TW201900516A - Apparatus and method for inserting electronic component and apparatus and method for fabricating electronic component storage tape smoothly inserting a plurality of electronic components into storage concave portions with the same number as that of the electronic components of a carrier tape - Google Patents

Abstract

This invention provides an apparatus for inserting an electronic component, which is capable of smoothly inserting a plurality of electronic components, especially small electronic components, into storage concave portions with the same number as that of the electronic components of a carrier tape. At a photographing position PP closer than insertion positions IP, the carrier tape CT is captured by an imaging range IA including three storage concave portions CTa, two-dimensional position detection and offset calculation of each of the three storage concave portions CTa are performed based on the image obtained by photographing, a common correction amount corresponding to the three storage concave portions is calculated and sequentially recorded; and at the insertion positions IP, before the three electronic components EC are inserted into the three storage concave portions CTa, the common correction amount corresponding to the three storage concave portions CTa is read, and the insertion positions IP corresponding to the carrier tape CT are at least partially shifted based on the common correction amount, and two-dimensional positions of the three storage concave portions CTa are corrected.

Description

Electronic component insertion device, electronic component storage tape manufacturing device, electronic component insertion method, and electronic component storage tape manufacturing method

The present invention relates to an electronic component insertion device and an electronic component insertion method for inserting n (n is an integer of 2 or more) electronic components into n storage recesses of a carrier tape at an insertion position, and an apparatus and method therefor An electronic component storage tape manufacturing apparatus and an electronic component storage tape manufacturing method that combine a cover tape attachment mechanism and a cover tape attachment method.

The tape-shaped carrier tape used in the manufacture of the electronic component storage tape has a housing recess for electronic components at equal intervals in the longitudinal direction. The carrier tape is an electronic component storage tape by inserting an electronic component into the housing recess by a specific insertion position and attaching a cover tape for closing the housing recess. Incidentally, the electronic component storage tape is attached to, for example, a tape feeder that takes out an electronic component from a housing recess while peeling off the cover tape. In the prior art, the electronic component is inserted into the housing recess, and the electronic component is inserted into the housing recess one by one. Recently, in order to improve the insertion efficiency of the electronic component, in other words, the manufacturing efficiency of the electronic component storage tape is improved, and a plurality of electrons are studied. A method of inserting the same number of storage recesses together with each other (see Patent Documents 1 to 3 to be described later). However, the electronic components to be inserted into the object, such as capacitors, inductors, or varistors, are increasingly miniaturized based on the requirements of the demand side. As far as the current situation is concerned, electronic components having a maximum reference size of 0.6 mm or less, for example, are substantially rectangular parallelepiped. Electronic parts with a length (reference dimension) of 0.6 mm or less and a width (reference dimension) of 0.3 mm or less are also widely used. Further, with the miniaturization of the electronic component, a carrier tape having a housing recess corresponding to a small electronic component is also commercially available. The size (including the dimensional tolerance) of the housing recess of the carrier tape is defined in consideration of the reference size and dimensional tolerance of the electronic component to be inserted, and therefore, for each housing recess, even if the electronic component is small, it is not particularly suitable for individual insertion. Create obstacles. However, the size of the housing recess corresponding to the small electronic component is of course small, and the two-dimensional position of each of the housing recesses (the position of the longitudinal direction and the width direction of the carrier tape) also has a tolerance, so that a plurality of electrons as described above are used. In the case where the parts are inserted into the same number of storage recesses, it is necessary to fully consider the deviation of the two-dimensional position of each of the plurality of housing recesses. In other words, when a plurality of electronic components are inserted into the same number of storage recesses, the two-dimensional position of each of the plurality of storage recesses may be different, and a plurality of electronic components may be in contact with the inner side surface of the housing recess. After inserting. In other words, when a plurality of electronic components are collectively inserted into the same number of storage recesses, in particular, when the electronic components are small, it is necessary to more smoothly perform technical considerations for collective insertion. [PRIOR ART DOCUMENT] [Patent Document 1] Japanese Patent Laid-Open No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. Bulletin

[Problem to be Solved by the Invention] The problem to be solved by the invention is to provide an electronic component insertion device and an electronic component insertion method, in which a plurality of electronic components are collectively inserted into the same number of storage recesses of the carrier tape, in particular When the electronic component is small, it can be inserted more smoothly, and an electronic component storage tape manufacturing apparatus and an electronic component storage tape manufacturing method using the electronic component insertion device and the electronic component insertion method are provided. [Means for Solving the Problems] In order to solve the above problems, the electronic component insertion device of the present invention intermittently moves the tape-shaped carrier tape having the housing recesses for electronic components at equal intervals in the longitudinal direction, and is used for inserting n positions (in the insertion position). n is an integer of 2 or more), and the electronic component is inserted into the n housing recesses of the carrier tape, and includes: (A1) an image pickup unit including the n pieces at a position closer to the insertion position than the insertion position a photographing range of the housing recess for capturing the carrier tape; and (A2) a position detecting mechanism for detecting a two-dimensional position of each of the n housing recesses included in the image based on an image obtained by the image capturing mechanism (A3) an offset amount calculation unit that calculates an offset amount of a two-dimensional position of each of the n storage recesses based on the two-dimensional position detected by the position detecting means; (A4) correction amount calculation a mechanism for calculating a common correction amount corresponding to the n storage recesses based on the offset calculated by the offset calculation unit; (A5) a position correction mechanism at the insertion position Inserting the n electronic components together into the n storage recesses included in the image, and based on the common correction amount calculated by the correction amount calculation means, at least the insertion position corresponding to the carrier tape The partial displacement is performed to change the two-dimensional position of the n housing recesses. Moreover, the electronic component storage tape manufacturing apparatus of the present invention includes: the electronic component insertion device; and a cover tape attachment mechanism that attaches a cover tape for closing the storage recessed portion after the electronic component is inserted to the carrier tape. Further, in the electronic component insertion method of the present invention, the tape-shaped carrier tape having the housing recess portion for electronic components at equal intervals in the longitudinal direction is intermittently moved, and n (n is an integer of 2 or more) electronic components are used at the insertion position. Inserting the n storage recesses of the carrier tape together with the following steps: (B1) capturing the image at a shooting position closer to the insertion position, and capturing the image by the imaging means including the imaging ranges of the n storage recesses a carrier tape; (B2) detecting, by the position detecting means, a two-dimensional position of each of the n housing recesses included in the image by the position detecting means; (B3) based on the position detecting mechanism The two-dimensional position detected, the offset amount calculation means calculates an offset of the two-dimensional position of each of the n storage recesses; (B4) based on the offset calculated by the offset calculation means And a correction amount calculating unit that calculates a common correction amount corresponding to the n housing recesses; (B5) inserting, at the insertion position, the n electronic components into the n pieces included in the image Before the recess, based on the common correction amount calculated by the correction amount calculating means, the position correcting means shifts a portion corresponding to at least the insertion position of the carrier tape to obtain a two-dimensional position of the n housing recesses Variety. Furthermore, the electronic component storage tape manufacturing method of the present invention includes: the electronic component insertion method; and a cover tape attaching mechanism that attaches a cover tape for closing the storage recessed portion after the electronic component is inserted to the carrier tape step. [Effect of the Invention] According to the electronic component insertion device and the electronic component insertion method of the present invention, even when a plurality of electronic components are collectively inserted into the same number of storage recesses of the carrier tape, especially when the electronic component is small, It can be inserted more smoothly. Moreover, according to the electronic component storage tape manufacturing apparatus and the electronic component storage tape manufacturing method of the present invention, the insertion of the electronic component into the housing recess of the carrier tape can be efficiently performed, and the electronic component storage tape can be efficiently manufactured.

First, an example of an electronic component to be inserted and an object to be inserted will be described with reference to Fig. 1 . The carrier tape CT shown in Fig. 1(A) has a strip shape, and has a substantially rectangular parallelepiped housing recess CTa for an electronic component at an equal pitch Pa in the longitudinal direction (the X direction in the drawing, hereinafter referred to as the X direction in the longitudinal direction). The storage recessed portion CTa is spaced apart from the width direction (the Y direction in the drawing, hereinafter, the width direction is referred to as the Y direction), and has a feed hole CTb at a different pitch Pb from the housing recess CTa in the X direction. Incidentally, the type of processing of the carrier tape CT is not particularly limited, and for example, a compression processing type carrier tape or an embossed processing type carrier tape can be suitably used. The electronic component EC shown in FIG. 1(B) has a substantially rectangular parallelepiped shape, and the reference dimension has a dimensional relationship of length d1 > width d2 = height d3 (not shown). Incidentally, the type of the electronic component EC is not particularly limited, and an electronic component such as a capacitor, an inductor, or a varistor can be suitably used. For reference, the dimension W in the Y direction of the carrier tape CT based on Fig. 1(A) is 4 mm ± 0.05 mm. Further, the Y-direction dimension Dy of each of the housing recesses CTa is 0.46 mm ± 0.02 mm, the X-direction dimension Dx is 0.25 mm ± 0.02 mm, and the dimension Dz (depth, omitted) in the direction orthogonal to the Y direction and the X direction is 0.25 mm ± 0.02 mm. Furthermore, the diameter f of each of the feed holes CTb is 0.9 mm ± 0.05 mm. Further, the distance Pa between the housing recesses CTa is 1 mm ± 0.02 mm, and the distance Pb between the feed holes CTb is 2 mm ± 0.04 mm. Further, the distance between the center of each of the housing recesses CTa and the center of each of the feed holes CTb (the symbol is omitted) is 1.8 mm ± 0.02 mm. The electronic component EC based on Fig. 1(B) is called 0402, the length d1 is 0.4 mm ± 0.02 mm, the width d2 and the height d3 (not shown) are 0.2 mm ± 0.02 mm. Next, a configuration of an electronic component insertion device using the carrier tape CT shown in FIG. 1(A) and the electronic component EC shown in FIG. 1(B) will be described with reference to FIGS. 2 to 5. The electronic component insertion device has a function of intermittently moving the carrier tape CT (see FIG. 1(A)) in the +X direction, and the three housing recesses CTa of the carrier tape CT are three electronic components each time the insertion position IP is stopped. The EC is inserted into the three housing recesses CTa (see FIG. 1(B)). Incidentally, the intermittent movement of the carrier tape CT is guided by a guide rail (not shown). The reference numeral 12 in Fig. 2 and Fig. 3 is a motor in which the carrier belt CT is intermittently moved in such a manner that three of the housing recesses CTa carrying the CT are stopped at the insertion position IP. As shown in FIGS. 2 and 4, the shaft (not shown) of the intermittent movement motor 12 is connected to the outer peripheral surface at intervals of equidistant intervals and has a gap 11a that can be engaged with the feed hole CTb of the carrier tape CT. The center of the moving sprocket 11. Further, a plurality of projections 11a of the intermittent moving sprocket 11 are engaged with the feed holes CTb of the carrier tape CT. Since the distance Pa between the housing recesses CTa of the carrier tape CT is 1/2 of the distance Pb between the feed holes CTb, as shown in FIG. 4, the carrier tape CT and the intermittent moving sprocket 11 are in the insertion position IP, in two states. (The first stop state Sip1 and the second stop state Sip2, which will be described later) are alternately stopped. 4(A) and 5(A) show the first stop state Sip1, and the center of the one projection 11a of the intermittent movement sprocket 11 and the target position TG (corresponding to the insertion position) in the first stop state Sip1. The position of the center of the IP in the X direction is the same, and the carrier tape CT is stopped. 4(B) and 5(B) show the second stop state Sip2, and in the second stop state Sip2, the center of the two projections 11a of the intermittent movement sprocket 11 coincides with the target position TG. The carrier tape CT stops. As shown in FIG. 5(A) and FIG. 5(B), in the first stop state Sip1 and the second stop state Sip2, the three housing recesses CTa are similarly stopped at the point where the insertion position IP is stopped. Reference numeral 13 in Fig. 2 denotes a two-dimensional moving mechanism, for example, an XY stage or the like, and has a movable portion 13a movable in the X direction and the Y direction, and the intermittent moving motor 12 is fixed to the movable portion 13a. Reference numeral 13b in Fig. 3 denotes an X-direction moving motor of the two-dimensional moving mechanism 13, and reference numeral 13c denotes a Y-direction moving motor of the two-dimensional moving mechanism 13. The two-dimensional moving mechanism 13 moves the movable portion 13a and the intermittent movement motor 12 fixed thereto in the X direction and the Y direction by the operation of the X-direction moving motor 13b and the Y-direction moving motor 13c. The intermittent movement sprocket 11 coupled to the shaft of the intermittent movement motor 12 is moved in the X direction and the Y direction. In other words, in the first stop state Sip1 and the second stop state Sip2 shown in FIGS. 4 and 5, the plurality of projections 11a of the intermittent movement sprocket 11 are engaged with the feed hole CTb of the carrier tape CT. Therefore, the intermittent moving sprocket 11 is moved in the X direction and the Y direction by the two-dimensional moving mechanism 13, whereby the portion corresponding to the insertion position IP of the carrier tape CT can be displaced, and the corresponding position can be made. The two-dimensional position (position in the X direction and the Y direction) of the three housing recesses CTa of the IP changes. Reference numeral 14 in Fig. 2 denotes a part transporting disc for transporting the electronic component EC to the insertion position IP. Though not shown in the drawings, a rectangular groove or a rectangular hole in which the electronic component EC can be accommodated is provided at an outer peripheral portion of the component transfer tray 14 at a distance corresponding to the distance Pa between the housing recesses CTa of the carrier tape CT. Part holding part. The electronic component insertion device shown in FIG. 2 is inserted into the three housing recesses CTa of the carrier tape CT by inserting three electronic components EC into the insertion position IP. Therefore, the total number of component holding portions of the component transfer tray 14 is three. The multiple is oriented so that each of the three faces is aligned with the direction of the three housing recesses CTa that are stopped at the insertion position IP. Further, although not shown, the component transfer tray 14 is provided with an air suction passage for maintaining the electronic component EC in the component holding portion, and the air suction passage is connected to the air suction device via an air tube. Reference numeral 14a in Fig. 3 is a motor for intermittently rotating the component transfer tray 14 so that three of the component holding portions of the component transporting tray 14 are stopped at the insertion position IP. A shaft (not shown) of the intermittent rotation motor 14a is coupled to the center of the component transporting tray 14. Reference numeral 15 in Fig. 3 is that three of the component holding portions of the component transfer tray 14 are inserted into the carrier tape CT together with the three electronic components EC held in the three component holding portions each time the IP position is stopped at the insertion position. The three storage recesses CTa are inserted into the drive source. Although not shown, the insertion drive source is preferably a solenoid, and the plunger of the solenoid is provided with three parts corresponding to the electronic component EC held in the three component holding portions that are stopped at the insertion position IP. Insert the pin. Incidentally, the air ejection device may be used as the insertion drive source. In this case, the front end of the air tube connected to the air ejection device is directed to the electronic component EC held by the three component holding portions stopped at the insertion position IP, and The three electronic components EC held in the three component holding portions by the ejection of air may be inserted into the three housing recesses CTa of the carrier tape CT. Although not shown in the drawings, a component supply device for supplying the electronic component EC to the component holding portion is attached to the component transfer tray 14 . The component supply device may sequentially supply the electronic component EC to the component holding portion from the front end of the linear feeder connected to the ball feeder, or may sequentially supply the component holding portion in a bulk state by using self weight or air or the like (toward The state of the messy state of the electronic parts EC. The symbol PP of Fig. 2 is a shooting position set closer to the front (-X direction) than the insertion position IP. Further, reference numeral 16 in Fig. 3 denotes a photographing position IA including three storage recesses CTa (see Fig. 7) for photographing a camera carrying a tape CT, and a built-in MOS (Metal-Oxide- Semiconductor Field-Effect) Transistor: metal-oxide-semiconductor field effect transistor), CMOS (Complementary Metal Oxide Semiconductor) or CCD (Charge-coupled Device). Although not shown in the drawings, an illuminator that illuminates the carrier tape CT at the time of shooting is disposed on or around the camera 16. As described above, the electronic component insertion device shown in FIG. 2 is inserted into the three housing recesses CTa of the carrier tape CT at the insertion position IP, so that the three housings at the shooting position PP are accommodated. There is a storage recessed portion CTa of a multiple of three (27 in FIG. 2) between the recessed portion CTa and the three housing recessed portions CTa at the insertion position IP. Incidentally, the shooting position PP may be set to a position closer to the insertion position IP than the position shown in FIG. 2, or may be set to a position farther from the insertion position IP than the position shown in FIG. 2. Further, in FIG. 7, for the sake of convenience, the shooting range IA is drawn in the same size as the rectangular frame indicating the insertion position IP and the stop position PP, but the shooting range IA may be the same as the insertion position IP and the stop position PP. The rectangular box is different in size. Reference numeral 17 in Fig. 3 denotes a control unit having a microcomputer, various drivers, and various interfaces, and an operation control program is stored in a ROM (read only memory). Reference numeral 18 in Fig. 3 denotes a memory portion for temporarily storing an image obtained by the camera 16, and a common correction amount or the like to be described later is temporarily stored in the memory unit 16. Further, the component transporting tray 14 of the electronic component insertion device may have a horizontal or substantially horizontal orientation, or may be an orientation in which the rotational axis thereof is inclined with respect to the vertical line within an acute angle range. In either case, the upper surface of the carrier tape CT and the rotation axis of the intermittent movement sprocket 11 and the upper surface of the movable portion 13a of the two-dimensional movement mechanism 13 shown in Fig. 2 become the same orientation as the component transfer tray 14. , you can achieve the desired action. Next, the basic operation of the component insertion of the electronic component insertion device will be described with reference to Figs. 2 to 5 . The intermittent moving sprocket 11 shown in Figs. 2 and 4 is intermittently rotated in synchronization with the component transporting disc 14 shown in Fig. 2 . The electronic component insertion device shown in FIG. 2 is for inserting three electronic components EC into the three housing recesses CTa of the carrier tape CT at the insertion position IP. Therefore, the carrier tape CT has three storage recesses CTa at the insertion position IP. The movement is intermittently performed in a sequential manner, that is, the movement and the stop in the +X direction are repeated, and the component transfer tray 14 is intermittently rotated in such a manner that the three holding portions are sequentially stopped at the insertion position IP, that is, the counterclockwise direction of FIG. 2 is repeated. Rotate and stop. As shown in FIG. 2, FIG. 4, and FIG. 5, when the carrier tape CT and the component transfer tray 14 are stopped, the insertion drive source 15 is operated, and the electronic component EC held in the three component holding portions where the insertion position IP is stopped is inserted. The three housing recesses CTa that are stopped at the same insertion position IP. When the insertion is completed, the three storage recesses CTa are moved in the +X direction after the carrier tape CT is stopped, and the component transporting tray 14 is stopped along with the three component holding portions at the insertion position IP. Rotate counterclockwise. If it is inserted in the same manner thereafter, the movement and stop of the carrier tape CT and the rotation and stop of the component transfer tray 14 are repeated. In other words, the operation of inserting the three electronic components EC into the three housing recesses CTa of the carrier tape CT is repeated at the insertion position IP. Next, the position correcting operation of the electronic component insertion device, that is, three storages in which the three electronic components EC are simultaneously inserted into the three housing recesses CTa of the carrier tape CT at the insertion position IP, will be described with reference to FIGS. 6 to 9 . The correction operation of the two-dimensional position (the position in the X direction and the Y direction) of the concave portion CTa will be described. As shown in FIG. 7, when the intermittently moving carrier tape CT is stopped at the imaging position PP, the imaging range IA including the three housing recesses CTa is referred to by the camera 16 (see FIG. 3) at the imaging position PP (see FIG. 7) The carrier tape CT is photographed (refer to steps ST11 and ST12 of Fig. 6). Since the distance Pa between the housing recesses CTa of the carrier tape CT is 1/2 of the distance Pb between the feed holes CTb, as shown in FIG. 7, the carrier tape CT is in the shooting position PP in two states (the first stop state described later). Spp1 and the second stop state Spp2) alternately stop. 7(A) shows the first stop state Spp1. In the first stop state Spp1, the carrier tape CT is stopped such that the one feed hole CTb coincides with the position corresponding to the center of the imaging position PP in the X direction. 7(B) shows the second stop state Spp2. In the second stop state Spp2, the carrier tape CT is stopped such that the center of the two feed holes CTb coincides with the position corresponding to the center of the X-direction of the imaging position PP. . In the first stop state Spp1 shown in FIG. 7(A) and the second stop state Spp2 shown in FIG. 7(B), the three storage recesses CTa are stopped at the imaging position pp and fall into the imaging range IA. In other words, in step ST12, the first stop state Spp1 shown in FIG. 7(A) and the second stop state Spp1 shown in FIG. 7(B) are alternately captured at the imaging position PP. When the image obtained in step ST12 is the image of the first stop state Spp1 shown in FIG. 7(A), the two-dimensional position of one of the feed holes CTb and the three storage recesses CTa is detected based on the image. The offset amount of the two-dimensional position of each of the housing recesses CTa is calculated based on the detected two-dimensional position, and the common correction amounts (ΔX and ΔY) corresponding to the three housing recesses CTa are calculated based on the calculated offset amount, and the memory is calculated. The common correction amount calculated (refer to steps ST13 to ST17 of Fig. 6). When the image obtained in step ST12 is the image of the second stop state Spp2 shown in FIG. 7(B), based on the image, two dimensions of the two feed holes CTb and the three housing recesses CTa are detected. The position is calculated based on the detected two-dimensional position, and the offset amount of the two-dimensional position of each of the housing recesses CTa is calculated, and the common correction amount corresponding to the three housing recesses CTa is calculated based on the calculated offset amount, and the memory is calculated. The correction amount is common (refer to steps ST13 to ST17 of Fig. 6). Here, the processing of steps ST13 to ST17 of FIG. 6 will be described in detail using an example of the image shown in FIG. 8(A) shows an example of the image IM1 obtained in the first stop state Spp1, and FIG. 8(B) shows an example of the image IM2 obtained in the second stop state Spp2. Incidentally, in the case of the image IM1 shown in FIG. 8(A), the two-dimensional position and the ideal position of the two housing recesses CTa on the left and right sides of the three housing recesses CTa (meaning the position without deviation, Refer to the dotted line box for a deviation. In the case of the image IM2 shown in FIG. 8(B), the two-dimensional position and the ideal position of the two housing recesses CTa in the left and center of the three housing recesses CTa (meaning the position without deviation, refer to the dotted line) Box) is biased. As the image IM1 shown in FIG. 8(A), first, by searching for a pattern detection method corresponding to the pattern corresponding to each of the feeding hole CTb and the housing recess CTa, one feeding hole CTb is detected and The two-dimensional position of the three housing recesses CTa. Further, the two-dimensional position (the center position indicated by the + mark) of one of the feed holes CTb is set to the origin (X0, Y0) of the XY coordinate system, and the origin (X0, Y0) is calculated in the XY coordinate system. The two-dimensional position (the center position indicated by the + mark) of each of the three housing recesses CTa. The ideal positions (X1, Y1), (X2, Y2), and (X3, Y3) of each of the three housing recesses CTa based on the origin (X0, Y0) may be based on the respective reference dimensions of the design of the carrier tape CT. Since it is calculated in advance, the XY coordinates of the two-dimensional position of each of the three housing recesses CTa are preferably calculated so as to be offset from the respective ideal positions. In other words, in the image IM1, the two-dimensional position of the storage recessed portion CTa on the left side is shifted obliquely upward to the left, and thus the XY coordinates are (X1+a, Y1-b). Further, since the central housing recess CTa has no offset, its XY coordinates are (X2, Y2). Further, since the two-dimensional position of the storage recessed portion CTa on the right side is shifted obliquely upward to the left, the XY coordinates are (X3+c, Y3-d). Further, based on the XY coordinates (X1+a, Y1-b), (X2, Y2), and (X3+c, Y3-d) of each of the three housing recesses CTa, {(+a)+(0)+( +c)}/3 The correction amount ΔX in the X direction common to the three housing recesses CTa is calculated, and the correction of the Y direction common to the three housing recesses CTa is calculated by {(-b)+(0)+(-c)}/3 The amount ΔY. Further, this (ΔX, ΔY) memory is used as a common correction amount corresponding to the three housing recesses CTa included in the image IM1. As the image IM2 shown in FIG. 8(B), first, the two-dimensional position of the two feeding holes CTb and the three housing recesses CTa is detected by the same pattern detecting method described above. Further, one of the two feed holes CTb (here, the left side) is fed to the two-dimensional position of the hole CTb (the center position indicated by the + mark) as the origin (X0, Y0) of the XY coordinate system. The two-dimensional position (the center position indicated by the + mark) of each of the three housing recesses CTa based on the origin (X0, Y0) is calculated in the XY coordinate system. The ideal positions (X4, Y4), (X5, Y5) and (X6, Y6) of each of the three housing recesses CTa based on the origin (X0, Y0) can be determined by the respective reference dimensions of the carrier belt CT. Since it is calculated in advance, the XY coordinates of the two-dimensional position of each of the three housing recesses CTa are preferably calculated so as to be offset from the respective ideal positions. In other words, in the image IM2, the two-dimensional position of the storage recessed portion CTa on the left side is shifted obliquely upward to the left, and therefore the XY coordinates are (X4+e, Y4-f). Further, since the two-dimensional position of the central housing recess CTa is shifted obliquely upward to the right, the XY coordinates are (X5-g, Y5-h). Further, since the central housing recess CTa has no offset, its XY coordinates are (X6, Y6). Further, based on the XY coordinates (X4+e, Y4-f), (X5-g, Y5-h), and (X6, Y6) of each of the three housing recesses CTa, {(+e)+(-g)+ (0)}/3 calculates the correction amount ΔX in the X direction common to the three housing recesses CTa, and calculates the Y direction common to the three housing recesses CTa by {(-f)+(-h)+(0)}/3 Correction amount ΔY. Further, this (ΔX, ΔY) memory is used as a common correction amount corresponding to the three housing recesses CTa included in the image IM2. In other words, since the carrier tape CT is intermittently moved in units of three housing recesses CTa, the above-described common correction amount (ΔX, ΔY) is sequentially stored in units of three housing recesses CTa. In addition, the two-dimensional position (the center position indicated by the + mark) of one feeding hole CTb in the image IM1 shown in FIG. 8(A) is set as the origin (X0, Y0) of the XY coordinate system, and the drawing will be performed. The reason why one of the two feed holes CTb (the center position indicated by the + mark) in the image IM2 shown in Fig. 8(B) is the origin (X0, Y0) of the XY coordinate system is that the load is carried out. The projection 11a of the intermittent moving sprocket 11 with intermittent movement of the CT is engaged with the feeding hole CTb of the carrier tape CT. Therefore, it is easier to grasp the two-dimensionality of each housing recess CTa based on the two-dimensional position of the feeding hole CTb. Deviation of position. In other words, the calculation of the shift amount and the calculation of the common correction amount can be performed satisfactorily by calculating the shift amount of the two-dimensional position of the housing recess CTa based on the two-dimensional position of the feed hole CTb. On the other hand, when the carrier tape CT that has been intermittently moved is stopped at the insertion position IP and the three electronic components EC are inserted into one of the three housing recesses CTa, the memory correction amount (ΔX, ΔY) is stored. The common correction amount (ΔX, ΔY) corresponding to the last three housing recesses CTa is read (refer to steps ST24 and ST21 of FIG. 9). Then, before the three electronic components EC are inserted into the three storage recesses CTa, the two-dimensional position of the three housing recesses CTa is corrected based on the read common correction amount (ΔX, ΔY) (refer to the steps of FIG. 9). ST22). The position correction is performed by moving the intermittent moving sprocket 11 in the X direction and the Y direction by the two-dimensional moving mechanism 13 based on the read correction amount (ΔX, ΔY), and the movement corresponds to the carrier tape. The portion of the CT at least the insertion position IP is shifted by only the common correction amount (ΔX, ΔY) in the X direction and the Y direction. Then, three electronic components EC are inserted into the three housing recesses CTa after the position correction is completed (see step ST23 in FIG. 9). The above-mentioned common correction amount (ΔX, ΔY) is a common correction amount in consideration of the offset of the two-dimensional position of each of the three housing recesses CTa at which the insertion position IP is stopped. Therefore, the three electronic components can be smoothly elapsed. One of the three housing recesses CTa is inserted. Further, even if the two-dimensional position of each of the three housing recesses CTa is shifted in a state different from the images IM1 and IM2 shown in FIG. 8, one of the three electronic components EC can be inserted extremely smoothly. Next, the insertion position of the carrier tape and the stop state of the imaging position in the case where the number of electronic components other than the three are inserted into the same number of housing recesses will be described with reference to FIG. 10 to FIG. FIG. 10 shows a state in which the insertion position IP of the carrier tape CT and the imaging position PP are stopped when the two electronic components EC are inserted into the two housing recesses CTa. In this case, since the carrier tape CT is intermittently moved in units of two housing recesses CTa, if the distance Pa between the housing recesses CTa of the carrier tape CT is 1/2 of the distance Pb between the feeding holes CTb, the insertion of the carrier tape CT is performed. There is only one stop state of the position IP (refer to Sip), and there is only one stop state of the shooting position PP (refer to Spp). In this case, as long as the common correction amount corresponding to the two housing recesses CTa is calculated and stored in the same manner as in FIG. 6, one of the two electronic components EC can be extremely smoothly performed by the same processing as that of FIG. And insert. FIG. 11 shows a state in which the insertion position IP of the carrier tape CT and the photographing position PP are stopped when the four electronic components EC are collectively inserted into the four housing recesses CTa. In this case, since the carrier tape CT is intermittently moved in units of four housing recesses CTa, if the distance Pa between the housing recesses CTa of the carrier tape CT is 1/2 of the distance Pb between the feeding holes CTb, the insertion of the carrier tape CT is performed. The stop state of the position IP is only one type (refer to Sip), and the stop state of the shooting position PP is also only one type (refer to Spp). Further, since the two image feed holes CTb are included in the image obtained at the image capturing position PP, the two-dimensional position of one of the two feed holes CTb is set to the origin of the XY coordinate system ( X0, Y0). In this case, as long as the common correction amount corresponding to the four housing recesses CTa is calculated and stored in the same manner as in FIG. 6, one of the four electronic components EC can be extremely smoothly performed by the same processing as that of FIG. And insert. FIG. 12 shows a state in which the insertion position IP of the carrier tape CT and the photographing position PP are stopped when the five electronic components EC are collectively inserted into the five housing recesses CTa. In this case, since the carrier tape CT is intermittently moved in units of five housing recesses CTa, if the distance Pa between the housing recesses CTa of the carrier tape CT is 1/2 of the distance Pb between the feeding holes CTb, the insertion of the carrier tape CT is performed. The stop state of the position IP is two types (refer to Sip1 and Sip2), and the stop state of the shooting position PP is also two types (refer to Spp1 and Spp2). In addition, since the image obtained by the imaging position PP includes three feeding holes CTb (refer to Spp1) and the case where the two feeding holes CTb are included (refer to Spp2), one of the three is sent. The two-dimensional position of the two-dimensional position of the entrance hole CTb and one of the two feed holes CTb is set to the origin (X0, Y0) of each XY coordinate system. In this case, as long as the common correction amount corresponding to the five housing recesses CTa is calculated and stored in the same manner as in FIG. 6, one of the five electronic components EC can be extremely smoothly performed by the same processing as that of FIG. And insert. Fig. 13 is a view showing a state in which the insertion position IP of the carrier tape CT and the photographing position PP are stopped when the six electronic components EC are collectively inserted into the six housing recesses CTa. In this case, since the carrier tape CT is intermittently moved in units of six housing recesses CTa, if the distance Pa between the housing recesses CTa of the carrier tape CT is 1/2 of the distance Pb between the feeding holes CTb, the carrier tape CT There is only one stop state of the insertion position IP (refer to Sip), and there is only one stop state of the shooting position PP (refer to Spp). Further, since the image obtained at the imaging position PP must include three feeding holes CTb, the two-dimensional position of one of the three feeding holes CTb is set to the origin of the XY coordinate system ( X0, Y0). In this case, as long as the common correction amount corresponding to the six housing recesses CTa is calculated and stored in the same manner as in FIG. 6, one of the six electronic components EC can be performed extremely smoothly by the same processing as that of FIG. And insert. Next, a carrier tape different from the carrier tape shown in Fig. 1(A) will be described with reference to Fig. 14 . The carrier tape CT-1 shown in Fig. 14 is different from the carrier tape CT shown in Fig. 1(A) in that the distance Pa between the housing recesses CTa is 1/4 of the distance Pb-1 between the feed holes CTb. In the carrier tape CT-1, the distance Pa between the housing recesses CTa is 1/4 of the distance Pb-1 between the feed holes CTb, so that two electronic components EC are inserted into the two housing recesses CTa at the same time, and When three electronic components EC are inserted into the three housing recesses CTa, an image including two or three housing recesses CTa and at least one feeding hole CTb cannot be obtained. Therefore, when two types of insertion and three insertions are performed by using the carrier tape CT-1, for example, an image including one of the feed holes CTb and the four or more storage recesses CTa is obtained. The calculation of the offset amount of only two or three housing recesses CTa of the insertion target and the calculation of only the common correction amount may be performed. Next, the main effects obtained by the above-described electronic component insertion device and electronic component insertion method will be described. <Operation effect 1> When the carrier tape CT intermittently moved in units of n (n is an integer of 2 or more) is stopped, the imaging position PP is closer to the insertion position IP than the insertion position IP, and includes n storage recesses CTa. The imaging range IA captures the carrier tape CT, and performs two-dimensional position detection and offset calculation for each of the n housing recesses CTa based on the image obtained by the imaging, and calculates a common correction amount (ΔX) corresponding to the n housing recesses CTa. ΔY) and sequentially stored in the insertion position IP, before the n electronic components EC are inserted into the n housing recesses CTa, the common correction amount (ΔX, ΔY) corresponding to the n housing recesses CTa is read. The two-dimensional position of the n housing recesses CTa can be corrected by shifting a portion corresponding to at least the insertion position IP of the carrier tape CT based on the common correction amount (ΔX, ΔY). In other words, even if the two-dimensional position of each of the n housing recesses CTa varies, in particular, the electronic component EC is small, and it is possible to smoothly insert the n electronic components EC into one of the n housing recesses CTa. In the above-described imaging range IA, at least one feeding hole CTb is included in addition to the n housing recesses CTa, and each of the n housing recesses CTa is calculated based on the two-dimensional position of the feeding hole CTb. The offset of the dimension position. In other words, since the projection 11a of the intermittent movement sprocket 11 that intermittently moves the carrier tape CT is engaged with the feeding hole CTb of the carrier tape CT, it is easier to grasp the housing recesses based on the two-dimensional position of the feeding hole CTb. The deviation of the two-dimensional position of CTa is also good, and the calculation of the above-described offset and the calculation of the common correction amount can be performed satisfactorily. <Operation 3> Even if the number n of electronic components EC inserted is changed, the two-dimensional position detection of the n feed holes CTb, the calculation of the offset amount, and the common correction amount can be performed in the same manner as described above. Since the calculation is performed, the n electronic components EC can be extremely smoothly inserted into one of the n housing recesses CTa. <Operation 4> An electronic component storage tape manufacturing apparatus and an electronic component storage tape manufacturing method can be provided, which are attached by thermal compression bonding or the like by a carrier tape CT by the electronic component insertion device and the electronic component insertion method. The cover tape attaching mechanism and the cover tape attaching method for closing the cover tape of the housing recess CTa after the insertion of the electronic component EC can efficiently manufacture the electronic component storage for efficiently inserting the electronic component EC into the housing recess CTa of the carrier tape CT band. Next, a description will be given of a modification of the electronic component insertion device and the electronic component insertion method that achieve the same effects as described above. <Variation 1> FIG. 1(A) shows an example of the carrier tape CT. However, as long as the electronic component EC storage recessed portion CTa is provided at equal intervals in the longitudinal direction, various carrier tapes such as the Y-direction dimension W can be suitably used. a carrier tape having a reference size of 8 mm, a reference dimension of Pa between the storage recesses CTa of 2 mm, a reference dimension of Pm between the feed holes CTb of 4 mm, or a reference dimension of the Y-direction of each housing recess CTa, and an X direction A carrier tape having a different reference dimension (depth) in the direction in which the dimension is the reference dimension, the Y direction, and the X direction. 1(B) shows an example of an electronic component EC to be inserted, but if it is an electronic component having a reference dimensional relationship other than the length d1>width d2=height d3, for example, the reference dimension relationship is length d1>width d2> The electronic component having the height d3 or the electronic component having the reference dimension of the length d1 > the height d2 > the width d2 may be appropriately inserted as an insertion tape having a housing recessed portion CTa. <Variation 2> The case where the number n of the electronic components EC to be inserted is 2 to 6 is described. However, even if the number n of electronic components EC to be inserted is 7 or more, it is only necessary to borrow By the same processing as that of FIG. 6 and the common correction amount corresponding to the seven or more housing recesses CTa is stored, one of the seven or more electronic components EC can be inserted extremely smoothly by the same processing as that of FIG. <Variation 3> It is disclosed that the pattern detecting method is used for detecting the two-dimensional position of the feeding hole CTb and the housing recess CTa in steps ST13 and ST14 of Fig. 6, but other methods capable of detecting the two-dimensional position can be used as appropriate, for example Edge detection method. Incidentally, in the case where the edge detection method is used for detecting the two-dimensional position of the feeding hole CTb and the housing recess CTa, it is only necessary to search for at least three contours of the feeding hole CTb, and to accommodate the contour of the concave portion CTa (X direction) 2 sides and 2 sides of the Y direction), and each 2D position can be detected. <Variation 4> A method of calculating the offset amount of the two-dimensional position of each of the housing recesses CTa based on the two-dimensional position of the feed hole CTb is disclosed as the calculation method of the offset amount in step ST15 of FIG. Other offset calculation methods may be used as appropriate. For example, in step ST13, the two-dimensional position of the feed hole CTb is not detected, and the reference point is set in advance in the imaging range IA, and the two-dimensionality of each storage recess CTa is calculated based on the reference point. The method of shifting the position, or setting the reference point in the image obtained by the shooting, calculating the offset amount of the two-dimensional position of each of the housing recesses CTa based on the reference point, or based on the detection detected in step ST14 A method of calculating the offset amount of the two-dimensional position of each of the housing recesses CTa by calculating the relative positions of the recesses CTa.

11‧‧‧Intermittent moving sprocket

11a‧‧‧ Protrusion

12‧‧‧Intermittent moving motor

13‧‧‧2D mobile agency

13a‧‧‧movable department

13b‧‧‧X direction moving motor

13c‧‧‧Y direction moving motor

14‧‧‧Parts transporting dishes

14a‧‧‧Intermittent rotation motor

15‧‧‧Insert drive source

16‧‧‧Camera

17‧‧‧Control Department

18‧‧‧Memory Department

CT, CT-1‧‧‧ carrying belt

CTa‧‧‧ Storage recess

CTb‧‧‧ into the hole

D1‧‧‧ length

D2‧‧‧Width

Dx‧‧‧X direction size

Dy‧‧‧Y direction size

EC‧‧‧Electronic parts

IA‧‧‧ shooting range

IM1‧‧‧ image

IM2‧‧‧ image

IP‧‧‧ insertion position

Pa‧‧‧ spacing

Pb‧‧‧ spacing

Pb-1‧‧‧ spacing

PP‧‧‧ shooting location

Sip‧‧‧Stop state

Sip1‧‧‧1st stop state

Sip2‧‧‧2nd stop state

Spp1‧‧‧1st stop state

Spp2‧‧‧2nd stop state

ST11～ST17‧‧‧Steps

ST21～ST24‧‧‧ steps

TG‧‧‧ target location

W‧‧‧Y direction size

Fig. 1(A) is a view showing an example of a carrier tape, and Fig. 1(B) is a view showing an example of an electronic component inserted into a subject. Figure 2 is a partial view of the electronic component insertion device of the present invention. Fig. 3 is a view showing the operation control system of the electronic component insertion device shown in Fig. 2. 4(A) and 4(B) are explanatory views of the feeding operation of the carrier tape in the case where three electronic components are collectively inserted into the three housing recesses. Fig. 5(A) is a view showing a first stop state of the carrier tape at the insertion position shown in Fig. 2, and Fig. 5(B) is a view showing the second stop state. Fig. 6 is a view showing an operational flow of the calculation of the common correction amount. Fig. 7(A) is a view showing a first stop state of the carrier tape at the shooting position shown in Fig. 2, and Fig. 7(B) is a view showing the second stop state. 8(A) is a view showing an example of an image obtained in the first stop state shown in FIG. 7(A), and FIG. 8(B) is obtained in the second stop state shown in FIG. 7(B). A diagram of an example of an image. Fig. 9 is a view showing an operational flow of position correction of the housing recess. FIG. 10 is an explanatory diagram of the insertion position of the carrier tape and the stop state of the imaging position in the case where two electronic components are simultaneously inserted into the two housing recesses. Fig. 11 is an explanatory view showing a state in which the insertion position of the carrier tape and the photographing position are stopped in the case where four electronic components are inserted into the four housing recesses. FIG. 12 is an explanatory view showing a state in which the insertion position of the carrier tape and the stop position of the imaging position are performed when five electronic components are inserted into the five housing recesses. Fig. 13 is an explanatory view showing a state in which the insertion position of the carrier tape and the stop position of the imaging position are performed when six electronic components are simultaneously inserted into the six housing recesses. Fig. 14 is a view showing a carrier tape having a different distance between the carrier tape and the feed hole shown in Fig. 1(A).

Claims (20)

An electronic component insertion device for intermittently moving a tape-shaped carrier tape having a housing recess for electronic components at equal intervals in the longitudinal direction, and for inserting n (n is an integer of 2 or more) electronic components at the insertion position The n housing recesses of the carrier tape include: (A1) an imaging unit that captures the carrier tape by including an imaging range of the n housing recesses at an imaging position that is closer to the insertion position; A2) a position detecting means for detecting a two-dimensional position of each of the n housing recesses included in the image based on an image obtained by the imaging means; (A3) an offset calculating means based on The two-dimensional position detected by the position detecting means for calculating an offset amount of a two-dimensional position of each of the n housing recesses; (A4) a correction amount calculating means that calculates based on the offset amount calculating means The offset amount is used to calculate a common correction amount corresponding to the n storage recesses; and (A5) a position correction mechanism for inserting the n electronic components into the image at the insertion position Before the n storage recesses are included, the common correction amount calculated by the correction amount calculation means is used to displace at least the insertion position corresponding to the carrier tape, and the n storage recesses 2 Dimensional position changes. The electronic component insertion device of claim 1, wherein the carrier tape has a feed hole at an equal interval from the storage recess in a longitudinal direction, and the position correcting mechanism has a two-dimensional moving mechanism for providing an outer peripheral surface The intermittent movement sprocket that is engaged with the projection of the feed hole moves in the longitudinal direction and the width direction of the carrier tape. The electronic component insertion device according to claim 2, wherein the imaging mechanism is configured to image the carrier tape at an imaging range including the n housing recesses and at least one feeding hole at the imaging position, and the position detecting mechanism is configured In order to detect a two-dimensional position of each of the n storage recesses included in the image and a two-dimensional position of the at least one feed hole included in the image, the offset calculation mechanism is configured to The two-dimensional position of the at least one feeding hole detected by the position detecting means is used as a reference, and the offset amount of the two-dimensional position of each of the n housing recesses is calculated. The electronic component insertion device according to claim 3, wherein the offset calculation mechanism is configured to calculate one or more of the two or more two-dimensional positions when the image includes two or more of the feed holes. The offset amount of the two-dimensional position of each of the n storage recesses. The electronic component insertion device according to claim 3, wherein the offset calculation mechanism is configured to operate only when n or more +1 or more storage recesses are provided in the image than the n storage recesses The offset amount of the two-dimensional position of each of the n storage recesses of the +1 or more. The electronic component insertion device according to claim 4, wherein the offset calculation mechanism is configured to operate only when n or more +1 or more storage recesses are provided in the image than the n storage recesses The offset amount of the two-dimensional position of each of the n storage recesses of the +1 or more. The electronic component insertion device according to any one of claims 1 to 6, wherein the n series are selected within a range of 2 to 6. The electronic component insertion device according to any one of claims 1 to 6, wherein the housing recess has a substantially rectangular parallelepiped shape. The electronic component insertion device according to any one of claims 1 to 6, wherein the electronic component is an electronic component having a maximum reference size of 0.6 mm or less. An electronic component storage tape manufacturing apparatus comprising: the electronic component insertion device according to any one of claims 1 to 9; and a cover tape attachment mechanism for closing a cover tape of the storage recessed portion after the electronic component is inserted Attached to the above carrier tape. An electronic component insertion method for intermittently moving a tape-shaped carrier tape having a housing recess for electronic components at equal intervals in a longitudinal direction, and inserting n (n is an integer of 2 or more) electronic components at an insertion position The n storage recesses of the carrier tape have the following steps: (B1) capturing the carrier tape with an imaging range including the n storage recesses by an imaging mechanism at an imaging position closer to the insertion position; (B2) detecting, by the position detecting means, a two-dimensional position of each of the n housing recesses included in the image by the position detecting means; (B3) detecting based on the position detecting means by the position detecting means The two-dimensional position is calculated by an offset calculation means for calculating an offset amount of a two-dimensional position of each of the n storage recesses; (B4) based on the offset calculated by the offset calculation means The correction amount calculation means calculates a common correction amount corresponding to the n storage recesses; and (B5) the insertion position, the n electronic components are collectively inserted into the n storages included in the image Before the recess, based on the common correction amount calculated by the correction amount calculating means, the position correcting means shifts a portion corresponding to at least the insertion position of the carrier tape to obtain a two-dimensional position of the n housing recesses Variety. The method of inserting an electronic component according to claim 11, wherein the carrier tape has a feed hole at an equal interval from the storage recess in a longitudinal direction, and the position correcting mechanism has a two-dimensional moving mechanism for providing an outer peripheral surface The intermittent movement sprocket that is engaged with the projection of the feed hole moves in the longitudinal direction and the width direction of the carrier tape. The electronic component insertion method according to claim 12, wherein the imaging mechanism is configured to image the carrier tape at an imaging range including the n housing recesses and at least one feeding hole at the imaging position, and the position detecting mechanism is configured In order to detect a two-dimensional position of each of the n storage recesses included in the image and a two-dimensional position of the at least one feed hole included in the image, the offset calculation mechanism is configured to The two-dimensional position of the at least one feeding hole detected by the position detecting means is used as a reference, and the offset amount of the two-dimensional position of each of the n housing recesses is calculated. The method of inserting an electronic component according to claim 13, wherein the offset calculating means is configured to operate on the two or more two-dimensional positions of the two or more of the feeding holes when the image includes two or more of the feeding holes. The offset amount of the two-dimensional position of each of the n storage recesses. The electronic component insertion method according to claim 13, wherein the offset calculation mechanism is configured to operate only when n or more +1 or more storage recesses are provided in the image than the n storage recesses The offset amount of the two-dimensional position of each of the n storage recesses of the +1 or more. The method of inserting an electronic component according to claim 14, wherein the offset calculation unit is configured to operate only when n or more storage recesses of the n or more storage recesses are included in the image. The offset amount of the two-dimensional position of each of the n storage recesses of the +1 or more. The electronic component insertion method according to any one of claims 11 to 16, wherein the n lines are selected within a range of 2 to 6. The electronic component insertion method according to any one of claims 11 to 16, wherein the housing recess has a substantially rectangular parallelepiped shape. The electronic component insertion method according to any one of claims 11 to 16, wherein the electronic component is an electronic component having a maximum reference size of 0.6 mm or less. A method of manufacturing an electronic component storage tape, comprising: the electronic component insertion method according to any one of claims 11 to 19; and covering the storage recessed portion after the electronic component is inserted by the cover tape attachment mechanism The belt is attached to the above-mentioned carrier tape.