the intermittent movement motor 12 is intermittently provided with protrusions 11a on the outer peripheral surface capable of engaging with the feed hole CTb of the carrier tape CT at equal angular intervals. The centers of the moving sprockets 11 are connected. Further, some of the protrusions 11a of the intermittently moving sprocket 11 are engaged with the feed holes CTb of the carrier tape CT.

Since the pitch Pa of the storage recess CTa of the carrier tape CT is 1/2 of the pitch Pb of the feed hole CTb, as shown in FIG. 4, the carrier tape CT and the intermittent movement sprocket 11 have 2 at the insertion position IP. It stops alternately in various states (first stop state Ship1 and second stop state Ship2 described later).

4 (A) and 5 (A) show the first stopped state Ship1. In the first stopped state Ship1, the center of one protrusion 11a of the intermittent movement sprocket 11 is the target position TG (insertion position). The carrier tape CT is stopped so as to coincide with the position corresponding to the center of the IP in the X direction. 4 (B) and 5 (B) show a second stopped state Ship2, in which the center of the two protrusions 11a of the intermittent movement sprocket 11 coincides with the target position TG. The carrier tape CT is stopped. As shown in FIGS. 5A and 5B, in the first stop state Ship1 and the second stop state Ship2, the three storage recesses CTa are similarly stopped at the insertion position IP. There is no change.

Reference numeral 13 in FIG. 2 is a two-dimensional moving mechanism such as an XY table, which has a movable portion 13a that can move in the X and Y directions, and the intermittent moving motor 12 is fixed to the movable portion 13a. ing. Reference numeral 13b in FIG. 3 indicates a motor for moving in the X direction of the two-dimensional moving mechanism 13, and reference numeral 13c indicates a motor for moving in the Y direction of the two-dimensional moving mechanism 13. The two-dimensional moving mechanism mechanism 13 moves the movable portion 13a and the intermittent moving motor 12 fixed to the movable portion 13a in the X direction and the Y direction by the operation of the X direction moving motor 13b and the Y direction moving motor 13c. As a result, the intermittent movement sprocket 11 connected to the shaft of the intermittent movement motor 12 can be moved in the X direction and the Y direction.

That is, in the first stopped state Ship1 and the second stopped state Ship2 shown in FIGS. 4 and 5, some protrusions 11a of the intermittent movement sprocket 11 are engaged with the feed hole CTb of the carrier tape CT. .. Therefore, by moving the intermittent movement sprocket 11 in the X direction and the Y direction by the two-dimensional movement mechanism 13, at least the portion corresponding to the insertion position IP of the carrier tape CT is displaced, and three pieces corresponding to the insertion position IP are displaced. The two-dimensional position (position in the X direction and the Y direction) of the storage recess CTa can be changed.

Reference numeral 14 in FIG. 2 is a component transfer disk for transporting the electronic component EC to the insertion position IP. Although not shown, a component holding portion composed of a rectangular groove or a rectangular hole capable of accommodating an electronic component EC corresponds to the pitch Pa of the storage recess CTa of the carrier tape CT on the outer peripheral portion of the component transport disk 14. It is provided at intervals. Since the electronic component insertion device shown in FIG. 2 collectively inserts three electronic component ECs into the three storage recesses CTa of the carrier tape CT at the insertion position IP, the component holding portion of the component transfer disk 14 The total number of the components is a multiple of 3, and the orientation of each of the three components matches the orientation of the three storage recesses CTa stopped at the insertion position IP. Further, although not shown, the component transfer disk 14 is provided with an air suction passage for maintaining a state in which the electronic component EC is held in the component holding portion, and the gathering portion of the air suction passage is air. It is connected to the air suction device via a tube.

Reference numeral 14a in FIG. 3 is a motor for intermittently rotating the component transfer disk 14 so that three of the component holding portions of the component transfer disk 14 are sequentially stopped at the insertion position IP. The center of the component transfer disk 14 is connected to the shaft (not shown) of the intermittent rotation motor 14a.

Reference numeral 15 in FIG. 3 carriers the three electronic component ECs held in the three component holders each time three of the component holders of the component transfer disk 14 stop at the insertion position IP. It is an insertion drive source for collectively inserting into the three storage recesses CTa of the tape CT. Although not shown, the insertion drive source is preferably a solenoid, and the plunger of this solenoid has three components corresponding to the electronic component EC held in the three component holders stopped at the insertion position IP. An insertion pin is provided. By the way, an air discharge device can also be used as the insertion drive source. In this case, the tip of the air tube connected to the air discharge device is an electronic component held by three component holders stopped at the insertion position IP. It is preferable to face the EC and insert the three electronic component ECs held in the three component holding portions by the discharged air into the three storage recesses CTa of the carrier tape CT at once.

Although not shown, the component transfer disk 14 is provided with a component supply device for supplying electronic component EC to the component holding unit. This component supply device may sequentially supply the electronic component EC from the tip of the linear feeder connected to the ball feeder to the component holding unit, or may supply the electronic component EC in a bulk state (in different directions). It may be sequentially supplied to the component holding portion by using its own weight, air, or the like.

The reference numeral PP in FIG. 2 is an imaging position set in front of the insertion position IP (in the −X direction). Reference numeral 16 in FIG. 3 is a camera for imaging the carrier tape CT in the imaging range IA (see FIG. 7) including the three storage recesses CTa at the imaging position PP, and is a MOS or CMOS. It has a built-in image sensor such as a CCD or a CCD. Although not shown, an illuminator that illuminates the carrier tape CT at the time of imaging is arranged in or around the camera 16.

As described above, since the electronic component insertion device shown in FIG. 2 collectively inserts the three electronic component ECs into the three storage recesses CTa of the carrier tape CT at the insertion position IP, the image is captured. There are storage recesses CTa that are multiples of 3 (27 in FIG. 2) between the three storage recesses CTa at the position PP and the three storage recesses CTa at the insertion position IP. Incidentally, the imaging position PP may be set at a position closer to the insertion position IP than the position shown in FIG. 2, or may be set at a position farther from the insertion position IP than the position shown in FIG. Further, in FIG. 7, for convenience, the imaging range IA is drawn with the same size as the rectangular frame indicating the insertion position IP and the stop position PP, but the imaging range IA is a rectangular frame indicating the insertion position IP and the stop position PP. It may be different in size from.

Reference numeral 17 in FIG. 3 is a control unit having a microcomputer, various drivers, and various interfaces, and stores a program for operation control in the ROM. Reference numeral 18 in FIG. 3 is a storage unit for temporarily storing an image obtained by the camera 16, and the storage unit 16 also temporarily stores a common correction amount and the like described later.

The component transport disk 14 of the electronic component insertion device may be oriented horizontally or substantially horizontally, or its rotation axis may be oriented so as to be tilted within an acute angle range with respect to the vertical line. In either case, the upper surface of the carrier tape CT shown in FIG. 2, the rotation axis of the intermittent movement sprocket 11 and the upper surface of the movable portion 13a of the two-dimensional movement mechanism 13 are oriented in the same direction as the component transfer disk 14. Then, the desired operation can be realized.

Next, the basic operation of component insertion in the electronic component insertion device will be described with reference to FIGS. 2 to 5.

The intermittent movement sprocket 11 shown in FIGS. 2 and 4 and the component transfer disk 14 shown in FIG. 2 rotate intermittently in synchronization with each other. Since the electronic component insertion device shown in FIG. 2 collectively inserts three electronic component ECs into the three storage recesses CTa of the carrier tape CT at the insertion position IP, the carrier tape CT stores three. Intermittent movement, that is, movement and stop in the + X direction are repeated so that the concave portion CTa is sequentially stopped at the insertion position IP, and the component transfer disk 14 is intermittently rotated, that is, so that the three holding portions are sequentially stopped at the insertion position IP. , Rotating and stopping in the counterclockwise direction of FIG. 2 is repeated.

As shown in FIGS. 2, 4 and 5, when the carrier tape CT and the component transfer disk 14 are stopped, the insertion drive source 15 operates and is held by the three component holding portions stopped at the insertion position IP. The electronic component EC is collectively inserted into the three storage recesses CTa stopped at the same insertion position IP. When this batch insertion is completed, the carrier tape CT moves in the + X direction so that the next three storage recesses CTa stop at the insertion position IP, and the component transfer disk 14 also has the next three component holding portions. Rotate counterclockwise to stop at the insertion position IP. After that, the same batch insertion, movement and stop of the carrier tape CT, and rotation and stop of the component transfer disk 14 are repeated. That is, the operation of collectively inserting the three electronic component ECs into the three storage recesses CTa of the carrier tape CT at the insertion position IP is repeated.

Next, using FIGS. 6 to 9, the position correction operation in the electronic component insertion device, that is, the three electronic component ECs are collectively inserted into the three storage recesses CTa of the carrier tape CT at the insertion position IP. The correction operation of the two-dimensional positions (positions in the X direction and the Y direction) of the three storage recesses CTa performed in the previous step will be described.

As shown in FIG. 7, when the intermittently moving carrier tape CT stops at the imaging position PP, the imaging range including the three storage recesses CTa by the camera 16 (see FIG. 3) at the imaging position PP. The carrier tape CT is imaged in IA (see FIG. 7) (see steps ST11 and ST12 in FIG. 6).

Since the pitch Pa of the storage recess CTa of the carrier tape CT is 1/2 of the pitch Pb of the feed hole CTb, as shown in FIG. 7, the carrier tape CT has two states (described later) at the imaging position PP. It stops alternately in the first stop state Spp1 and the second stop state Spp2).

FIG. 7A shows a first stop state Spp1, and in this first stop state Spp1, the carrier tape CT is set so that one feed hole CTb coincides with the position corresponding to the center of the imaging position PP in the X direction. Stop. FIG. 7B shows a second stop state Spp2, and in this second stop state Spp2, the carrier tape so that the center of the two feed holes CTb coincides with the position corresponding to the center of the imaging position PP in the X direction. CT stops. In the first stopped state Spp1 shown in FIG. 7A and the second stopped state Spp2 shown in FIG. 7B, the three storage recesses CTa are similarly stopped at the imaging position pp and the imaging range is captured. It still fits in the IA.

That is, in step ST12, the first stopped state Spp1 shown in FIG. 7A and the second stopped state Spp1 shown in FIG. 7B are alternately imaged at the imaging position PP. To.

When the image obtained in step ST12 is the image of the first stopped state Spp1 shown in FIG. 7A, two dimensions of one feed hole CTb and three storage recesses CTa are based on this image. The position is detected, the deviation amount of the two-dimensional position of each storage recess CTa is calculated based on the detected two-dimensional position, and the common correction amount corresponding to the three storage recess CTa is calculated based on the calculated deviation amount ( ΔX and ΔY) are calculated, and the calculated common correction amount is stored (see steps ST13 to ST17 in FIG. 6).

Further, when the image obtained in step ST12 is the image of the second stopped state Spp2 shown in FIG. 7B, the two feed holes CTb and the three storage recesses CTa are based on this image. The two-dimensional position is detected, the amount of deviation of the two-dimensional position of each storage recess CTa is calculated based on the detected two-dimensional position, and the common correction corresponding to the three storage recesses CTa is calculated based on the calculated deviation amount. The amount is calculated and the calculated correction amount is stored (see steps ST13 to ST17 in FIG. 6).

Here, the processing of steps ST13 to ST17 of FIG. 6 will be described in detail using an example of the image shown in FIG.

FIG. 8A shows an example of the image IM1 obtained in the first stopped state Spp1, and FIG. 8B shows an example of the image IM2 obtained in the second stopped state Spp2. By the way, in the image IM1 shown in FIG. 8A, the two-dimensional positions of the two storage recesses CTa on the left side and the right side of the three storage recesses CTa are ideal positions (meaning positions without deviation). See the broken line frame). Further, in the image IM2 shown in FIG. 8B, the two-dimensional positions of the two storage recesses CTa on the left side and the center of the three storage recesses CTa are ideal positions (meaning positions without deviation). See the broken line frame).

In the case of the image IM1 shown in FIG. 8A, first, one feed hole CTb and three feed holes CTb are searched by a pattern detection method for searching the same pattern as the template corresponding to each of the feed hole CTb and the storage recess CTa. The two-dimensional position of the storage recess CTa is detected. Then, the two-dimensional position (center position indicated by + mark) of one feed hole CTb is set as the origin (X0, Y0) of the XY coordinate system, and the three storage recesses CTa are referred to from this origin (X0, Y0). Each two-dimensional position (center position indicated by + mark) is calculated in the XY coordinate system.

The ideal positions (X1, Y1), (X2, Y2) and (X3, Y3) of each of the three storage recesses CTa with respect to the origin (X0, Y0) are set in advance from the design reference dimensions of the carrier tape CT. Since it can be calculated, the XY coordinates of the two-dimensional positions of each of the three storage recesses CTa are preferably calculated so that the amount of deviation from each ideal position can be known. That is, in the image IM1, since the two-dimensional position of the storage recess CTa on the left side is shifted diagonally to the upper left, the XY coordinates are (X1 + a, Y1-b). Further, since there is no deviation in the central storage recess CTa, its XY coordinates are (X2, Y2). Further, since the two-dimensional position of the storage recess CTa on the right side is shifted diagonally to the upper left, its XY coordinates are (X3 + c, Y3-d).

Then, based on the XY coordinates (X1 + a, Y1-b), (X2, Y2) and (X3 + c, Y3-d) of each of the three storage recesses CTa, the correction in the X direction common to the three storage recesses CTa. The amount ΔX is calculated by {(+ a) + (0) + (+ c)} / 3, and the correction amount ΔY in the Y direction common to the three storage recesses CTa is {(−b) + (0) + ( -C)} / 3 is used for calculation. Then, this (ΔX, ΔY) is stored as a common correction amount corresponding to the three storage recesses CTa included in the image IM1.

In the case of the image IM2 shown in FIG. 8B, first, the two-dimensional positions of the two feed holes CTb and the three storage recesses CTa are detected by the same pattern detection method. Then, the two-dimensional position (center position indicated by + mark) of the feed hole CTb of one of the two feed holes CTb (here, the left side) is set as the origin (X0, Y0) of the XY coordinate system, and this origin is set. The two-dimensional position (center position indicated by + mark) of each of the three storage recesses CTa is calculated in the XY coordinate system with reference to (X0, Y0).

The ideal positions (X4, Y4), (X5, Y5) and (X6, Y6) of each of the three storage recesses CTa with respect to the origin (X0, Y0) are set in advance from the design reference dimensions of the carrier tape CT. Since it can be calculated, the XY coordinates of the two-dimensional positions of each of the three storage recesses CTa are preferably calculated so that the amount of deviation from each ideal position can be known. That is, in the image IM2, since the two-dimensional position of the storage recess CTa on the left side is shifted diagonally to the upper left, the XY coordinates are (X4 + e, Y4-f). Further, since the two-dimensional position of the central storage recess CTa is shifted diagonally to the upper right, its XY coordinates are (X5-g, Y5-h). Further, since there is no deviation in the central storage recess CTa, its XY coordinates are (X6, Y6).

Then, based on the XY coordinates (X4 + e, Y4-f), (X5-g, Y5-h) and (X6, Y6) of each of the three storage recesses CTa, the X direction common to the three storage recesses CTa. The correction amount ΔX of h) + (0)} / 3 is used for calculation. Then, this (ΔX, ΔY) is stored as a common correction amount corresponding to the three storage recesses CTa included in the image IM2.

That is, since the carrier tape CT intermittently moves in units of three storage recesses CTa, the above-mentioned common correction amount (ΔX, ΔY) is sequentially stored in units of three storage recesses CTa.

In the image IM1 shown in FIG. 8A, the two-dimensional position (center position indicated by + mark) of one feed hole CTb is set as the origin (X0, Y0) of the XY coordinate system, and FIG. 8B is shown. The reason why one of the two feed holes CTb (center position indicated by +) in the image IM2 shown in the above is the origin (X0, Y0) of the XY coordinate system is that the carrier tape CT is intermittently moved. Since the protrusion 11a of the moving sprocket 11 is engaged with the feed hole CTb of the carrier tape CT, it is easier to grasp the variation in the two-dimensional position of each storage recess CTa when the two-dimensional position of the feed hole CTb is used as a reference. There is something in it. That is, it is based on the fact that the calculation of the deviation amount of the two-dimensional position of the storage recess CTa with reference to the two-dimensional position of the feed hole CTb is more suitable for the above-mentioned calculation of the deviation amount and the calculation of the common correction amount.

On the other hand, when the carrier tape CT that moves intermittently stops at the insertion position IP and the batch insertion of the three electronic components EC into the three storage recesses CTa is completed, the stored common correction amount (ΔX, ΔY) is reached. The common correction amount (ΔX, ΔY) corresponding to the next three storage recesses CTa is read out from the inside (see steps ST24 and ST21 in FIG. 9).

Subsequently, before the three electronic component ECs are collectively inserted into the next three storage recesses CTa, the three storage recesses CTa are two-dimensionally based on the common correction amount (ΔX, ΔY) read out. The position is corrected (see step ST22 in FIG. 9). In this position correction, the intermittent movement sprocket 11 is moved in the X and Y directions by the two-dimensional movement mechanism 13 based on the read correction amount (ΔX, ΔY), and this movement causes at least the insertion position IP of the carrier tape CT. This is done by displacing the portion corresponding to the above in the X and Y directions by a common correction amount (ΔX, ΔY).

Subsequently, the three electronic component ECs are collectively inserted into the three storage recesses CTa after the position correction is performed (see step ST23 in FIG. 9).

Since the above-mentioned common correction amount (ΔX, ΔY) is a common correction amount considering the deviation of the two-dimensional position of each of the three storage recesses CTa stopped at the insertion position IP, 3 to the three storage recesses CTa. Batch insertion of individual electronic component ECs can be performed extremely smoothly. Further, even if the two-dimensional positions of the three storage recesses CTa are displaced in a manner different from those of the images IM1 and IM2 shown in FIG. 8, the three electronic component ECs can be inserted all at once extremely smoothly. can.

Next, with reference to FIGS. 10 to 13, a stop state at the insertion position and the imaging position of the carrier tape when a number other than three electronic components are collectively inserted into the same number of storage recesses will be described.

FIG. 10 shows the insertion position IP of the carrier tape CT and the stopped state at the imaging position PP when the two electronic component ECs are collectively inserted into the two storage recesses CTa. In this case, since the carrier tape CT intermittently moves in units of two storage recesses CTa, if the pitch Pa of the storage recess CTa of the carrier tape CT is 1/2 of the pitch Pb of the feed hole CTb, the carrier tape CT There is only one type of stop state for the insertion position IP (see Ship), and there is only one type of stop state for the imaging position PP (see Spp). In this case as well, if the common correction amount corresponding to the two storage recesses CTa is calculated and stored by the same processing as in FIG. 6, the batch insertion of the two electronic component ECs is extremely smooth by the same processing as in FIG. Can be done.

FIG. 11 shows the insertion position IP of the carrier tape CT and the stopped state at the imaging position PP when the four electronic component ECs are collectively inserted into the four storage recesses CTa. In this case, since the carrier tape CT intermittently moves in units of four storage recesses CTa, if the pitch Pa of the storage recess CTa of the carrier tape CT is 1/2 of the pitch Pb of the feed hole CTb, the carrier tape CT There is only one type of stop state for the insertion position IP (see Ship), and there is only one type of stop state for the imaging position PP (see Spp). Further, since the image obtained at the imaging position PP always includes two feed holes CTb, the two-dimensional position of one feed hole CTb out of the two feed holes CTb is set to the origin (X0) of the XY coordinate system. , Y0). In this case as well, if the common correction amount corresponding to the four storage recesses CTa is calculated and stored by the same processing as in FIG. 6, the batch insertion of the four electronic component ECs is extremely smooth by the same processing as in FIG. Can be done.

FIG. 12 shows the insertion position IP of the carrier tape CT and the stopped state at the imaging position PP when the five electronic component ECs are collectively inserted into the five storage recesses CTa. In this case, since the carrier tape CT intermittently moves in units of five storage recesses CTa, if the pitch Pa of the storage recess CTa of the carrier tape CT is 1/2 of the pitch Pb of the feed hole CTb, the carrier tape CT There are two types of stop states for the insertion position IP (see Ship1 and Ship2), and two types of stop states for the imaging position PP (see Spp1 and Spp2). Further, since the image obtained at the imaging position PP may include three feed holes CTb (see Spp1) and two feed holes CTb (see Spp2), out of the three. The two-dimensional position of one feed hole CTb and the two-dimensional position of one of the two feed holes CTb are set as the origins (X0, Y0) of each XY coordinate system. In this case as well, if the common correction amount corresponding to the five storage recesses CTa is calculated and stored by the same processing as in FIG. 6, the batch insertion of the five electronic component ECs is extremely smooth by the same processing as in FIG. Can be done.

FIG. 13 shows the insertion position IP of the carrier tape CT and the stopped state at the imaging position PP when the six electronic component ECs are collectively inserted into the six storage recesses CTa. In this case, since the carrier tape CT intermittently moves in units of six storage recesses CTa, if the pitch Pa of the storage recesses CTa of the carrier tape CT is 1/2 of the pitch Pb of the feed hole CTb, the carrier tape CT There is only one type of stop state for the insertion position IP (see Ship), and there is only one type of stop state for the imaging position PP (see Spp). Further, since the image obtained at the imaging position PP always includes three feed holes CTb, the two-dimensional position of one feed hole CTb out of the three feed holes CTb is set to the origin (X0) of the XY coordinate system. , Y0). In this case as well, if the common correction amount corresponding to the six storage recesses CTa is calculated and stored by the same processing as in FIG. 6, the batch insertion of the six electronic component ECs is extremely smooth by the same processing as in FIG. Can be done.

Next, the carrier tape shown in FIG. 1A and the carrier tape having different feed hole pitches will be described with reference to FIG.

The carrier tape CT-1 shown in FIG. 14 differs from the carrier tape CT shown in FIG. 1 (A) in that the pitch Pa of the storage recess CTa is 1/4 of the pitch Pb-1 of the feed hole CTb. It is in. In this carrier tape CT-1, since the pitch Pa of the storage recess CTa is 1/4 of the pitch Pb-1 of the feed hole CTb, when two electronic component ECs are collectively inserted into the two storage recess CTa. And, when the three electronic component ECs are inserted into the three storage recesses CTa, it is not possible to obtain an image including two or three storage recesses CTa and at least one feed hole CTb. Therefore, when performing two-piece batch insertion and three-piece batch insertion using such a carrier tape CT-1, for example, an image including one feed hole CTb and four or more storage recesses CTa is obtained. Therefore, it is preferable to perform only the calculation of the deviation amount and the calculation of the common correction amount only for the two or three storage recesses CTa to be inserted.

Next, the main functions and effects obtained by the above-mentioned electronic component insertion device and electronic component insertion method will be described.

<Action effect 1> Each time the carrier tape CT that moves intermittently in units of n (n is an integer of 2 or more) stops, n storage recesses CTa are included at the imaging position PP in front of the insertion position IP. The carrier tape CT is imaged in the imaging range IA, and the two-dimensional position detection and displacement amount calculation of each of the n storage recesses CTa are performed based on the image obtained by the imaging to correspond to the n storage recesses CTa in common. The correction amount (ΔX, ΔY) is calculated and sequentially stored, and the n storage recesses CTa are supported before the n electronic component ECs are collectively inserted into the n storage recesses CTa at the insertion position IP. The common correction amount (ΔX, ΔY) is read out, and based on this common correction amount (ΔX, ΔY), at least the portion corresponding to the insertion position IP of the carrier tape CT is displaced to position the two-dimensional positions of the n storage recesses CTa. Can be corrected. That is, even if there are variations in the two-dimensional positions of each of the n storage recesses CTa, and even if the electronic component EC is particularly small, the n electronic component ECs can be collectively inserted into the n storage recesses CTa. It can be done very smoothly.

<Action Effect 2> The imaging range IA includes at least one feed hole CTb in addition to the n storage recesses CTa, and each of the n storage recesses CTa is based on the two-dimensional position of the feed hole CTb. The amount of deviation of the two-dimensional position of is calculated. That is, since the protrusion 11a of the intermittent movement sprocket 11 that intermittently moves the carrier tape CT is engaged with the feed hole CTb of the carrier tape CT, it is better to refer to the two-dimensional position of the feed hole CTb as a reference to each storage recess. It is easy to grasp the variation in the two-dimensional position of the CTa, and the calculation of the deviation amount and the calculation of the common correction amount can be suitably performed.

<Action effect 3> Even if the number n of the electronic components EC to be inserted all at once is changed, the two-dimensional positions of the n feed holes CTb can be detected, the deviation amount can be calculated, and the common correction amount can be calculated in the same manner as described above. , The batch insertion of n electronic components EC into the n storage recesses CTa can be performed extremely smoothly.

<Action Effect 4> A cover tape for closing the storage recess CTa after the electronic component EC is inserted is attached to the above-mentioned electronic component insertion device and electronic component insertion method by thermocompression bonding of the carrier tape CT or the like. By combining the attachment means and the cover tape attachment method, the electronic component storage tape can be inserted into the storage recess CTa of the carrier tape CT with high efficiency, and the electronic component storage tape can be manufactured with high efficiency. A method for manufacturing a component storage tape can be provided.

Next, a modified example of the above-mentioned electronic component insertion device and electronic component insertion method that can obtain the same effect as described above will be described.

<Modification 1> An example of the carrier tape CT is shown in FIG. 1 (A), but various carrier tapes, for example Y A carrier tape having a reference dimension W of the direction dimension W of 8 mm, a reference dimension of the pitch Pa of the storage recess CTa of 2 mm, and a reference dimension of the pitch Pb of the feed hole CTb of 4 mm, and a reference dimension of each storage recess CTa in the Y direction and the X direction. Carrier tapes or the like having different reference dimensions (depths) in the reference dimensions of the dimensions and the directions orthogonal to the Y direction and the X direction can be appropriately used. Further, although an example of the electronic component EC to be inserted is shown in FIG. 1 (B), an electronic component having a reference dimension relationship other than length d1> width d2 = height d3, for example, the reference dimension relationship is length d1>. Even if an electronic component having a width d2> a height d3 or an electronic component having a reference dimension relationship of length d1> height d3> width d2 can be stored, by using a carrier tape having a storage recess CTa that can store them. It can be inserted as appropriate.

<Modification 2> The case where the number n of the electronic components EC to be collectively inserted is 2 to 6 has been described. However, even if the number n of the electronic components EC to be collectively inserted is 7 or more, the same processing as in FIG. 6 is performed. By calculating and storing the common correction amount corresponding to the storage recess CTa of 7 or more, the batch insertion of 7 or more electronic components EC can be performed extremely smoothly by the same process as in FIG.

<Modification 3> A method using a pattern detection method for detecting the two-dimensional positions of the feed hole CTb and the storage recess CTa in steps ST13 and ST14 of FIG. 6 is shown, but another method capable of detecting the two-dimensional position, For example, an edge detection method can be appropriately used. By the way, when the edge detection method is used to detect the two-dimensional positions of the feed hole CTb and the storage recess CTa, at least three points of the contour of the feed hole CTb and four points of the contour of the storage recess CTa (two sides in the X direction). And two sides in the Y direction) may be searched to detect each two-dimensional position.

<Modification Example 4> As a method of calculating the amount of deviation in step ST15 of FIG. 6, a method of calculating the amount of deviation of the two-dimensional position of each storage recess CTa with reference to the two-dimensional position of the feed hole CTb has been shown. A reference point is set in advance in the imaging range IA without detecting the two-dimensional position of the feed hole CTb in the deviation amount calculation method, for example, step ST13, and the two-dimensional position of each storage recess CTa is set based on this reference point. A method of calculating the amount of deviation of the storage recess CTa, a method of setting a reference point in the image obtained by imaging and calculating the amount of deviation of the two-dimensional position of each storage recess CTa based on this reference point, and a method detected in step ST14. A method of calculating the amount of deviation of the two-dimensional position of each storage recess CTa based on the relative position of the storage recess CTa can be appropriately used.

CT, CT-1 ... Carrier tape, CTa ... Storage recess, CTb ... Feed hole, EC ... Electronic parts, 11 ... Intermittent movement sprocket, 12 ... Intermittent movement motor, 13 ... Two-dimensional movement mechanism, 13a ... Movable part, 13b ... Motor for moving in the X direction, 13c ... Motor for moving in the Y direction, 14 ... Parts transfer disk, 14a ... Motor for intermittent rotation, 15 ... Insert drive source, 16 ... Camera, 17 ... Control unit, 18 ... Storage unit, IP … Insertion position, PP… Imaging position.

Claims (16)

A band-shaped carrier tape having storage recesses for electronic parts at equal pitches is intermittently moved in the length direction, and n electronic parts (n is an integer of 2 or more) are stored in the carrier tape at the insertion position. An electronic component insertion device for batch insertion into recesses.
(A1) An imaging means for imaging the carrier tape in an imaging range including the n storage recesses at an imaging position in front of the insertion position.
(A2) A position detecting means for detecting the two-dimensional position of each of the n storage recesses included in the image based on the image obtained by the imaging means.
(A3) A deviation amount calculation means for calculating the deviation amount of the two-dimensional position of each of the n storage recesses based on the two-dimensional position detected by the position detection means.
(A4) A correction amount calculation means for calculating a common correction amount corresponding to the n storage recesses based on the deviation amount calculated by the deviation amount calculation means.
(A5) At the insertion position, before the n electronic components are collectively inserted into the n storage recesses included in the image, based on the common correction amount calculated by the correction amount calculation means. A position correction means for changing the two-dimensional position of the n storage recesses by displacing at least a portion of the carrier tape corresponding to the insertion position is provided.
The carrier tape has feed holes in the length direction at an equal pitch different from that of the storage recess.
The position correction means has a two-dimensional movement mechanism for moving a sprocket for intermittent movement having a protrusion engageable with the feed hole on the outer peripheral surface in the length direction and the width direction of the carrier tape. Yes,
Electronic component insertion device. The image pickup means is configured to image the carrier tape in an image pickup range including the n storage recesses and at least one feed hole at the image pickup position.
The position detecting means is configured to detect the two-dimensional position of each of the n storage recesses included in the image and the two-dimensional position of at least one feed hole included in the image.
The deviation amount calculation means is configured to calculate the deviation amount of the two-dimensional positions of each of the n storage recesses with reference to the two-dimensional positions of the at least one feed hole detected by the position detection means. Has been,
The electronic component insertion device according to claim 1 . When the image includes two or more of the feed holes, the deviation amount calculation means has two of each of the n storage recesses with reference to the two-dimensional position of one of the two or more. It is configured to calculate the amount of deviation of the dimensional position,
The electronic component insertion device according to claim 2 . When the image contains n + 1 or more storage recesses that are larger than the n storage recesses, the deviation amount calculation means includes n + 1 or more storage recesses out of n + 1 or more, respectively. It is configured to calculate only the amount of deviation of the two-dimensional position of
The electronic component insertion device according to claim 2 or 3 . The n pieces are selected within the range of 2 to 6 pieces.
The electronic component insertion device according to any one of claims 1 to 4 . The storage recess has a substantially rectangular parallelepiped shape.
The electronic component insertion device according to any one of claims 1 to 5 . The electronic component is an electronic component having a maximum reference dimension of 0.6 mm or less.
The electronic component insertion device according to any one of claims 1 to 6 . The electronic component insertion device according to any one of claims 1 to 7 .
A cover tape adhering means for adhering a cover tape for closing the storage recess after the electronic component is inserted to the carrier tape is provided.
Electronic component storage tape manufacturing equipment. A band-shaped carrier tape having storage recesses for electronic parts at equal pitches is intermittently moved in the length direction, and n electronic parts (n is an integer of 2 or more) are stored in the carrier tape at the insertion position. It is a method of inserting electronic components for batch insertion into recesses.
(B1) A step of imaging the carrier tape in an imaging range including the n storage recesses by an imaging means at an imaging position in front of the insertion position.
(B2) A step of detecting the two-dimensional position of each of the n storage recesses included in the image by the position detecting means based on the image obtained by the imaging means.
(B3) A step of calculating the deviation amount of the two-dimensional position of each of the n storage recesses by the deviation amount calculation means based on the two-dimensional position detected by the position detection means.
(B4) A step of calculating a common correction amount corresponding to the n storage recesses by the correction amount calculation means based on the deviation amount calculated by the deviation amount calculation means.
(B5) At the insertion position, before the n electronic components are collectively inserted into the n storage recesses included in the image, based on the common correction amount calculated by the correction amount calculation means. The position correction means includes a step of displacing at least a portion of the carrier tape corresponding to the insertion position to change the two-dimensional position of the n storage recesses.
The carrier tape has feed holes in the length direction at an equal pitch different from that of the storage recess.
The position correction means has a two-dimensional movement mechanism for moving a sprocket for intermittent movement having a protrusion engageable with the feed hole on the outer peripheral surface in the length direction and the width direction of the carrier tape. Yes,
Electronic component insertion method. The image pickup means is configured to image the carrier tape in an image pickup range including the n storage recesses and at least one feed hole at the image pickup position.
The position detecting means is configured to detect the two-dimensional position of each of the n storage recesses included in the image and the two-dimensional position of at least one feed hole included in the image.
The deviation amount calculation means is configured to calculate the deviation amount of the two-dimensional positions of each of the n storage recesses with reference to the two-dimensional positions of the at least one feed hole detected by the position detection means. Has been,
The method for inserting an electronic component according to claim 9 . When the image includes two or more of the feed holes, the deviation amount calculation means has two of each of the n storage recesses with reference to the two-dimensional position of one of the two or more. It is configured to calculate the amount of deviation of the dimensional position,
The method for inserting an electronic component according to claim 10 . When the image contains n + 1 or more storage recesses that are larger than the n storage recesses, the deviation amount calculation means includes n + 1 or more storage recesses out of n + 1 or more, respectively. It is configured to calculate only the amount of deviation of the two-dimensional position of
The method for inserting an electronic component according to claim 10 or 11 . The n pieces are selected within the range of 2 to 6 pieces.
The method for inserting an electronic component according to any one of claims 9 to 12 . The storage recess has a substantially rectangular parallelepiped shape.
The method for inserting an electronic component according to any one of claims 9 to 13 . The electronic component is an electronic component having a maximum reference dimension of 0.6 mm or less.
The method for inserting an electronic component according to any one of claims 9 to 14 . The electronic component insertion method according to any one of claims 9 to 15, and the method for inserting electronic components.
The cover tape for closing the storage recess after the electronic component is inserted is provided with a step of adhering the cover tape to the carrier tape by the cover tape adhering means.
Electronic component storage tape manufacturing method.

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